LCMXO2-640ZE-3TG100C

The LCMXO2-640ZE-3TG100C is a MachXO2 family field-programmable gate array (FPGA) in a 100-pin LQFP package. This commercial-grade device provides 640 logic elements, 78 user I/Os and on-chip memory, making it suitable for compact control, glue-logic and I/O-centric designs where low power and flexible interfacing are important.

Built on the MachXO2 family architecture, the device pairs reconfigurable logic with family-level features such as non-volatile user flash, programmable I/O modes and low-power operation to support in-field updates and system-level integration.

Key Features

• Logic Capacity — 640 logic elements (cells) for implementing control, glue logic and moderate-density state machines.
• Embedded Memory — Total on-chip RAM of 18,432 bits to support small FIFOs, buffers and state storage.
• I/O Count & Flexibility — 78 user I/Os with programmable buffer options as provided by the MachXO2 family for a wide range of interfaces and signaling modes.
• Power Supply — Single-supply operation with a VCC range of 1.14 V to 1.26 V.
• Package — 100‑pin LQFP package; supplier device package indicated as 100‑TQFP (14 × 14 mm) for board-level integration.
• Operating Range — Commercial operating temperature from 0 °C to 85 °C and RoHS-compliant packaging.
• Family-Level Low Power — MachXO2 family offers ultra low-power options including sleep/standby modes and low standby currents (family feature).
• On‑Chip Non‑Volatile Memory (Family Feature) — The MachXO2 family includes on-chip user flash memory and supports background programming and secure single-chip configurations.
• Reconfiguration and System Support (Family Feature) — Family-level capabilities include in-field reconfiguration (TransFR), background programming options and integrated functions such as SPI, I²C and timers for system-level integration.

Typical Applications

• System Glue Logic — Use the 640 logic elements and 78 I/Os to consolidate discrete glue logic, bus interfacing and protocol adaptation in compact designs.
• Peripheral and I/O Expansion — Ideal for expanding or adapting I/O on embedded boards where programmable I/O standards and moderate on-chip RAM are required.
• Control and Sequencing — Implement finite-state machines, control sequencing and timers leveraging the device’s logic capacity and family-level timer/counter resources.
• Field Upgradeable Systems — Take advantage of MachXO2 family in-field reconfiguration and non-volatile configuration to update logic in deployed systems without external configuration storage.

Unique Advantages

• Compact, Integrated Solution: Combines reconfigurable logic, embedded RAM and extensive I/O in a 100‑pin package to reduce BOM and board area.
• Low‑Power Operation: MachXO2 family low-power options and the device’s single-supply operation support energy-conscious designs and standby modes.
• Non‑Volatile Configuration: Family-level on-chip user flash enables secure, single-chip configurations and background programming for simplified system boot.
• Flexible I/O Signaling: Programmable I/O buffer options from the MachXO2 family provide the flexibility to support multiple interface standards without extra components.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C for standard commercial applications and deployments.
• RoHS‑Compliant Packaging: Environmentally compliant packaging supports regulatory requirements for modern electronics manufacturing.

Why Choose LCMXO2-640ZE-3TG100C?

The LCMXO2-640ZE-3TG100C positions itself as a space-efficient, low-power FPGA option within the MachXO2 family, offering 640 logic elements, 78 I/Os and 18,432 bits of on-chip RAM in a 100‑pin LQFP package. It is well suited to designers needing programmable I/O flexibility, compact logic integration and non-volatile configuration in commercial-temperature applications.

For teams implementing board-level control, interface adaptation or field-updatable logic, this device delivers a balance of integration and system-level support drawn from the MachXO2 family capabilities, helping reduce external components and simplify firmware-driven updates.

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