LCMXO2-7000HC-4BG332I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 278 245760 6864 332-FBGA |
|---|---|
| Quantity | 305 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 278 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HC-4BG332I – MachXO2 Field Programmable Gate Array (FPGA) IC 278 245760 6864 332-FBGA
The LCMXO2-7000HC-4BG332I is a MachXO2-family FPGA from Lattice Semiconductor designed as an industrial-grade, non-volatile, instant-on programmable logic device. It combines programmable logic, embedded block RAM, on-chip user flash, and a broad set of I/O capabilities in a compact 332-ball caBGA package to address system control, interface bridging and glue-logic tasks.
With 6,864 logic elements, approximately 240 kbits of embedded block RAM and support for 278 I/O pins, this device is aimed at applications that require flexible I/O standards, low standby power and reliable operation across an extended temperature range.
Key Features
- Core Logic 6,864 logic elements (LUT4 architecture) provide programmable combinational and sequential logic resources for custom glue logic and control functions.
- Embedded and Distributed Memory Approximately 240 kbits of embedded block RAM (EBR) plus up to 54 kbits of distributed RAM enable FIFO buffering, small data stores and state retention for system logic.
- On-Chip Non-Volatile Memory Up to 256 kbits of on-chip user flash memory supports single-chip, infinitely reconfigurable designs with background programming and up to 100,000 write cycles.
- I/O Flexibility 278 user I/Os with programmable sysIO buffer support a wide range of standards, including multiple LVCMOS voltages, LVTTL, LVDS-family interfaces, PCI, SSTL, HSTL and more, plus on-chip differential termination and hot-socketing support.
- Power and Low-Power Modes Built on an advanced 65 nm low-power process with standby power as low as 22 μW and programmable power-saving options to minimize system-level power consumption.
- Clocking and PLLs Flexible on-chip clocking with eight primary clocks, up to two edge clocks for high-speed I/O, and up to two analog PLLs for fractional-n frequency synthesis.
- Reconfiguration and Security Instant-on operation (powers up in microseconds), TransFR in-field reconfiguration, background programming and secure single-chip configuration via JTAG, SPI or I²C.
- System-Level Support Hardened functions include SPI, I²C and timer/counter blocks, an on-chip oscillator, unique TraceID for tracking and IEEE 1149.1 boundary scan support.
- Packaging and Environmental 332-ball caBGA (17 mm × 17 mm) surface-mount package, RoHS compliant, designed for industrial-grade operation from -40 °C to 100 °C with a supply range of 2.375 V to 3.465 V.
Typical Applications
- System Control and Glue Logic Programmable logic and on-chip flash make it suitable for replacing fixed glue logic and implementing system control tasks with in-field update capability.
- Interface Bridging and Protocol Adaptation Wide-ranging programmable I/O standards and dedicated DDR/I/O gearing support make the device useful for interfacing between disparate peripherals and memory interfaces.
- Low-Power Standby Functions Ultra-low standby power and power-saving modes support always-on supervisory logic and power-managed subsystems.
- Embedded Memory and Buffering Embedded block RAM and distributed RAM provide on-chip buffering for data flow control, FIFOs and small data storage without external SRAM.
Unique Advantages
- Highly Integrated Non-Volatile Logic: On-chip user flash and instant-on architecture eliminate the need for external configuration memory and enable secure, single-chip solutions.
- Wide I/O Standard Support: Programmable sysIO buffer and differential I/O options reduce the need for external level translators and simplify board design.
- Low Standby Power: Advanced 65 nm process and power-saving modes lower system idle power, beneficial for energy-conscious designs.
- Robust Industrial Operation: Rated for -40 °C to 100 °C operation and RoHS compliant, suitable for industrial environments requiring extended temperature performance.
- Field Update and Background Programming: TransFR reconfiguration and background programming allow in-field logic updates with minimal system disruption.
- Compact High-Density Packaging: 332-ball caBGA (17 × 17 mm) provides high I/O count in a compact footprint for space-constrained systems.
Why Choose LCMXO2-7000HC-4BG332I?
The LCMXO2-7000HC-4BG332I delivers a balanced combination of programmable logic capacity, embedded memory and flexible I/O in an industrial-grade, non-volatile FPGA. Its instant-on behavior, on-chip user flash and extensive system-level features make it well suited to products that require reliable, field-updatable logic and broad interface support without external configuration components.
This device is ideal for design teams implementing system control, interface bridging and low-power supervisory functions who need a compact, high-I/O solution with proven reconfiguration and memory features. The MachXO2 family ecosystem and on-chip peripherals provide scalability and long-term flexibility for evolving product requirements.
Request a quote or submit an order inquiry for LCMXO2-7000HC-4BG332I to check availability, pricing and lead times.