LCMXO2-7000HC-6FG484I

The LCMXO2-7000HC-6FG484I is a MachXO2 family field programmable gate array (FPGA) optimized for flexible logic integration and system control. It combines a flexible logic architecture with embedded memory, on-chip non-volatile flash and a broad, programmable I/O feature set.

With 6,864 logic elements, 334 I/Os and approximately 0.246 Mbits of on-chip RAM, this industrial-grade device is targeted at designs that require compact, low-power programmable logic and extensive I/O integration within a 484-ball BGA package.

Key Features

• Core Logic — 6,864 logic elements delivering flexible LUT-based logic capacity for glue logic, control paths and small to mid-density FPGA functions.
• Embedded Memory — Total on-chip RAM of 245,760 bits (approximately 0.246 Mbits), plus support for distributed RAM and dedicated FIFO control logic.
• On-Chip User Flash — Up to 256 kbits of non-volatile user flash memory with 100,000 write cycles; accessible and programmable via JTAG, SPI and I²C interfaces.
• I/O Flexibility — 334 I/Os with programmable sysIO buffers supporting a wide range of interfaces including multiple CMOS/TTL and differential standards, programmable pull modes and on-chip differential termination.
• High-Speed I/O and Memory Interfaces — Pre-engineered source-synchronous I/O, DDR registers in I/O cells, dedicated gearing logic and support for DDR memory interfaces and DQS.
• Low Power Options — Advanced low-power process with standby power as low as 22 μW and multiple power-saving modes including standby operation.
• Clocking and PLLs — Flexible on-chip clocking with up to eight primary clocks and up to two analog PLLs supporting wide input frequency ranges for fractional-n synthesis.
• Package and Industrial Temperature — 484-ball BGA (23 × 23 mm) package; single-supply voltage range of 2.375 V to 3.465 V and operating temperature from −40 °C to 100 °C.
• System Reliability & Management — Instant-on non-volatile reconfiguration, IEEE 1149.1 boundary-scan and support for IEEE 1532 in-system programming; on-chip oscillator and unique TraceID for tracking.

Typical Applications

• Interface Bridging and Glue Logic — High I/O count and programmable sysIO buffers enable protocol bridging and board-level glue functions between disparate subsystems.
• User Interface and Display Control — Pre-engineered source-synchronous I/O and gearing for display interfaces simplify implementation of display timing and DDR-latched I/O.
• Embedded System Management — On-chip flash, timers, SPI and I²C support system configuration, firmware storage and supervisory tasks without external flash.
• Memory and High-Speed I/O Front-Ends — DDR/DDR2/LPDDR memory interface support and dedicated I/O registers assist in implementing memory controllers and source-synchronous interfaces.

Unique Advantages

• Highly Integrated Solution: Combines logic, embedded RAM and non-volatile user flash on a single chip to reduce BOM and board complexity.
• Extensive I/O Capability: 334 programmable I/Os with differential support and on-chip terminations simplify multi-standard interface designs.
• Low-Power Operation: Advanced 65 nm low-power process and standby modes reduce system power consumption, with standby as low as 22 μW.
• Instant-On Non-Volatile Reconfiguration: Single-chip, instant-on capability with background programming and optional dual-boot supports field updates and secure boot strategies.
• Rugged Operating Range: Industrial-grade temperature performance from −40 °C to 100 °C and a wide supply range (2.375 V to 3.465 V) for deployment in demanding environments.
• Compact High-Density Packaging: 484-ball BGA (23 × 23 mm) package provides high I/O density in a compact footprint for space-constrained designs.

Why Choose LCMXO2-7000HC-6FG484I?

The LCMXO2-7000HC-6FG484I delivers a balanced combination of programmable logic capacity, on-chip memory and extensive, flexible I/O in an industrial-temperature 484-BBGA package. It is well suited for designs that need instant-on non-volatile programmable logic, multi-standard interfacing and compact integration while maintaining low standby power.

Engineers designing mid-density logic systems, interface controllers, or embedded supervisory functions will find this device offers scalability, integrated system functions and configuration options (JTAG, SPI, I²C) that simplify development and reduce external component count.

Request a quote or submit an RFQ today to include the LCMXO2-7000HC-6FG484I in your next design.