LCMXO2-7000HC-4FG484I

The LCMXO2-7000HC-4FG484I is a MachXO2 family FPGA providing a flexible, non-volatile logic platform with 6,864 logic elements and 334 general-purpose I/Os in a 484-ball BGA package. Designed for industrial-temperature systems, it delivers embedded SRAM, on-chip user Flash, and a wide range of programmable I/O options for interface control, system glue logic, and in-field upgrades.

Core attributes from the MachXO2 family—instant-on non-volatile configuration, low standby power, and rich I/O flexibility—make this device suitable for applications that require reliable control, high I/O density, and field reconfigurability.

Key Features

• Core Logic — 6,864 logic elements providing the combinational and sequential resources for custom glue logic and control functions.
• On-chip Memory — Total RAM bits: 245,760 (approximately 240 kbits) of embedded block and distributed memory for FIFOs, buffering, and local data storage.
• User Flash (UFM) — On-chip non-volatile user Flash memory (up to 256 kbits in the family) with documented 100,000 write cycles for configuration storage and in-field updates.
• I/O Density & Flexibility — 334 I/Os supporting a wide range of standards and programmable sysIO buffer options, enabling diverse interface protocols and hot-socketing capability.
• Power — Advanced low-power architecture (family-level standby as low as 22 μW) and support for programmable low-swing differential I/Os to optimize system power.
• Clocking & PLLs — Multiple primary clocks and up to two analog PLLs per device (family feature) with wide input frequency range for flexible clock management.
• Reconfiguration & Security — Non-volatile instant-on configuration, background programming and TransFR in-field reconfiguration capability for live updates and secure single-chip solutions.
• Package & Environmental — 484-BBGA package (23 mm × 23 mm footprint) with industrial-grade operation from −40 °C to 100 °C and a single supply voltage range of 2.375 V to 3.465 V.

Typical Applications

• Display and Video I/O — Use the device’s pre-engineered source-synchronous I/O and gearing features for display interface control and LVDS/DDR signaling.
• Interface Bridging and Protocol Translation — High I/O count and programmable sysIO buffers enable protocol conversion and multi-interface bridging for embedded systems.
• Embedded System Control — On-chip Flash, timers/counters, SPI and I²C support allow implementation of system management, configuration storage, and watchdog or timing functions.
• Field Upgradeable Logic — TransFR reconfiguration and background programming enable in-field logic updates without full system downtime.

Unique Advantages

• High I/O Integration: 334 I/Os reduce external glue logic and simplify board-level routing for multi-interface designs.
• Non-Volatile Instant-On: On-chip user Flash and instant-on architecture eliminate the need for external configuration memory and speed system start-up.
• Embedded Memory Resources: Approximately 240 kbits of embedded RAM and distributed memory support local buffering and FIFO control without external SRAM.
• Industrial Temperature Rated: Specified operation from −40 °C to 100 °C for deployment in industrial environments.
• Flexible Power Supply Range: Single-supply operation from 2.375 V to 3.465 V accommodates a range of system power rails.
• Low-Power Standby: Family-level ultra-low standby power supports energy-sensitive applications and reduces system idle consumption.

Why Choose LCMXO2-7000HC-4FG484I?

The LCMXO2-7000HC-4FG484I positions itself as a highly integrated, industrial-grade FPGA option for designs that require substantial I/O density, on-chip non-volatile configuration, and embedded memory. With 6,864 logic elements, approximately 240 kbits of embedded RAM, and on-chip user Flash, the device is geared toward system control, interface consolidation, and field-reconfigurable applications.

Engineers targeting scalable, reliable designs will benefit from the MachXO2 family feature set—flexible clocking and PLLs, programmable I/O standards, low standby power, and a 484-ball BGA footprint—providing a robust platform for long-term deployment and updates in the field.

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