LCMXO2-640ZE-2TG100I

IC FPGA 78 I/O 100TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 78 18432 640 100-LQFP

Quantity 113 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LQFPNumber of I/O78Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of LCMXO2-640ZE-2TG100I – MachXO2 FPGA IC, 640 logic elements, 100-pin package

The LCMXO2-640ZE-2TG100I is a MachXO2 field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for industrial applications. It combines a flexible logic fabric with embedded RAM, a broad range of programmable I/O options, and an ultra-low-power architecture to address glue-logic, interface, and control tasks in compact systems.

Key strengths include 640 logic elements, approximately 18 kbits of on-chip RAM, 78 I/Os, a low-voltage supply range, and operation across an industrial temperature range—enabling reliable, low-power designs in a 100-pin surface-mount package.

Key Features

  • Logic Capacity — 640 logic elements suitable for moderate-density control, glue logic and interface functions.
  • Embedded Memory — Approximately 18 kbits of on-chip RAM (18,432 bits) for local data storage and buffering.
  • I/O — 78 programmable I/Os supporting a wide range of I/O standards as provided by the MachXO2 family, enabling flexible interfacing to peripherals and buses.
  • Low-Voltage Supply — Operates from 1.14 V to 1.26 V, supporting low-power system designs.
  • Ultra Low Power Family Characteristics — MachXO2 family features an advanced 65 nm low-power process with standby modes and low standby power (family-level data).
  • On-Chip Non-Volatile and Configuration — Family-level support for on-chip user flash and background programming, instant-on power-up behavior and in-field reconfiguration (TransFR) for live updates.
  • Clocking and Timing — Family supports multiple primary clocks, edge clocks for high-speed I/O, and analog PLLs for fractional frequency synthesis (family-level capabilities).
  • Package & Mounting — 100-pin surface-mount package; listed package case 100-LQFP and supplier device package 100-TQFP (14 × 14 mm).
  • Industrial Grade & Temperature — Industrial-rated operation from −40 °C to 100 °C for deployment in demanding environments.
  • Standards & System Features (family-level) — Support for JTAG, SPI, I²C programming interfaces, boundary-scan and in-system programming standards.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Industrial Control & Automation — Implements glue logic, sensor interfacing and simple control engines within an industrial temperature window and low-power envelope.
  • Interface Bridging — Provides flexible I/O and programmable buffering to bridge mismatched bus formats and peripheral interfaces.
  • Display and Memory I/O — Family-level pre-engineered source-synchronous and DDR-capable I/O features support display and memory interface tasks where deterministic timing is required.
  • Embedded System Glue Logic — Integrates timers, SPI/I²C controllers and custom logic to reduce BOM and simplify board-level design.

Unique Advantages

  • Compact, moderate-density FPGA — 640 logic elements and embedded RAM deliver the right balance of capacity and footprint for many control and interface roles.
  • Low-voltage, low-power operation — Narrow VCC range (1.14–1.26 V) and family-level low-power modes help minimize system power in standby and active states.
  • Industrial temperature rating — Specified for −40 °C to 100 °C operation to meet demanding environmental requirements.
  • Flexible, programmable I/O — Family I/O architecture supports a broad set of standards to simplify peripheral interfacing and reduce external components.
  • Non-volatile, field-updatable logic — Family features such as on-chip flash, instant-on behavior and in-field reconfiguration enable secure, updatable deployments.
  • System-level integration — On-chip peripherals and programming interfaces (JTAG, SPI, I²C) streamline system design and provisioning.

Why Choose LCMXO2-640ZE-2TG100I?

This MachXO2 device is positioned for engineers who need a compact, low-power, industrial-grade FPGA that combines moderate logic capacity with flexible I/O and embedded memory. Its combination of 640 logic elements, approximately 18 kbits of RAM, and 78 I/Os in a 100-pin surface-mount package makes it well suited for board-level glue logic, interface bridging, and control functions where reliability and low-power operation matter.

Choosing the LCMXO2-640ZE-2TG100I helps reduce external components and simplifies system design through on-chip memory and family-level support for non-volatile configuration and in-field updates, while meeting industrial temperature and RoHS requirements.

Request a quote or submit a procurement inquiry to receive pricing and availability for the LCMXO2-640ZE-2TG100I.

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