LCMXO2-7000HC-6BG332C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 278 245760 6864 332-FBGA |
|---|---|
| Quantity | 365 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 278 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HC-6BG332C – MachXO2 FPGA, 332-FBGA
The LCMXO2-7000HC-6BG332C is a MachXO2 field programmable gate array (FPGA) IC providing a mid-to-high density programmable logic solution in a 332-ball caBGA package. It combines 6,864 logic elements, 278 general-purpose I/O pins and 245,760 bits of on-chip RAM to support flexible glue logic, I/O expansion and embedded control functions in commercial-grade applications.
Designed for low-power, instantly reconfigurable operation with a broad voltage supply range and rich I/O capabilities, this device targets designs that require high I/O count, embedded memory and non-volatile configuration in a compact surface-mount package.
Key Features
- Logic Capacity — 6,864 logic elements provide programmable LUT4-based logic resources for glue logic, state machines and control functions.
- Embedded Memory — 245,760 total RAM bits of on-chip memory for FIFOs, buffers and small data storage requirements.
- I/O Density and Flexibility — 278 I/Os available in the 332-ball caBGA package with programmable sysIO buffer options supporting a wide range of interfaces.
- Wide Voltage Supply — Single supply operation over 2.375 V to 3.465 V to accommodate different system power rails.
- Package and Mounting — 332-FBGA / 332-CABGA (17 × 17 mm) surface-mount package for compact board implementation.
- Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C for general-purpose embedded applications.
- Low Power and Power Modes — Family-level features include ultra low standby power and programmable power-saving options.
- On-Chip Non-Volatile Memory — Family support for on-chip user flash memory and background programming for non-volatile configuration storage.
- Flexible I/O Standards — Programmable support for LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL, SSTL, HSTL and Schmitt trigger inputs as provided by the family architecture.
- Clocking and Timing — Multiple primary clocks and up to two analog PLLs per device for fractional-n frequency synthesis and flexible timing architectures.
Typical Applications
- Interface Bridging and Level Translation — Use the programmable sysIO buffers and high I/O count to implement custom protocol bridging and voltage-level interfacing.
- Control and Glue Logic — 6,864 logic elements and embedded RAM support complex state machines, sequencers and peripheral control functions.
- Embedded System Integration — On-chip non-volatile memory and background programming enable instant-on configurations and field updates for embedded control systems.
- High-Density I/O Applications — The 278 I/O pins in a compact 17 × 17 mm package suit compact boards requiring many external connections.
Unique Advantages
- High I/O Count in a Compact Package: 278 I/Os in a 332-ball caBGA (17 × 17 mm) enable dense connectivity without a large PCB footprint.
- Substantial On-Chip Memory: 245,760 bits of embedded RAM simplify FIFO and buffering needs, reducing external memory dependence.
- Broad I/O Standard Support: Programmable I/O buffers support multiple signaling standards for flexible interface design.
- Non-Volatile, Reconfigurable: Family-level on-chip user flash and background programming allow secure, single-chip configuration and in-field updates.
- Flexible Power and Clocking: Wide supply range and multiple PLLs provide adaptability to diverse system power and timing requirements.
- Commercial-Grade Reliability: Specified operating temperature and surface-mount packaging align with standard commercial embedded system requirements.
Why Choose LCMXO2-7000HC-6BG332C?
This MachXO2-series device delivers a balanced mix of logic capacity, I/O density and embedded memory in a compact caBGA package, making it well suited for designs that demand flexible interfacing, on-chip buffering and non-volatile configuration. Its commercial-grade operating range, broad voltage support and family-level features for low power and in-field reconfiguration provide a reliable platform for system-level integration and iterative development.
Design teams looking to consolidate glue logic, implement high-density I/O designs, or add programmable control functionality without a large BOM will find the LCMXO2-7000HC-6BG332C a practical option backed by the MachXO2 family’s configuration and I/O capabilities.
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