LCMXO2-7000HC-6FG484C

IC FPGA 334 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 334 245760 6864 484-BBGA

Quantity 582 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O334Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HC-6FG484C – MachXO2 Field Programmable Gate Array (FPGA) IC 334 I/Os, 6864 Logic Elements, 484-BBGA

The LCMXO2-7000HC-6FG484C is a MachXO2 family FPGA from Lattice Semiconductor, packaged in a 484-ball BBGA. It provides a flexible, non-volatile programmable logic solution with 6,864 logic elements and up to 334 I/O pins for mid-density system integration.

Designed for general commercial applications, this device delivers on-chip embedded memory, configurable I/O standards, and low-power architecture for control, glue-logic, display and I/O interfacing tasks where fast, reconfigurable logic is required.

Key Features

  • Logic Capacity 6,864 logic elements for mid-density logic integration and implementation of complex glue logic, state machines and control functions.
  • I/O Density 334 I/Os to support extensive peripheral and bus connectivity across the package.
  • On-chip Memory Approximately 240 kbits of total RAM (245,760 bits) for embedded data buffering and distributed RAM usage.
  • On-Chip Non-Volatile Memory Family supports on-chip user flash memory (up to 256 kbits) enabling single-chip, reconfigurable, non-volatile designs and background programming.
  • Low-Power Architecture MachXO2 family features an advanced low-power process and power-saving modes suitable for designs requiring low standby consumption.
  • Flexible I/O and Interfaces Programmable I/O buffer support for a wide range of standards and dedicated source-synchronous and DDR I/O options (family capability).
  • Clocking and PLLs Multiple primary clocks and up to two analog PLLs per device for flexible clock management and fractional-n synthesis (family capability).
  • Package and Mounting 484-ball BBGA package; supplier device package listed as 484-FBGA (23×23). Surface-mount mounting type for compact PCB layouts.
  • Supply and Temperature Single-supply operation across 2.375 V to 3.465 V and commercial operating range of 0 °C to 85 °C.
  • Compliance RoHS compliant.

Typical Applications

  • System Glue Logic and I/O Expansion Use the device’s 6,864 logic elements and 334 I/Os to consolidate glue logic, peripheral interfacing, and bus bridging tasks on a single chip.
  • Display and Video Interfaces Family I/O gearing and DDR options enable display timing, source-synchronous I/O and related pre-engineered interfaces for video and panel control.
  • Communications and Networking Modules Dense I/O and embedded RAM support packet buffering, protocol adaptation and interface bridging in commercial communications equipment.
  • Embedded Control and Sensor Aggregation On-chip memory and reconfigurable logic are useful for sensor aggregation, control sequencing and local processing in commercial devices.

Unique Advantages

  • Reconfigurable Non-Volatile Solution: On-chip user flash memory and MachXO2 family reconfiguration features enable secure, instant-on, single-chip designs without external configuration memory.
  • High I/O Count: 334 available I/Os reduce the need for external multiplexers and expanders, simplifying board design and lowering BOM.
  • Embedded Memory for Buffering: Approximately 240 kbits of on-chip RAM supports FIFOs and local data buffering to streamline interface and protocol handling.
  • Flexible Power and I/O Standards: Wide supply range and programmable sysIO buffer options enable compatibility with multiple voltage domains and interface requirements.
  • Compact Surface-Mount Package: 484-ball BBGA packaging delivers high pin count in a compact footprint for space-constrained commercial designs.

Why Choose LCMXO2-7000HC-6FG484C?

The LCMXO2-7000HC-6FG484C positions itself as a balanced mid-density FPGA offering a combination of abundant I/O, substantial logic resources and on-chip memory in a single, non-volatile device. Its MachXO2 family capabilities—reconfigurable user flash, flexible I/O options and low-power operation—make it well suited for commercial designs that require reliable, instant-on programmable logic and extensive interfacing.

Choose this device for applications that need scalable logic capacity, high I/O connectivity and embedded memory without adding external configuration components. The device’s commercial temperature rating and RoHS compliance support broad deployment in general-purpose electronic products.

Request a quote or submit an inquiry to check availability and pricing for LCMXO2-7000HC-6FG484C. Our team can assist with volume pricing, lead times and technical fit for your design.

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