LCMXO2-7000HC-6FTG256I

The LCMXO2-7000HC-6FTG256I is a MachXO2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a flexible, non-volatile logic fabric with a large I/O count and on-chip memory, optimized for embedded and industrial applications that require reconfigurable logic and robust I/O integration.

With 6,864 logic elements, approximately 245,760 bits of on-chip RAM, and 206 user I/Os in a 256‑ball ftBGA package, this device delivers a balance of capacity, I/O connectivity and industrial temperature support for in-field configurable designs.

Key Features

• Core Logic: 6,864 logic elements provide significant programmable logic capacity for glue logic, control functions and medium-density custom logic implementations.
• Embedded Memory: Approximately 245,760 bits of on-chip RAM available for FIFOs, buffers and local data storage.
• On-Chip Non-Volatile Storage: Family-level user flash memory (UFM) up to 256 kbits supports non-volatile configuration and user data storage.
• I/O Density and Flexibility: 206 user I/Os in a 256‑LBGA package enable broad connectivity for multi-interface designs and dense board layouts.
• Power and Supply Range: Single-supply operation with a voltage range of 2.375 V to 3.465 V to accommodate different system domains.
• Industrial Temperature Rating: Qualified for operation from −40 °C to 100 °C to meet industrial-environment requirements.
• Packaging and Mounting: Surface-mount 256‑LBGA (supplier package: 256‑FTBGA, 17 × 17 mm) for compact, high-density PCB integration.
• Low-Power Capabilities: Series-level low-power options and standby modes support reduced energy consumption in idle states.
• System-Level Features: Family features include instant-on non-volatile reconfiguration, background programming and hardened system functions for common interfaces and timers.
• RoHS Compliant: Device meets RoHS requirements for lead-free manufacturing processes.

Typical Applications

• Industrial Control: Reconfigurable control logic, I/O aggregation and protocol bridging in industrial automation systems where extended temperature and robust I/O are required.
• Embedded Systems: On-board logic for microcontroller offload, custom peripheral implementation and real-time glue logic using the device’s logic elements and embedded memory.
• Interface Bridging and I/O Expansion: High I/O count supports interfacing between multiple buses, sensors and peripherals on compact PCBs.
• Memory and Display Interfaces: On-chip memory and family-level support for DDR and display gearing enable buffering and timing control for memory or display subsystems.

Unique Advantages

• High Logic Capacity: 6,864 logic elements allow complex custom logic and state machines without external CPLDs or discrete logic.
• Integrated Non‑Volatile Configuration: On-chip user flash memory enables secure, instant-on operation and in-field reconfiguration without external configuration PROMs.
• Extensive I/O Count: 206 user I/Os reduce the need for external multiplexers or I/O expanders, simplifying BOM and PCB routing.
• Industrial Reliability: −40 °C to 100 °C operating range and surface-mount ftBGA packaging support deployment in industrial environments.
• Single-Supply Flexibility: Wide supply range (2.375 V–3.465 V) helps integrate the device into a variety of system power domains.
• Compact, High-Density Package: 256‑LBGA (17 × 17 mm ftBGA) enables a small board footprint while delivering high I/O and logic density.

Why Choose LCMXO2-7000HC-6FTG256I?

The LCMXO2-7000HC-6FTG256I positions itself as a versatile, non-volatile FPGA solution for designers needing substantial logic capacity, abundant I/Os and on-chip memory within a compact industrial-grade package. Its combination of programmable logic, embedded memory and user flash supports designs that require in-field updates, secure configuration and reduced external component count.

This device is well suited to engineering teams building industrial and embedded systems that demand reliable operation across temperature extremes, flexible I/O connectivity and the ability to reconfigure logic and firmware in the field while minimizing board space and BOM complexity.

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