LCMXO2-7000HC-4FTG256C

The LCMXO2-7000HC-4FTG256C is a MachXO2 family Field Programmable Gate Array (FPGA) optimized for flexible on-board logic integration. It provides 6,864 logic elements, extensive on-chip memory, and a broad set of I/O options in a compact 256-LBGA package.

Designed for applications that require reconfigurable logic, wide I/O flexibility and non-volatile in-system programmability, this commercial-grade device supports single-supply operation across a broad voltage range and standard commercial temperature operation.

Key Features

• Logic Capacity — 6,864 logic elements suitable for mid-density glue logic, control and interface functions.
• On-Chip Memory — 245,760 bits of total RAM for embedded and distributed storage, plus up to 256 kbits of on-chip user Flash memory for non-volatile configuration and user data.
• I/O Density & Flexibility — 206 I/Os delivered in a 256-LBGA package (256-FTBGA 17×17 supplier package) supporting a wide range of interface options described in the MachXO2 family.
• Power & Supply — Single power-supply operation with a voltage range of 2.375 V to 3.465 V and family-level low-power architecture options.
• Reconfiguration & Non-Volatility — Instant-on, non-volatile single-chip operation with background programming via supported interfaces and in-field logic update capability.
• Clocking — Multiple on-chip clock resources and up to two PLLs per device available in the MachXO2 family for flexible clock management.
• System-Level Support — On-chip peripherals such as SPI, I²C and timers/counters, plus IEEE 1149.1 boundary scan and IEEE 1532 in-system programming compatibility noted for the family.
• Package & Mounting — Surface-mount 256-LBGA package (supplier 256-FTBGA 17×17) for compact board integration; RoHS compliant.
• Operating Conditions — Commercial-grade device with an operating temperature range of 0 °C to 85 °C.

Typical Applications

• Interface Bridging and Protocol Conversion — Mid-density logic and flexible I/O support enable board-level protocol translation and interface adaptation between subsystems.
• System Control and Glue Logic — On-chip RAM and 6,864 logic elements provide resources for control state machines, sequencing, and peripheral integration.
• Embedded Configuration and Field Updates — On-chip user Flash and reconfiguration features allow secure, in-field firmware updates and dual-boot configurations.
• Memory and Display Interfaces — Family-level support for source-synchronous I/O and DDR register features enables implementation of memory interface logic and display I/O gearing.

Unique Advantages

• Mid-Density Integration: 6,864 logic elements provide substantial on-chip resources without requiring larger, higher-cost devices.
• Significant On-Chip RAM: 245,760 bits of embedded RAM support buffering, FIFOs and small data stores directly on the FPGA.
• Non-Volatile, Instant-On: On-chip user Flash enables rapid boot and persistent configuration without external PROMs.
• Flexible I/O Count: 206 I/Os in a 256-LBGA footprint offer a balance of I/O density and compact package size for space-constrained designs.
• Single-Supply Simplicity: Operates across a 2.375 V to 3.465 V supply range, simplifying power-domain planning on mixed-voltage boards.

Why Choose LCMXO2-7000HC-4FTG256C?

This MachXO2 device combines mid-range logic capacity, sizable embedded memory and a broad set of system-level features in a compact 256-LBGA package. It is positioned for designs that need reconfigurable logic, on-chip non-volatile configuration and flexible I/O without moving to larger FPGA families.

Engineers designing control logic, interface bridges, or systems that require field-updatable logic will find the combination of 6,864 logic elements, 245,760 bits of RAM and up to 256 kbits of user Flash useful for reducing BOM complexity and enabling in-field maintenance and upgrades.

Request a quote or submit a pricing inquiry to obtain availability, lead times and volume pricing for the LCMXO2-7000HC-4FTG256C.