LCMXO2-7000HC-4BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA

Quantity 684 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HC-4BG256C – MachXO2 Field Programmable Gate Array (FPGA), 6,864 logic elements, 206 I/Os, 256-LFBGA

The LCMXO2-7000HC-4BG256C is a MachXO2 family FPGA offering a flexible logic architecture with 6,864 logic elements and 206 general-purpose I/Os in a 256-ball LFBGA package (supplier package: 256-CABGA, 14 × 14 mm). It targets designs that need moderate logic density, dense I/O, and non-volatile, field-reconfigurable capability.

Built for commercial-grade applications, the device provides embedded memory, programmable I/O standards, and low-power options while operating from a single supply rail between 2.375 V and 3.465 V and across a 0 °C to 85 °C temperature range.

Key Features

  • Core Logic  6,864 logic elements for glue logic, control, and custom digital functions in a compact FPGA.
  • Embedded and Distributed Memory  Approximately 245,760 bits (≈240 kbits) of on-chip RAM for system buffers and state storage; family documentation also cites embedded block RAM and distributed RAM options.
  • On-Chip Non-Volatile Memory  Family-level support for on-chip user flash memory (up to 256 kbits), enabling instant-on and in-field reprogramming of configuration data.
  • High-density I/O  206 I/O pins with programmable sysIO buffer support for a wide range of standards including multiple single-ended and differential interfaces, on-chip differential termination, and hot-socketing support.
  • Clocking and PLLs  Flexible on-chip clocking with multiple primary clocks and up to two PLLs per device (family-level capability) for fractional-n frequency synthesis and wide input frequency support.
  • Power and Low-Power Modes  Advanced low-power process with selectable standby and power-saving options; device operates from a single supply between 2.375 V and 3.465 V.
  • Configuration and In-Field Update  Non-volatile, infinitely reconfigurable architecture with JTAG, SPI, and I2C programming interfaces and support for in-field logic updates (TransFR reconfiguration).
  • Package and Mounting  Supplied in a 256-ball LFBGA package suitable for surface-mount assembly; supplier package recorded as 256-CABGA (14 × 14 mm).
  • Commercial Grade and Environmental  Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Interface Bridging and Protocol Conversion  Use the dense I/O and programmable I/O standards to implement protocol translation, bus bridging and I/O aggregation.
  • User Interface and Display Control  Pre-engineered source-synchronous I/O, DDR registers in I/O cells and gearing support make the device suitable for display timing, user interface control, and buffering.
  • Embedded Control and Glue Logic  6,864 logic elements and on-chip RAM provide resources for control tasks, timers/counters, and system glue between discrete components.
  • Low-Power Standby Functions  Low standby power modes and single-supply operation support duty-cycled systems and designs requiring low-power idle states.

Unique Advantages

  • Non-volatile, Instant-On Configuration: On-chip user flash memory and single-chip configuration enable immediate start-up and secure boot configurations without external flash.
  • Field Reprogrammability: TransFR reconfiguration and background programming allow in-field logic updates while the system remains operational.
  • Wide I/O Flexibility: Programmable sysIO supports a broad set of interface standards and differential signaling with on-chip termination, reducing external components.
  • Compact, High-I/O Package: 206 I/Os in a 256-ball package provide dense connectivity in a compact 14 × 14 mm form factor (supplier package), simplifying board-level routing for mid-density designs.
  • Single-Supply Operation: Extended supply range (2.375 V to 3.465 V) supports designs that require straightforward power distribution from a single rail.

Why Choose LCMXO2-7000HC-4BG256C?

This MachXO2 FPGA delivers a balanced combination of moderate logic density, extensive I/O, embedded memory and non-volatile configuration in a commercial-grade package. It suits engineers building control logic, interface bridges, display controllers and other embedded systems that benefit from instant-on behavior and in-field reprogramming.

With flexible clocking, programmable I/O standards and low-power modes, the LCMXO2-7000HC-4BG256C is positioned for designs that need reliable system integration, reduced external component count and ongoing configurability through the product life cycle.

Request a quote or submit a sales inquiry to receive pricing and availability information for the LCMXO2-7000HC-4BG256C.

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