LCMXO2-7000HC-5TG144C

IC FPGA 114 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP

Quantity 78 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O114Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HC-5TG144C – MachXO2 Field Programmable Gate Array (FPGA), 6,864 logic elements, 245,760-bit RAM, 114 I/Os, 144‑LQFP

The LCMXO2-7000HC-5TG144C is a MachXO2 family Field Programmable Gate Array (FPGA) IC offering 6,864 logic elements and 245,760 bits of on-chip RAM in a 144-pin package. It combines non-volatile configuration, flexible I/O, embedded memory, and packetized clocking to address a range of embedded logic and interface tasks.

This commercial-grade device is targeted for designs that require instant-on, reconfigurable logic, broad I/O support and low-power operation across a 2.375 V to 3.465 V supply range and an operating temperature of 0 °C to 85 °C.

Key Features

  • Core Logic  6,864 logic elements (LUT4-based architecture) suitable for glue logic, control functions and moderate-density FPGA tasks.
  • Embedded and Distributed Memory  Total on-chip RAM: 245,760 bits (approximately 240 kbits of embedded block RAM available in the family and additional distributed RAM for flexible buffering and FIFOs).
  • I/O Density and Flexibility  114 I/Os with programmable sysIO buffers supporting a wide range of interfaces including multiple LVCMOS voltages, LVTTL, PCI, LVDS and other differential standards; I/Os support hot-socketing and on-chip differential termination.
  • Non‑Volatile, Reconfigurable  On-chip User Flash Memory (UFM) in the family up to 256 kbits, instant-on configuration, background programming and TransFR in-field reconfiguration capabilities.
  • Clocking and PLLs  Flexible clocking with eight primary clocks and up to two analog PLLs per device (fractional‑N support and wide input range noted in the family specification).
  • Low Power Operation  Built on an advanced low-power process with standby power as low as 22 μW and programmable power-saving modes.
  • Package and Environmental  144-pin LQFP package (supplier package listed as 144‑TQFP, 20×20 mm), commercial grade, RoHS compliant, operating temperature 0 °C to 85 °C.

Typical Applications

  • Interface Bridging and Glue Logic  Use the device to implement protocol translation, bus bridging and board-level glue where flexible I/O standards and moderate logic density are required.
  • Display and Memory I/O  Pre‑engineered source-synchronous I/O features and DDR register support make the family suitable for display gating and memory interface control tasks.
  • Embedded Control and Peripheral Management  On-chip timers, SPI and I²C controllers combined with non-volatile UFM enable integration of system control, configuration storage, and peripheral management.
  • Low-Power, Always‑On Logic  Low standby power and instant-on configuration are useful for always-on supervisory logic and power-managed subsystems.

Unique Advantages

  • Highly integrated single-chip solution: Combines logic, embedded RAM and non-volatile configuration memory to reduce BOM and board area.
  • Flexible I/O support: Programmable sysIO buffers and on-chip differential termination simplify multi-standard interface designs without extensive external components.
  • Instant-on and reconfigurable: Non-volatile configuration and TransFR support in-field updates and background programming for system flexibility and reduced downtime.
  • Low standby power: Advanced low-power process delivers minimal standby consumption for power-sensitive applications.
  • Commercial-grade robustness: 0 °C to 85 °C operating range and RoHS compliance align with standard commercial embedded applications.

Why Choose LCMXO2-7000HC-5TG144C?

The LCMXO2-7000HC-5TG144C positions itself as a versatile, commercially graded FPGA option for embedded designers who need non-volatile, reconfigurable logic with flexible I/O and substantial on-chip RAM. Its combination of 6,864 logic elements, approximately 245,760 bits of RAM, and extensive I/O capability provides a balance of integration and performance for control, interface, and peripheral tasks.

Designers benefit from instant-on behavior, low standby power, and family-level features such as programmable sysIO buffers, PLL-based clocking, and on-chip Flash memory for configuration storage—providing a scalable solution for product lines that require field updates and dependable operation across commercial temperature ranges.

If you would like pricing, lead-time or a formal quote for LCMXO2-7000HC-5TG144C, submit a request for a quote or RFQ and our team will respond with the available purchasing options and delivery information.

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