LCMXO2-7000HC-4BG332C

The LCMXO2-7000HC-4BG332C is a MachXO2 family Field Programmable Gate Array (FPGA) in a 332‑ball caBGA package. It delivers configurable logic, on-chip memory and a rich I/O set in a single, non-volatile FPGA device suited for commercial embedded applications.

Built for low-power and highly integrated control, the device combines 6,864 logic elements with approximately 240 kbits of embedded RAM and up to 256 kbits of on-chip user flash memory, making it useful for system glue logic, interface bridging, and control functions where fast instant-on and flexible I/O are important.

Key Features

• Logic Capacity — 6,864 logic elements providing ample programmable resources for glue logic, control state machines and peripheral integration.
• Embedded Memory — 245,760 total RAM bits (approximately 240 kbits) of on-chip RAM plus up to 256 kbits of on-chip user flash memory for configuration and parameter storage.
• Rich I/O — 278 I/O pins with programmable sysIO buffer support for a wide range of standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, MLVDS, RSDS, LVPECL, SSTL and HSTL.
• Power and Low‑Power Modes — Advanced 65 nm low-power architecture and standby options; datasheet notes standby currents as low as 22 µW for reduced power consumption in idle states.
• Clocking and PLLs — Integrated clocking resources with up to two analog PLLs supporting fractional‑n frequency synthesis and wide input frequency ranges for flexible timing and interface needs.
• On‑Chip Peripherals — Hardened functions including SPI, I²C, timer/counter, internal oscillator and unique TraceID for system tracking and simplified system integration.
• Reconfigurability and Security — Non‑volatile instant‑on architecture with background programming support, TransFR in-field reconfiguration capability and optional One Time Programmable (OTP) mode.
• Package and Mounting — 332‑FBGA (supplier package: 332‑caBGA, 17 × 17 mm) surface‑mount package suited for compact PCB designs; single power-supply operation over a wide range.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial applications.

Typical Applications

• System Glue Logic — Replace complex discrete logic and simplify board-level designs by consolidating control and interfacing functions into a single FPGA.
• Interface Bridging — Use the broad programmable I/O and DDR/source-synchronous support to bridge between heterogeneous peripherals and buses.
• Display and Memory Interfaces — Leverage dedicated DDR gearing and I/O DDR registers for display or memory interface timing and data alignment.
• Embedded Control and Peripheral Integration — Implement timers, SPI/I²C controllers and custom control state machines with on-chip flash for firmware storage and fast boot.

Unique Advantages

• High Integration: Combines 6,864 logic elements, substantial embedded RAM and on-chip user flash to reduce external components and BOM complexity.
• Flexible I/O Standards: Programmable sysIO buffers support a wide range of signaling standards, enabling easier interface migration and hardware reuse.
• Low-Power Operation: Advanced low-power process and standby modes (standby power as low as 22 µW) lower system idle power consumption.
• Instant-On Non‑Volatile Configuration: Powers up configured in microseconds and supports background programming and dual‑boot options for reliable field updates.
• Compact Packaging: 332‑ball caBGA (17 × 17 mm) surface-mount package balances high I/O count with a small PCB footprint for space-constrained designs.
• System-Level Functions On-Chip: Integrated SPI, I²C, timers and oscillator simplify software and hardware integration while reducing the need for discrete controllers.

Why Choose LCMXO2-7000HC-4BG332C?

The LCMXO2-7000HC-4BG332C positions itself as a highly integrated, low-power FPGA option for commercial embedded designs that require substantial programmable logic, flexible I/O and non‑volatile instant-on behavior. Its combination of 6,864 logic elements, approximately 240 kbits of embedded RAM and up to 256 kbits of user flash supports a wide range of control, interface and system consolidation tasks.

Designed for teams seeking to reduce component count and streamline interface management, this MachXO2 device offers the configuration flexibility, on-chip peripherals and packaged density needed for compact, field-updatable designs while operating within a commercial temperature range and a 2.375 V to 3.465 V supply window.

Request a quote or submit a parts inquiry to receive pricing and availability for the LCMXO2-7000HC-4BG332C. Technical and procurement details can be provided on request.