LCMXO2-7000HC-5TG144I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP |
|---|---|
| Quantity | 1,411 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 114 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HC-5TG144I – MachXO2 FPGA, 6,864 Logic Elements, 114 I/Os, 144‑LQFP
The LCMXO2-7000HC-5TG144I is a MachXO2 family field programmable gate array (FPGA) offered in a 144‑pin LQFP package for surface-mount assembly. It provides 6,864 logic elements, approximately 245,760 bits of embedded RAM, and 114 user I/Os, delivering a flexible logic fabric and integrated system functions for industrial applications.
Designed for low-power, instant-on configurations, this device integrates on-chip user flash, programmable I/O buffers, hardened SPI and I2C functions, and flexible clocking to support a variety of system-level control, interface and glue-logic tasks within its specified industrial temperature and voltage ranges.
Key Features
- Core Logic 6,864 logic elements (cells) for implementing combinational and sequential logic, routed within the MachXO2 flexible architecture.
- Embedded and Distributed Memory Approximately 245,760 bits of total RAM available as embedded block RAM and distributed RAM to support buffers, FIFOs and small data stores.
- On‑Chip User Flash (UFM) Series-level support for on-chip user flash memory (up to 256 kbits) for non-volatile configuration and data storage; supports background programming and multiple interface access modes.
- Low Power Operation Built on an advanced 65 nm low-power process with standby modes and published low standby-power behavior for energy-efficient system designs.
- High‑Performance, Programmable I/O 114 I/Os with programmable sysIO buffer support across multiple standards (including LVCMOS, LVTTL, LVDS and others as provided by the family) and features such as on-chip differential termination and hot-socketing support.
- Source‑Synchronous and DDR I/O Support Pre-engineered source-synchronous I/O including DDR registers in I/O cells, gearing for display I/Os, and dedicated DDR-related logic to simplify high-speed interface implementation.
- Flexible Clocking Multiple primary clocks and up to two analog PLLs per device (fractional‑N synthesis) to support a wide input frequency range and diverse timing domains.
- System Integration and Reliability Hardened peripheral functions (SPI, I2C, timer/counter), on-chip oscillator, IEEE 1149.1 boundary scan and support for in-system programming and field reconfiguration (TransFR).
- Package and Environmental 144‑LQFP package (20 mm × 20 mm supplier TQFP footprint) with surface-mount mounting type, industrial grade operation from –40 °C to 100 °C, and RoHS compliance.
- Power Supply Range Supports single power-supply operation across a voltage range of 2.375 V to 3.465 V for flexible system power architectures.
Typical Applications
- Interface Bridging and Protocol Conversion Use the programmable sysIO buffers and hardened SPI/I2C blocks to implement protocol bridging, bus conversion and peripheral interfacing.
- Display and Memory Interface Support Pre‑engineered source-synchronous I/O and DDR gearing assist in implementing display controllers and memory interface glue logic.
- Embedded Control and Timing On-chip timers, PLLs and oscillator support system control functions, clock generation and deterministic timing within industrial systems.
- Field‑Updatable Logic TransFR reconfiguration enables in-field updates to logic while the system operates, suitable for systems requiring remote or iterative firmware/logic changes.
Unique Advantages
- Highly Integrative Logic + Memory: 6,864 logic elements combined with approximately 245,760 bits of embedded RAM reduces external component count for control and buffering tasks.
- Non‑Volatile Instant‑On Capability: On-chip user flash enables single-chip instantiation and instant-on configuration without external configuration PROMs.
- Versatile I/O Flexibility: Programmable sysIO buffers and extensive I/O standards support simplify multi-voltage and mixed-signal interface designs.
- Industrial Temperature Range: Rated for operation from –40 °C to 100 °C to meet many industrial environmental requirements.
- Field Reconfiguration: In-field TransFR updates allow logic revisions and feature additions without full system downtime.
- Single‑Supply Operation: Wide supply range (2.375 V–3.465 V) permits integration into diverse power architectures with minimal regulator complexity.
Why Choose LCMXO2-7000HC-5TG144I?
The LCMXO2-7000HC-5TG144I positions itself as a flexible, low-power FPGA solution that combines significant logic capacity with embedded RAM, on-chip non-volatile storage, and a broad set of system functions. Its programmable I/O, DDR-ready interfaces and integrated peripherals make it well suited to designs that require interface consolidation, in-field updates and robust operation across industrial temperature ranges.
This device is appropriate for engineers seeking a single-chip, reconfigurable component to simplify BOM count, enable field programmability, and support scalable designs that may evolve over the product lifecycle.
Request a quote or submit a procurement inquiry to receive pricing and availability for LCMXO2-7000HC-5TG144I for your next design.