LCMXO2-7000HC-4FG484C

The LCMXO2-7000HC-4FG484C is a MachXO2 family FPGA from Lattice Semiconductor designed for commercial applications requiring high I/O density, non-volatile instant-on logic and flexible system integration. This device delivers 6,864 logic elements, approximately 240 kbits of embedded RAM, and 334 I/Os in a 484-ball BGA (23 × 23 mm) package, making it suitable for system glue logic, I/O aggregation, and mid-density programmable logic tasks.

Built on the MachXO2 architecture, the device supports on-chip user flash, flexible I/O standards, low-power operation modes and in-field reconfiguration options that simplify system design and enable field updates without external volatile memory.

Key Features

• Core Logic — 6,864 logic elements provide mid-range combinational and sequential resource capacity for glue logic, control functions and programmable accelerators.
• Embedded Memory — Approximately 240 kbits of on-chip RAM (sysMEM™ Embedded Block RAM and distributed RAM) for buffering, small FIFOs and state storage.
• On-Chip User Flash & Reconfiguration — Supports non-volatile user flash for configuration and in-field updates, with family-level support for background programming and dual-boot options.
• I/O Density & Flexibility — 334 I/Os with programmable sysIO™ buffers that support multiple standards (LVCMOS, LVTTL, LVDS, SSTL, HSTL and others) and programmable differential termination.
• Clocking & PLLs — Flexible on-chip clocking with up to two analog PLLs (fractional-N support) and multiple primary clocks for system and I/O timing.
• Power & Low-Power Modes — Designed for low standby power and includes standby mode and other power-saving options to reduce system power consumption.
• Package & Mounting — 484-ball BGA (23 × 23 mm, ftBGA-style) surface-mount package; RoHS compliant and rated for commercial operating temperature (0 °C to 85 °C).
• Supply Voltage — Single supply operating range from 2.375 V to 3.465 V to support common system rails.

Typical Applications

• System Glue Logic — Consolidate discrete glue, level-shifting and custom control logic into a single programmable device to reduce BOM and board area.
• I/O Aggregation & Protocol Bridging — Use the high I/O count and programmable I/O standards to aggregate sensors, peripherals and bus interfaces with tailored signaling.
• Memory and Display Interfaces — Pre-engineered source-synchronous I/O and DDR support enable use in display I/O gearing and memory interface control tasks.
• Field Upgradeable Control — On-chip flash and in-field reconfiguration support make the device suitable for systems that require firmware updates or logic revisions in the field.

Unique Advantages

• High I/O Count: 334 configurable I/Os enable dense peripheral connectivity and simplify board routing by reducing the need for external translators or expanders.
• Non-Volatile Instant-On: On-chip user flash provides single-chip, secure configuration and rapid power-up without external configuration memory.
• Mid-Range Logic with On-Chip RAM: 6,864 logic elements combined with approximately 240 kbits of embedded RAM support a wide range of control and buffering functions without external SRAM.
• Flexible I/O Standards: Programmable sysIO buffers support numerous common signaling standards, enabling reuse across multiple designs and interfaces.
• Field Reconfiguration: TransFR™ reconfiguration and background programming enable in-field logic updates while the system remains operational.
• Compact, Surface-Mount Package: 484-ball BGA (23 × 23 mm) provides a high-pin-count solution in a compact footprint for densely populated boards.

Why Choose LCMXO2-7000HC-4FG484C?

This MachXO2 device balances high I/O density, substantial logic capacity and embedded memory with non-volatile configuration and field-update capability, offering a versatile building block for commercial systems. Its programmable I/O flexibility and on-chip flash simplify integration across multiple subsystems while reducing external components.

Choose the LCMXO2-7000HC-4FG484C for mid-density programmable logic needs where rapid power-up, in-field configurability and broad I/O support are important. The combination of 6,864 logic elements, approximately 240 kbits of embedded RAM and 334 I/Os in a 484-ball BGA gives designers the capacity and connectivity for diverse control, interface and glue-logic applications.

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