LCMXO2-7000HC-4FTG256I

The LCMXO2-7000HC-4FTG256I is a MachXO2 family FPGA offering a flexible, non-volatile logic fabric with 6,864 logic elements and 206 user I/Os in a 256‑ball LBGA package. Designed for industrial applications, it combines embedded memory, on-chip user Flash and rich I/O programmability to support interface bridging, control and system glue logic in space- and power-constrained designs.

Its architecture emphasizes instant-on non-volatile configuration, low standby power options and a broad set of on-chip system functions to simplify system integration and reduce BOM complexity.

Key Features

• Core Logic  6,864 logic elements provide flexible LUT4-based logic resources for glue logic, control and protocol handling.
• Embedded Memory  Approximately 0.246 Mbits (245,760 bits) of on-chip RAM for distributed and block memory needs, plus family support for up to 240 kbits of embedded block RAM.
• On‑Chip User Flash (UFM)  Non-volatile user Flash memory (up to 256 kbits per family documentation) for configuration storage and in-field updates; specified for 100,000 write cycles and accessible via JTAG, SPI and I²C interfaces.
• I/O Capability  206 I/Os with programmable sysIO buffers supporting multiple standards (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, PCI, LVDS, Bus‑LVDS, MLVDS, RSDS, LVPECL, SSTL, HSTL) and on-chip differential termination and DDR registers in I/O cells.
• Clocking and PLLs  Up to eight primary clocks and two analog PLLs per device (family capability) with fractional‑n synthesis and wide input frequency range for flexible timing architectures.
• Power and Supply  Single supply operation across 2.375 V to 3.465 V and ultra-low power design options including standby modes to minimize idle power consumption.
• Reliability & System Support  Instant-on non-volatile operation, TransFR in-field reconfiguration, IEEE 1149.1 boundary scan and hardened system functions (SPI, I²C, timer/counter, on-chip oscillator).
• Package & Environmental  256-LBGA (supplier 256-FTBGA, 17×17 mm) surface-mount package; industrial grade with operating range of −40 °C to 100 °C and RoHS compliance.

Typical Applications

• Industrial Control  Use for control logic, protocol conversion and I/O aggregation where industrial temperature range and non-volatile configuration are required.
• Interface Bridging  Ideal for bridging disparate interfaces and implementing custom glue logic thanks to programmable sysIO buffers and abundant I/O options.
• Display and Source‑Synchronous I/O  Supports DDR registers in I/O cells and gearing for display interfaces, enabling source-synchronous and high-speed I/O implementations.
• System Management and Security  On-chip user Flash and background programming via JTAG/SPI/I²C allow secure configuration storage and field updates without added external flash.

Unique Advantages

• Non‑volatile, instant-on logic:  Device powers up in microseconds with single-chip configuration, removing the need for external configuration PROM in many designs.
• High I/O density in a compact package:  206 I/Os in a 256-ball LBGA (17×17 mm) package provides a dense I/O footprint while minimizing board area.
• Embedded memory and UFM:  Embedded RAM combined with up to 256 kbits of user Flash enables local buffering, state retention and in-field update capability without extra components.
• Flexible voltage and temperature operation:  Supports a wide supply range (2.375–3.465 V) and industrial operating temperatures (−40 °C to 100 °C) for robust deployment.
• Rich system-level features:  On-chip SPI/I²C, timers, oscillator and boundary-scan support simplify design and validate integration during development and production.

Why Choose LCMXO2-7000HC-4FTG256I?

The LCMXO2-7000HC-4FTG256I positions itself as a compact, non‑volatile FPGA suited for industrial designs that need significant I/O, embedded memory and instant-on configurability. Its combination of 6,864 logic elements, extensive I/O programmability and on-chip user Flash reduces external component count and streamlines system architecture.

This part is well suited to engineers building control, interface and system-management functions who require a single-chip, reconfigurable solution with industrial temperature capability, broad voltage support and on-board system features that accelerate development and field updates.

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