LCMXO2-7000HC-5TG144I

IC FPGA 114 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP

Quantity 1,411 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O114Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HC-5TG144I – MachXO2 FPGA, 6,864 Logic Elements, 114 I/Os, 144‑LQFP

The LCMXO2-7000HC-5TG144I is a MachXO2 family field programmable gate array (FPGA) offered in a 144‑pin LQFP package for surface-mount assembly. It provides 6,864 logic elements, approximately 245,760 bits of embedded RAM, and 114 user I/Os, delivering a flexible logic fabric and integrated system functions for industrial applications.

Designed for low-power, instant-on configurations, this device integrates on-chip user flash, programmable I/O buffers, hardened SPI and I2C functions, and flexible clocking to support a variety of system-level control, interface and glue-logic tasks within its specified industrial temperature and voltage ranges.

Key Features

  • Core Logic  6,864 logic elements (cells) for implementing combinational and sequential logic, routed within the MachXO2 flexible architecture.
  • Embedded and Distributed Memory  Approximately 245,760 bits of total RAM available as embedded block RAM and distributed RAM to support buffers, FIFOs and small data stores.
  • On‑Chip User Flash (UFM)  Series-level support for on-chip user flash memory (up to 256 kbits) for non-volatile configuration and data storage; supports background programming and multiple interface access modes.
  • Low Power Operation  Built on an advanced 65 nm low-power process with standby modes and published low standby-power behavior for energy-efficient system designs.
  • High‑Performance, Programmable I/O  114 I/Os with programmable sysIO buffer support across multiple standards (including LVCMOS, LVTTL, LVDS and others as provided by the family) and features such as on-chip differential termination and hot-socketing support.
  • Source‑Synchronous and DDR I/O Support  Pre-engineered source-synchronous I/O including DDR registers in I/O cells, gearing for display I/Os, and dedicated DDR-related logic to simplify high-speed interface implementation.
  • Flexible Clocking  Multiple primary clocks and up to two analog PLLs per device (fractional‑N synthesis) to support a wide input frequency range and diverse timing domains.
  • System Integration and Reliability  Hardened peripheral functions (SPI, I2C, timer/counter), on-chip oscillator, IEEE 1149.1 boundary scan and support for in-system programming and field reconfiguration (TransFR).
  • Package and Environmental  144‑LQFP package (20 mm × 20 mm supplier TQFP footprint) with surface-mount mounting type, industrial grade operation from –40 °C to 100 °C, and RoHS compliance.
  • Power Supply Range  Supports single power-supply operation across a voltage range of 2.375 V to 3.465 V for flexible system power architectures.

Typical Applications

  • Interface Bridging and Protocol Conversion  Use the programmable sysIO buffers and hardened SPI/I2C blocks to implement protocol bridging, bus conversion and peripheral interfacing.
  • Display and Memory Interface Support  Pre‑engineered source-synchronous I/O and DDR gearing assist in implementing display controllers and memory interface glue logic.
  • Embedded Control and Timing  On-chip timers, PLLs and oscillator support system control functions, clock generation and deterministic timing within industrial systems.
  • Field‑Updatable Logic  TransFR reconfiguration enables in-field updates to logic while the system operates, suitable for systems requiring remote or iterative firmware/logic changes.

Unique Advantages

  • Highly Integrative Logic + Memory:  6,864 logic elements combined with approximately 245,760 bits of embedded RAM reduces external component count for control and buffering tasks.
  • Non‑Volatile Instant‑On Capability:  On-chip user flash enables single-chip instantiation and instant-on configuration without external configuration PROMs.
  • Versatile I/O Flexibility:  Programmable sysIO buffers and extensive I/O standards support simplify multi-voltage and mixed-signal interface designs.
  • Industrial Temperature Range:  Rated for operation from –40 °C to 100 °C to meet many industrial environmental requirements.
  • Field Reconfiguration:  In-field TransFR updates allow logic revisions and feature additions without full system downtime.
  • Single‑Supply Operation:  Wide supply range (2.375 V–3.465 V) permits integration into diverse power architectures with minimal regulator complexity.

Why Choose LCMXO2-7000HC-5TG144I?

The LCMXO2-7000HC-5TG144I positions itself as a flexible, low-power FPGA solution that combines significant logic capacity with embedded RAM, on-chip non-volatile storage, and a broad set of system functions. Its programmable I/O, DDR-ready interfaces and integrated peripherals make it well suited to designs that require interface consolidation, in-field updates and robust operation across industrial temperature ranges.

This device is appropriate for engineers seeking a single-chip, reconfigurable component to simplify BOM count, enable field programmability, and support scalable designs that may evolve over the product lifecycle.

Request a quote or submit a procurement inquiry to receive pricing and availability for LCMXO2-7000HC-5TG144I for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up