LCMXO2-7000HC-6BG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA |
|---|---|
| Quantity | 1,047 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HC-6BG256I – MachXO2 Field Programmable Gate Array (FPGA) IC
The LCMXO2-7000HC-6BG256I is a MachXO2 FPGA device designed for industrial applications that require flexible logic, non-volatile configuration and low-power operation. Built on the MachXO2 family architecture, it delivers 6,864 logic elements, on-chip user flash and embedded RAM alongside a broad, programmable I/O set for control, interface bridging and system glue logic.
This device targets markets that need instant-on, reconfigurable logic with extended operating conditions and integrated configuration memory—allowing compact, reliable implementations in industrial control, communication endpoints and embedded systems.
Key Features
- Core Logic — 6,864 logic elements suitable for medium-density logic integration and control functions.
- Embedded Memory — 245,760 bits of on-chip RAM (approximately 240 kbits) for distributed and block memory needs, plus dedicated FIFO control logic.
- On-Chip User Flash — Integrated user flash memory (up to 256 kbits as defined in the MachXO2 family) for non-volatile configuration and field updates; supports background programming and multiple interfaces for access.
- I/O Density and Flexibility — 206 I/Os with programmable sysIO buffer support for a wide variety of standards and on-chip differential termination and pull modes for interface flexibility.
- Power and Low-Power Modes — Advanced low-power process with standby power as low as 22 μW and programmable power-saving options.
- Clocking and PLLs — Multiple primary clocks and up to two analog PLLs with fractional‑N synthesis to support varied timing and high-speed I/O requirements.
- Single-Supply Operation — Operates from a single supply in the range of 2.375 V to 3.465 V for simplified power design.
- Robust Packaging and Temperature Range — 256-ball package (256-LFBGA / supplier 256-CABGA, 14 mm × 14 mm) and industrial operating temperature of −40 °C to 100 °C.
- System-Level Features — Instant-on configuration, JTAG/SPI/I²C programming support, IEEE 1149.1 boundary scan and options for in-field reconfiguration.
- Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Implement deterministic control logic, sensor interfacing and protocol conversion with extended operating temperature support.
- Embedded System Glue Logic — Replace discrete glue components by consolidating address decoding, bus arbitration and custom interface logic into a single device.
- Communications and Networking — Provide flexible I/O and clocking resources for protocol bridging, timing distribution and interface adaptation.
- Human-Machine Interfaces — Drive displays, manage input scanning and handle peripheral timing with dedicated gearing and DDR register support in I/O cells.
Unique Advantages
- Non-Volatile, Reconfigurable Memory: On-chip user flash enables secure, single-chip instant-on solutions and in-field updates without external configuration memory.
- Compact, High-I/O Package: 206 I/Os in a 256-ball package provide high signal density for space-constrained boards while keeping routing manageable.
- Low Standby Power: Ultra-low standby power (as low as 22 μW) reduces system idle power and supports energy-conscious designs.
- Wide Supply Range: Single-supply operation from 2.375 V to 3.465 V simplifies power rail design across varied system voltages.
- Industrial Temperature Rating: Specified for −40 °C to 100 °C to meet elevated temperature deployment needs.
- Integrated System Functions: Built-in SPI, I²C, timers/counters, PLLs and boundary-scan support reduce external component count and speed development.
Why Choose LCMXO2-7000HC-6BG256I?
The LCMXO2-7000HC-6BG256I offers a balance of density, non-volatile configuration and flexible I/O suitable for industrial-grade embedded designs. Its combination of 6,864 logic elements, substantial on-chip RAM and user flash memory lets designers consolidate control, interface and storage functions into a single, reconfigurable device.
This device is well suited to teams building reliable, compact systems that require instant-on behavior, field reprogrammability and low standby power—supported by on-chip clocking and system peripherals that reduce BOM and accelerate time to market.
Request a quote or submit an inquiry to start the procurement process and evaluate the LCMXO2-7000HC-6BG256I for your next design.

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