LCMXO2-7000HC-5FG484C

IC FPGA 334 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 334 245760 6864 484-BBGA

Quantity 839 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O334Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HC-5FG484C – MachXO2 FPGA, 6,864 logic elements, 334 I/Os, 484-BBGA

The LCMXO2-7000HC-5FG484C is a MachXO2 family Field Programmable Gate Array (FPGA) designed for commercial embedded and system applications requiring flexible logic, high I/O density and non-volatile configuration. Built on an advanced low-power process, the device combines 6,864 logic elements with a large I/O complement and embedded memory to handle glue logic, interface bridging and control functions.

This device delivers fast, single-chip configuration with on-chip user flash, programmable I/O standards and power-saving modes, making it suitable for display, memory-interface and general-purpose embedded control tasks in commercial products.

Key Features

  • Logic Capacity — 6,864 logic elements (LUT4 architecture) for flexible combinational and sequential logic implementation.
  • High I/O Count — 334 I/Os supporting a wide range of standards and enabling dense board-level connectivity.
  • Embedded Memory — Approximately 245,760 bits of on-chip RAM (sysMEM/EBR) plus support for distributed RAM and FIFO control logic.
  • On-Chip Non-Volatile Flash — User Flash Memory (UFM) up to 256 kbits with background programming and up to 100,000 write cycles for configuration storage and in-field updates.
  • Power and Low-Power Modes — Advanced 65 nm low-power process with standby operation as low as 22 μW and configurable power-saving options.
  • Flexible I/O and Interfaces — Programmable sysIO buffer supporting LVCMOS, LVTTL, PCI, LVDS and other differential standards; on-chip differential termination and programmable pull-up/pull-down.
  • Memory and High-Speed I/O Support — Pre-engineered source-synchronous I/O with DDR register support, dedicated gearing logic and dedicated DDR/DDR2/LPDDR memory interface support (family capability).
  • Clocking and PLLs — Up to two analog PLLs with fractional-N frequency synthesis and multiple primary clocks for flexible timing architectures.
  • Instant-On and Reconfiguration — Single-chip, non-volatile configuration with instant-on behavior, TransFR in-field reconfiguration and support for JTAG, SPI and I2C programming.
  • Package and Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23 × 23) designed for surface-mount PCB assembly; RoHS compliant.
  • Supply and Temperature — Single power-supply operation across 2.375 V to 3.465 V and commercial operating range from 0 °C to 85 °C.

Typical Applications

  • Interface Bridging and Glue Logic — Use the device to consolidate multiple interfaces and implement board-level glue logic with its large I/O count and flexible I/O standards.
  • Display and Video I/O — Pre-engineered source-synchronous I/O and gearing logic support display interface implementations and timing adaptation for panel or interface controllers.
  • Embedded Control and System Management — On-chip flash, timers/counters and hardened I2C/SPI support make the device suitable for system control, configuration storage and monitoring functions.
  • Memory Interface Support — Dedicated DDR/DDR2/LPDDR interface capabilities and DDR registers in I/O cells enable memory-side timing and buffering tasks.

Unique Advantages

  • High-density I/O and Logic in a Single Chip — 6,864 logic elements and 334 I/Os reduce board complexity by integrating dense logic and connectivity.
  • Non-Volatile Instant-On Configuration — On-chip user flash and single-chip configuration deliver fast power-up and field reconfiguration without external configuration ROM.
  • Low Standby Power — Advanced low-power process enables micro-watt standby modes, helping reduce overall system power consumption.
  • Flexible Interface Support — Programmable I/O buffers and on-chip differential termination simplify mixed-signal interfacing and signal integrity tuning.
  • Robust On-Chip Resources — Embedded SRAM, distributed RAM and dedicated FIFO logic support complex data buffering and processing without external memory.
  • Commercial Temperature and Wide Supply Range — Operates across 0 °C to 85 °C with a single supply range of 2.375 V to 3.465 V for straightforward power design.

Why Choose LCMXO2-7000HC-5FG484C?

The LCMXO2-7000HC-5FG484C positions itself as a versatile, non-volatile FPGA for commercial embedded systems that require high I/O density, substantial on-chip memory and flexible interface options. Its combination of 6,864 logic elements, approximately 245,760 bits of embedded RAM and up to 334 I/Os makes it well suited for applications that require integrated control, interface bridging and memory interfacing without adding external configuration components.

Designed for scalable designs and in-field reprogrammability, this MachXO2 device supports background programming, instant-on behavior and a range of on-chip peripherals that simplify system design and reduce BOM. It is an appropriate choice for engineers seeking a compact, power-efficient FPGA solution with non-volatile configuration and strong system-level support.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2-7000HC-5FG484C. Our team can provide ordering information and support for integration into your design.

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