LCMXO2-7000HC-6BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA

Quantity 1,047 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HC-6BG256I – MachXO2 Field Programmable Gate Array (FPGA) IC

The LCMXO2-7000HC-6BG256I is a MachXO2 FPGA device designed for industrial applications that require flexible logic, non-volatile configuration and low-power operation. Built on the MachXO2 family architecture, it delivers 6,864 logic elements, on-chip user flash and embedded RAM alongside a broad, programmable I/O set for control, interface bridging and system glue logic.

This device targets markets that need instant-on, reconfigurable logic with extended operating conditions and integrated configuration memory—allowing compact, reliable implementations in industrial control, communication endpoints and embedded systems.

Key Features

  • Core Logic — 6,864 logic elements suitable for medium-density logic integration and control functions.
  • Embedded Memory — 245,760 bits of on-chip RAM (approximately 240 kbits) for distributed and block memory needs, plus dedicated FIFO control logic.
  • On-Chip User Flash — Integrated user flash memory (up to 256 kbits as defined in the MachXO2 family) for non-volatile configuration and field updates; supports background programming and multiple interfaces for access.
  • I/O Density and Flexibility — 206 I/Os with programmable sysIO buffer support for a wide variety of standards and on-chip differential termination and pull modes for interface flexibility.
  • Power and Low-Power Modes — Advanced low-power process with standby power as low as 22 μW and programmable power-saving options.
  • Clocking and PLLs — Multiple primary clocks and up to two analog PLLs with fractional‑N synthesis to support varied timing and high-speed I/O requirements.
  • Single-Supply Operation — Operates from a single supply in the range of 2.375 V to 3.465 V for simplified power design.
  • Robust Packaging and Temperature Range — 256-ball package (256-LFBGA / supplier 256-CABGA, 14 mm × 14 mm) and industrial operating temperature of −40 °C to 100 °C.
  • System-Level Features — Instant-on configuration, JTAG/SPI/I²C programming support, IEEE 1149.1 boundary scan and options for in-field reconfiguration.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Implement deterministic control logic, sensor interfacing and protocol conversion with extended operating temperature support.
  • Embedded System Glue Logic — Replace discrete glue components by consolidating address decoding, bus arbitration and custom interface logic into a single device.
  • Communications and Networking — Provide flexible I/O and clocking resources for protocol bridging, timing distribution and interface adaptation.
  • Human-Machine Interfaces — Drive displays, manage input scanning and handle peripheral timing with dedicated gearing and DDR register support in I/O cells.

Unique Advantages

  • Non-Volatile, Reconfigurable Memory: On-chip user flash enables secure, single-chip instant-on solutions and in-field updates without external configuration memory.
  • Compact, High-I/O Package: 206 I/Os in a 256-ball package provide high signal density for space-constrained boards while keeping routing manageable.
  • Low Standby Power: Ultra-low standby power (as low as 22 μW) reduces system idle power and supports energy-conscious designs.
  • Wide Supply Range: Single-supply operation from 2.375 V to 3.465 V simplifies power rail design across varied system voltages.
  • Industrial Temperature Rating: Specified for −40 °C to 100 °C to meet elevated temperature deployment needs.
  • Integrated System Functions: Built-in SPI, I²C, timers/counters, PLLs and boundary-scan support reduce external component count and speed development.

Why Choose LCMXO2-7000HC-6BG256I?

The LCMXO2-7000HC-6BG256I offers a balance of density, non-volatile configuration and flexible I/O suitable for industrial-grade embedded designs. Its combination of 6,864 logic elements, substantial on-chip RAM and user flash memory lets designers consolidate control, interface and storage functions into a single, reconfigurable device.

This device is well suited to teams building reliable, compact systems that require instant-on behavior, field reprogrammability and low standby power—supported by on-chip clocking and system peripherals that reduce BOM and accelerate time to market.

Request a quote or submit an inquiry to start the procurement process and evaluate the LCMXO2-7000HC-6BG256I for your next design.

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