LCMXO2-7000HC-6BG332I

The LCMXO2-7000HC-6BG332I is a MachXO2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a flexible logic architecture with 6,864 logic elements, a large I/O count and on-chip memory, making it suitable for industrial embedded control, interface bridging and system glue logic.

This surface-mount device is offered in a 332-ball package (package case listed as 332‑FBGA; supplier device package listed as 332‑CABGA, 17×17), supports 278 I/Os, and operates across a wide supply range and industrial temperature window for robust deployment.

Key Features

• Logic Capacity — 6,864 logic elements (LUT4-based architecture) for implementing glue logic, finite state machines, and custom control functions.
• On-Chip Memory — Total RAM of 245,760 bits for embedded and distributed memory needs; family-level embedded block RAM and distributed RAM options support complex buffering and state storage.
• I/O Flexibility — 278 I/Os with programmable sysIO buffer support for multiple standards, including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, LVDS, Bus‑LVDS, MLVDS, RSDS, LVPECL, PCI and SSTL/HSTL variants, enabling diverse interface connectivity.
• Power and Supply — Single supply operation across 2.375 V to 3.465 V and ultra-low power architecture with standby modes; family documentation cites very low standby power characteristics.
• Clocking and PLLs — Multiple clocking resources with eight primary clocks and up to two analog PLLs supporting wide input ranges and fractional‑n synthesis for flexible clock management.
• On-Chip Non‑Volatile and Reconfiguration — On-chip user flash memory (family-level up to 256 kbits), instant-on behavior and TransFR reconfiguration for in-field logic updates and single-chip secure solutions.
• System Functions — Hardened peripherals including SPI, I2C, timer/counter and an on-chip oscillator (≈5.5% accuracy), reducing external component count for common control functions.
• Package and Temperature — Surface mount 332-ball BGA in a 17×17 supplier package footprint with industrial operating temperature range of -40 °C to 100 °C.
• Standards and Programming — Supports JTAG, SPI and I2C programming and IEEE 1149.1 boundary scan and IEEE 1532 in-system programming for production and field programmability.

Typical Applications

• Interface Bridging and Display I/O — Use the device’s pre-engineered source-synchronous I/O and display gearing capabilities to implement display drivers, protocol translation and interface buffering.
• Memory Interface and Buffering — Support for generic DDR, DDRX2/4 and dedicated DDR/DDR2/LPDDR memory with DQS support enables memory-interface logic, FIFOs and data buffering.
• Embedded System Control — Hardened SPI, I2C and timer/counter functions plus substantial logic and on-chip memory make this FPGA suitable for system control, sensor aggregation and peripheral management.
• Field Updatable Logic — TransFR reconfiguration and on-chip user flash memory allow in-field updates to logic while the system remains in operation, supporting long-term maintainability.

Unique Advantages

• High Logic Density — 6,864 logic elements provide significant capacity for logic consolidation, reducing external CPLD/MCU requirements.
• Extensive I/O Support — 278 configurable I/Os with wide protocol support enable a single device to handle multiple interfaces and signaling standards.
• Integrated Memory Resources — Nearly 246kbits of on-chip RAM and family-level embedded block RAM options simplify buffer and state memory design without external SRAM.
• Non‑Volatile, Reconfigurable — On-chip user flash and in-field reconfiguration streamline updates and reduce reliance on external configuration components.
• Industrial‑Grade Operation — Rated for -40 °C to 100 °C with surface-mount BGA packaging suitable for industrial embedded systems.
• System Integration — Built-in peripherals (SPI, I2C, timers, oscillator) lower BOM and speed time-to-market for control and interface applications.

Why Choose LCMXO2-7000HC-6BG332I?

The LCMXO2-7000HC-6BG332I combines a large logic fabric, extensive I/O capability and meaningful on-chip memory in a single industrial-temperature FPGA package. It targets designs that require flexible interfacing, in-field reconfigurability and integrated system functions, enabling engineers to consolidate logic, reduce component count and simplify board-level design.

This device is well suited for embedded and industrial applications that demand reliable operation across a wide supply range and temperature window, while benefiting from programmable I/O standards, multiple clocking options and non‑volatile configuration for secure, instant-on deployments.

Request a quote or submit an RFQ to obtain pricing and availability for the LCMXO2-7000HC-6BG332I.