LCMXO2-7000HC-5FG484C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 334 245760 6864 484-BBGA |
|---|---|
| Quantity | 839 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 334 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HC-5FG484C – MachXO2 FPGA, 6,864 logic elements, 334 I/Os, 484-BBGA
The LCMXO2-7000HC-5FG484C is a MachXO2 family Field Programmable Gate Array (FPGA) designed for commercial embedded and system applications requiring flexible logic, high I/O density and non-volatile configuration. Built on an advanced low-power process, the device combines 6,864 logic elements with a large I/O complement and embedded memory to handle glue logic, interface bridging and control functions.
This device delivers fast, single-chip configuration with on-chip user flash, programmable I/O standards and power-saving modes, making it suitable for display, memory-interface and general-purpose embedded control tasks in commercial products.
Key Features
- Logic Capacity — 6,864 logic elements (LUT4 architecture) for flexible combinational and sequential logic implementation.
- High I/O Count — 334 I/Os supporting a wide range of standards and enabling dense board-level connectivity.
- Embedded Memory — Approximately 245,760 bits of on-chip RAM (sysMEM/EBR) plus support for distributed RAM and FIFO control logic.
- On-Chip Non-Volatile Flash — User Flash Memory (UFM) up to 256 kbits with background programming and up to 100,000 write cycles for configuration storage and in-field updates.
- Power and Low-Power Modes — Advanced 65 nm low-power process with standby operation as low as 22 μW and configurable power-saving options.
- Flexible I/O and Interfaces — Programmable sysIO buffer supporting LVCMOS, LVTTL, PCI, LVDS and other differential standards; on-chip differential termination and programmable pull-up/pull-down.
- Memory and High-Speed I/O Support — Pre-engineered source-synchronous I/O with DDR register support, dedicated gearing logic and dedicated DDR/DDR2/LPDDR memory interface support (family capability).
- Clocking and PLLs — Up to two analog PLLs with fractional-N frequency synthesis and multiple primary clocks for flexible timing architectures.
- Instant-On and Reconfiguration — Single-chip, non-volatile configuration with instant-on behavior, TransFR in-field reconfiguration and support for JTAG, SPI and I2C programming.
- Package and Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23 × 23) designed for surface-mount PCB assembly; RoHS compliant.
- Supply and Temperature — Single power-supply operation across 2.375 V to 3.465 V and commercial operating range from 0 °C to 85 °C.
Typical Applications
- Interface Bridging and Glue Logic — Use the device to consolidate multiple interfaces and implement board-level glue logic with its large I/O count and flexible I/O standards.
- Display and Video I/O — Pre-engineered source-synchronous I/O and gearing logic support display interface implementations and timing adaptation for panel or interface controllers.
- Embedded Control and System Management — On-chip flash, timers/counters and hardened I2C/SPI support make the device suitable for system control, configuration storage and monitoring functions.
- Memory Interface Support — Dedicated DDR/DDR2/LPDDR interface capabilities and DDR registers in I/O cells enable memory-side timing and buffering tasks.
Unique Advantages
- High-density I/O and Logic in a Single Chip — 6,864 logic elements and 334 I/Os reduce board complexity by integrating dense logic and connectivity.
- Non-Volatile Instant-On Configuration — On-chip user flash and single-chip configuration deliver fast power-up and field reconfiguration without external configuration ROM.
- Low Standby Power — Advanced low-power process enables micro-watt standby modes, helping reduce overall system power consumption.
- Flexible Interface Support — Programmable I/O buffers and on-chip differential termination simplify mixed-signal interfacing and signal integrity tuning.
- Robust On-Chip Resources — Embedded SRAM, distributed RAM and dedicated FIFO logic support complex data buffering and processing without external memory.
- Commercial Temperature and Wide Supply Range — Operates across 0 °C to 85 °C with a single supply range of 2.375 V to 3.465 V for straightforward power design.
Why Choose LCMXO2-7000HC-5FG484C?
The LCMXO2-7000HC-5FG484C positions itself as a versatile, non-volatile FPGA for commercial embedded systems that require high I/O density, substantial on-chip memory and flexible interface options. Its combination of 6,864 logic elements, approximately 245,760 bits of embedded RAM and up to 334 I/Os makes it well suited for applications that require integrated control, interface bridging and memory interfacing without adding external configuration components.
Designed for scalable designs and in-field reprogrammability, this MachXO2 device supports background programming, instant-on behavior and a range of on-chip peripherals that simplify system design and reduce BOM. It is an appropriate choice for engineers seeking a compact, power-efficient FPGA solution with non-volatile configuration and strong system-level support.
Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2-7000HC-5FG484C. Our team can provide ordering information and support for integration into your design.

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