LCMXO2-7000HC-5BG256C

The LCMXO2-7000HC-5BG256C is a MachXO2 family FPGA IC featuring non-volatile, instantly reconfigurable logic in a 256-ball LFBGA package. It combines 6,864 logic elements, approximately 240 kbits of embedded RAM, and 206 I/Os to address control, interface and glue-logic functions in commercial embedded systems.

Designed for low-power, flexible I/O and in-field reconfiguration, this device targets applications that require high I/O density, on-chip user flash, and robust system-level features in a single-chip solution.

Key Features

• Logic Capacity — 6,864 logic elements (LUT4-based architecture) for implementing glue logic, state machines and custom peripherals.
• Embedded Memory — Total on-chip RAM of 245,760 bits (approximately 240 kbits) plus distributed RAM options for buffering and small data storage.
• On-Chip User Flash — Up to 256 kbits of non-volatile user flash memory with documented write-cycle endurance for configuration and parameter storage.
• High I/O Count — 206 programmable I/Os supporting a wide range of signaling standards for system interfacing and protocol bridging.
• Flexible I/O Standards — Programmable sysIO buffer and on-chip differential termination support multiple interfaces and signal levels for interoperability.
• Power and Supply — Single supply operation across a voltage range of 2.375 V to 3.465 V, with ultra-low standby power options documented for the family.
• Clocking and PLLs — Multiple primary clocks and up to two analog PLLs per device (family capability) for flexible clock generation and high-speed I/O timing.
• In-field Reconfiguration (TransFR) — Support for field-updatable logic allowing non-disruptive logic updates while the system operates.
• System-level Functions — On-chip hardened peripherals including SPI, I²C and timer/counter engines, plus an on-chip oscillator and unique device TraceID (family features).
• Package and Temperature — 256-LFBGA (supplier package 256-CABGA, 14×14 mm) and commercial operating temperature range of 0 °C to 85 °C.
• Standards and Test — IEEE 1149.1 boundary scan and IEEE 1532 compliant in-system programming capabilities (family features).

Typical Applications

• Interface Bridging and Protocol Conversion — Use the high I/O count and flexible sysIO buffering to implement protocol adapters, level shifting and protocol translation between subsystems.
• Display and Source-Synchronous I/O — Pre-engineered source-synchronous I/O and gearing options support display timing and other source-synchronous interfaces.
• Memory Interface Control — Dedicated DDR/DDR2/LPDDR support and DDR registers in I/O cells (family capabilities) allow integration of memory interface control and buffering logic.
• Embedded Control and Glue Logic — On-chip flash and logic resources enable consolidating timers, SPI/I²C peripherals and control state machines into a single programmable device.

Unique Advantages

• Non-Volatile Instant-On: On-chip user flash enables immediate startup without external configuration memory, simplifying board design.
• High Integration: Combines thousands of logic elements, embedded RAM and hardened interfaces to reduce bill-of-materials and board complexity.
• Flexible, High-Density I/O: 206 programmable I/Os with programmable buffer standards support broad interoperability with legacy and modern interfaces.
• In-Field Update Capability: TransFR reconfiguration allows safe, background logic updates for long-lived or field-maintained products.
• Wide Supply Range: Single-supply operation from 2.375 V to 3.465 V accommodates common system rails and simplifies power design.
• System-Level Support: On-chip SPI, I²C, timers and an oscillator provide ready-made building blocks to accelerate system integration.

Why Choose LCMXO2-7000HC-5BG256C?

The LCMXO2-7000HC-5BG256C positions itself as a versatile, non-volatile FPGA for commercial embedded designs that demand high I/O density, flexible interfacing and the ability to update logic in the field. Its combination of 6,864 logic elements, approximately 240 kbits of embedded RAM, on-chip user flash and extensive system features makes it suitable for consolidating glue logic, interface bridging and control functions onto a single device.

This device is appropriate for engineers and system designers seeking a compact, integrated solution with documented family-level capabilities for low power, flexible clocking and hardened peripherals—helping reduce BOM, simplify board layout and provide upgrade paths through density migration within the MachXO2 family.

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