LCMXO2-7000HC-6BG332C

IC FPGA 278 I/O 332CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 245760 6864 332-FBGA

Quantity 365 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package332-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case332-FBGANumber of I/O278Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HC-6BG332C – MachXO2 FPGA, 332-FBGA

The LCMXO2-7000HC-6BG332C is a MachXO2 field programmable gate array (FPGA) IC providing a mid-to-high density programmable logic solution in a 332-ball caBGA package. It combines 6,864 logic elements, 278 general-purpose I/O pins and 245,760 bits of on-chip RAM to support flexible glue logic, I/O expansion and embedded control functions in commercial-grade applications.

Designed for low-power, instantly reconfigurable operation with a broad voltage supply range and rich I/O capabilities, this device targets designs that require high I/O count, embedded memory and non-volatile configuration in a compact surface-mount package.

Key Features

  • Logic Capacity — 6,864 logic elements provide programmable LUT4-based logic resources for glue logic, state machines and control functions.
  • Embedded Memory — 245,760 total RAM bits of on-chip memory for FIFOs, buffers and small data storage requirements.
  • I/O Density and Flexibility — 278 I/Os available in the 332-ball caBGA package with programmable sysIO buffer options supporting a wide range of interfaces.
  • Wide Voltage Supply — Single supply operation over 2.375 V to 3.465 V to accommodate different system power rails.
  • Package and Mounting — 332-FBGA / 332-CABGA (17 × 17 mm) surface-mount package for compact board implementation.
  • Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C for general-purpose embedded applications.
  • Low Power and Power Modes — Family-level features include ultra low standby power and programmable power-saving options.
  • On-Chip Non-Volatile Memory — Family support for on-chip user flash memory and background programming for non-volatile configuration storage.
  • Flexible I/O Standards — Programmable support for LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL, SSTL, HSTL and Schmitt trigger inputs as provided by the family architecture.
  • Clocking and Timing — Multiple primary clocks and up to two analog PLLs per device for fractional-n frequency synthesis and flexible timing architectures.

Typical Applications

  • Interface Bridging and Level Translation — Use the programmable sysIO buffers and high I/O count to implement custom protocol bridging and voltage-level interfacing.
  • Control and Glue Logic — 6,864 logic elements and embedded RAM support complex state machines, sequencers and peripheral control functions.
  • Embedded System Integration — On-chip non-volatile memory and background programming enable instant-on configurations and field updates for embedded control systems.
  • High-Density I/O Applications — The 278 I/O pins in a compact 17 × 17 mm package suit compact boards requiring many external connections.

Unique Advantages

  • High I/O Count in a Compact Package: 278 I/Os in a 332-ball caBGA (17 × 17 mm) enable dense connectivity without a large PCB footprint.
  • Substantial On-Chip Memory: 245,760 bits of embedded RAM simplify FIFO and buffering needs, reducing external memory dependence.
  • Broad I/O Standard Support: Programmable I/O buffers support multiple signaling standards for flexible interface design.
  • Non-Volatile, Reconfigurable: Family-level on-chip user flash and background programming allow secure, single-chip configuration and in-field updates.
  • Flexible Power and Clocking: Wide supply range and multiple PLLs provide adaptability to diverse system power and timing requirements.
  • Commercial-Grade Reliability: Specified operating temperature and surface-mount packaging align with standard commercial embedded system requirements.

Why Choose LCMXO2-7000HC-6BG332C?

This MachXO2-series device delivers a balanced mix of logic capacity, I/O density and embedded memory in a compact caBGA package, making it well suited for designs that demand flexible interfacing, on-chip buffering and non-volatile configuration. Its commercial-grade operating range, broad voltage support and family-level features for low power and in-field reconfiguration provide a reliable platform for system-level integration and iterative development.

Design teams looking to consolidate glue logic, implement high-density I/O designs, or add programmable control functionality without a large BOM will find the LCMXO2-7000HC-6BG332C a practical option backed by the MachXO2 family’s configuration and I/O capabilities.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2-7000HC-6BG332C.

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