LCMXO2-7000HC-6BG256C

The LCMXO2-7000HC-6BG256C is a MachXO2 family Field Programmable Gate Array (FPGA) in a 256‑LFBGA package designed for commercial embedded applications. It delivers a blend of programmable logic, on-chip memory and flexible I/O in a single, non-volatile device suited for control, interface and glue-logic functions.

Key architectural highlights include 6,864 logic elements, 206 I/Os, and on-chip non-volatile flash for instant-on reconfiguration — providing integration and low-power operation for space-constrained commercial designs.

Key Features

• Core Logic  6,864 logic elements provide a scalable fabric for glue logic, state machines and moderate-complexity processing blocks.
• On-chip Memory  Total on-chip RAM of 245,760 bits (approximately 240 kbits) for embedded block memory and distributed RAM. The MachXO2 family also supports up to 256 kbits of user Flash memory for non-volatile configuration and data storage.
• I/O Density & Flexibility  206 user I/Os in a compact package with programmable sysIO buffer support for multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS and other differential interfaces.
• Power and Supply  Single supply operation across a voltage range of 2.375 V to 3.465 V and low-power options from the MachXO2 family, including standby modes with sub-milliwatt behavior.
• Clocking and PLLs  Multiple on-chip clock resources with eight primary clocks and up to two analog PLLs for flexible clock generation and fractional‑N synthesis.
• Reconfiguration & Non-Volatility  On-chip user Flash memory provides instant-on operation and in-field reconfiguration capabilities, including background programming and TransFR reconfiguration support from the family data.
• System Functions  Hardened peripherals and system features in the MachXO2 family such as SPI, I²C, timers/counters, on-chip oscillator and IEEE 1149.1 boundary scan simplify system integration.
• Package & Thermal  256‑LFBGA (256‑CABGA 14×14 supplier package) surface-mount package; commercial operating temperature range 0 °C to 85 °C. RoHS compliant.

Typical Applications

• Display and Video Interfaces  Programmable gearing and pre‑engineered source-synchronous I/O (including DDR registers and 7:1 gearing for display I/Os) enable interface logic for display panels and video peripherals.
• Memory Interface and Buffering  Dedicated DDR/DDR2/LPDDR support and DDR/DDRx gearing in the family make the device suitable for memory interface glue logic and timing adaptation.
• Embedded Control and Glue Logic  Use the device for board-level control, signal conditioning and protocol bridging where compact, non-volatile programmable logic is required.
• Sensor and Peripheral Aggregation  Hardened I2C/SPI peripherals, abundant I/Os and on-chip memory support sensor aggregation, data staging and low-level peripheral management in commercial systems.

Unique Advantages

• High I/O count in a compact package: 206 I/Os in a 256‑ball LFBGA provide dense connectivity for multi-signal interfaces without a large board footprint.
• Non-volatile, instant-on operation: On-chip user Flash enables single-chip non-volatile configuration and immediate startup behavior.
• Flexible mixed-signal I/O standards: Programmable sysIO buffers support a broad range of standards (LVCMOS, LVDS, PCI and others), reducing the need for external level translators.
• Integrated system peripherals: Built-in SPI, I²C, timers/counters and oscillator reduce BOM and simplify system software integration.
• Low-power options and standby modes: Family-level low-power architecture and standby capabilities help minimize power draw in idle states.
• Density migration and scalability: MachXO2 family selection and package variety support design scalability and future migrations.

Why Choose LCMXO2-7000HC-6BG256C?

The LCMXO2-7000HC-6BG256C offers a balanced mix of programmable logic, sizable on-chip memory and extensive I/O in a commercially graded, surface-mount 256‑LFBGA package. Its combination of non-volatile configuration, flexible I/O standards and integrated system functions make it well suited for commercial embedded designs that need reliable, compact programmable logic with instant-on behavior.

Designers targeting interface control, glue logic, display and memory adaptation tasks will find the device’s I/O density, on-chip peripherals and reconfiguration capabilities valuable for simplifying board-level design and reducing external components.

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