LCMXO2-640ZE-3MG132I

The LCMXO2-640ZE-3MG132I is a MachXO2 family field programmable gate array (FPGA) in a 132-ball CSPBGA surface-mount package. It delivers 640 logic elements, 18,432 bits of on-chip RAM and 79 I/Os in an industrial-grade device designed for embedded control, interface bridging and system glue logic.

With a low-voltage supply range and support from MachXO2 family-level features, this part targets compact, power-conscious designs that require non-volatile configuration and reliable operation across an extended temperature range.

Key Features

• Logic Capacity — 640 logic elements for implementing control, glue-logic and moderate-density custom functions.
• On-chip Memory — 18,432 total RAM bits to support FIFOs, small buffers and distributed memory needs.
• Flexible I/O — 79 I/Os available in the 132-CSPBGA package for signal interfacing and peripheral connections.
• Power Supply — Operates from a 1.14 V to 1.26 V supply to support low-voltage system domains.
• Industrial Temperature Range — Rated for −40 °C to 100 °C for use in industrial environments.
• Package & Mounting — 132-LFBGA / 132-CSPBGA (8×8) surface-mount package for compact PCB integration.
• Non-volatile Family Capabilities — MachXO2 family-level features include instant-on configuration, in-field reconfiguration (TransFR) and on-chip user flash memory capability.
• System-level Support (Family) — Family data highlights programmable I/O buffer options, source-synchronous I/O support and on-chip peripheral functions such as SPI, I²C and timer/counter primitives.
• Standards & Programming (Family) — MachXO2 family supports JTAG, SPI and I²C configuration paths and IEEE boundary-scan and in-system programming features.
• RoHS Compliant — Device is compliant with RoHS environmental requirements.

Typical Applications

• Interface Bridging — Convert or glue together disparate logic levels and peripheral interfaces using the device’s plentiful I/Os and programmable buffers.
• Embedded Control — Implement control and sequencing logic in industrial modules where extended temperature operation is required.
• Peripheral Aggregation — Consolidate multiple slow/peripheral interfaces into a single device to reduce BOM and board area.
• In-field Logic Updates — Use the MachXO2 family’s in-field reconfiguration features to update logic without removing the device from the system.

Unique Advantages

• Compact, production-ready package: 132-CSPBGA surface-mount package provides a small PCB footprint for space-constrained designs.
• Industrial reliability: Specified for −40 °C to 100 °C operation to meet industrial environmental requirements.
• Low-voltage operation: Single-supply operation at 1.14–1.26 V simplifies integration into low-voltage systems.
• Integrated memory resources: 18,432 bits of on-chip RAM reduce the need for external SRAM in many control and buffering applications.
• Non-volatile configuration and system features: Benefits from MachXO2 family capabilities such as instant-on configuration and TransFR in-field updates for flexible system maintenance.
• Compliance and manufacturability: RoHS compliance and surface-mount packaging support modern manufacturing and environmental requirements.

Why Choose LCMXO2-640ZE-3MG132I?

The LCMXO2-640ZE-3MG132I offers a balanced combination of moderate logic capacity, embedded RAM and a relatively large I/O count in a compact industrial-grade CSPBGA package. It is well suited for embedded designers and system engineers who need reliable, non-volatile FPGA functionality for interface logic, peripheral aggregation and in-field update capability.

Choosing this MachXO2 family device brings family-level system features—such as flexible I/O buffering, instant-on configuration and reconfiguration options—into a low-voltage, RoHS-compliant component that supports industrial temperature operation and streamlined board integration.

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