LCMXO2-7000HC-4BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA

Quantity 404 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HC-4BG256I – MachXO2 FPGA, 6864 logic elements, 206 I/Os, 256‑LFBGA

The LCMXO2-7000HC-4BG256I is a MachXO2 family Field Programmable Gate Array (FPGA) in a 256‑LFBGA package designed for industrial applications. It combines a flexible logic architecture with embedded memory, on-chip nonvolatile flash, programmable I/O and low-power operation to address glue logic, control, and interface tasks in space-constrained systems.

Key Features

  • Core Logic — 6,864 logic elements (LUT4-based) provide reconfigurable resources for glue logic, state machines and small to medium custom logic functions.
  • Embedded Memory — Total on-chip RAM of 245,760 bits (approximately 240 kbits) for system buffers and local data storage; family support for embedded block RAM and distributed RAM.
  • On‑Chip User Flash (UFM) — Up to 256 kbits of nonvolatile user flash memory with 100,000 write cycles for in-field configuration storage and soft‑processor PROM usage.
  • I/O Density & Flexibility — 206 I/Os in the 256‑ball package; programmable sysIO buffer supports a wide range of signaling standards and on‑chip differential termination.
  • Power — Advanced 65 nm low power process and standby modes; family-level standby power as low as 22 μW and multiple power saving options.
  • Clocking & PLLs — Up to two analog PLLs with fractional‑n synthesis and support for multiple primary clocks for flexible clocking topologies.
  • High‑Speed I/O & DDR Support — Pre‑engineered source synchronous I/O with DDR registers in I/O cells, dedicated gearing for display I/Os and dedicated DDR/DDR2/LPDDR memory support as provided by the MachXO2 family.
  • Instant‑On & Reconfiguration — Nonvolatile, single‑chip instant‑on capability and TransFR in‑field reconfiguration for background updates without full system downtime.
  • Package & Environmental — Surface mount 256‑LFBGA (supplier package 256‑CABGA, 14 × 14 mm), RoHS compliant; industrial grade with operating range from −40 °C to 100 °C.
  • Supply Voltage Range — Single power supply operation across 2.375 V to 3.465 V for flexible system integration.

Typical Applications

  • Industrial Control and Automation — Implement control logic, state machines and I/O bridging where industrial temperature range and robust I/O support are required.
  • Interface Bridging and Glue Logic — Replace discrete glue components by consolidating bus bridges, protocol translators and handshake logic into a single programmable device.
  • Display and Video Front‑End — Use source synchronous I/O and display gearing to manage display interfaces and timing-critical signal conditioning.
  • Communications and Networking Peripherals — Provide flexible I/O standards, DDR support and buffering for PHY interfacing, packet handling and control plane functions.

Unique Advantages

  • Highly integrated logic and I/O: 6,864 logic elements and 206 I/Os reduce external glue logic and simplify board-level design.
  • On‑chip nonvolatile storage: Up to 256 kbits of user flash enables secure instant‑on configurations and background reprogramming without external memory.
  • Low standby power options: Advanced low‑power process and standby modes minimize power draw in idle states.
  • Flexible signaling support: Programmable sysIO buffers and built‑in termination allow broad compatibility with common single‑ended and differential interfaces.
  • Industrial temperature rating: Rated for −40 °C to 100 °C operation to meet harsher environment requirements.
  • Single supply flexibility: Wide supply range (2.375 V to 3.465 V) eases integration into systems with differing supply rails.

Why Choose LCMXO2-7000HC-4BG256I?

The LCMXO2-7000HC-4BG256I positions itself as a compact, industrial‑grade, nonvolatile FPGA solution that balances significant logic capacity with extensive I/O and embedded memory. Its combination of on‑chip user flash, embedded RAM, and flexible clocking/PLL resources makes it suitable for designers seeking an integrated programmable device for control, interfacing and display tasks.

Long-term value derives from instant-on nonvolatile configuration, in-field reconfiguration capability, and a broad set of I/O and memory features that reduce BOM and simplify design migration within the MachXO2 family.

Request a quote or submit a procurement request to obtain pricing and lead-time information for LCMXO2-7000HC-4BG256I.

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