LCMXO2-7000HC-4TG144I

IC FPGA 114 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 114 245760 6864 144-LQFP

Quantity 1,071 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O114Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HC-4TG144I – MachXO2 FPGA, 6,864 logic elements, 114 I/O, 144‑LQFP

The LCMXO2-7000HC-4TG144I is a MachXO2 family field programmable gate array (FPGA) provided in a 144‑pin LQFP package for surface‑mount applications. It integrates 6,864 logic elements, 114 general‑purpose I/Os and on‑chip non‑volatile memory to deliver instant‑on, reconfigurable logic in industrial environments.

Built for low standby power and flexible I/O, this device targets applications that require compact, non‑volatile FPGA capability with broad voltage and temperature operating ranges (2.375 V to 3.465 V and −40 °C to 100 °C).

Key Features

  • Core Logic — 6,864 logic elements provide a flexible LUT4‑based architecture suitable for glue logic, control tasks and small to mid‑density FPGA designs.
  • Embedded and Distributed Memory — Total on‑chip RAM: 245,760 bits. The MachXO2 family also documents up to approximately 240 kbits of embedded block RAM and up to 54 kbits of distributed RAM for buffering and small data structures.
  • On‑chip User Flash (UFM) — Family supports up to 256 kbits of user flash memory for configuration and data storage; UFM is accessible through standard interfaces and supports background programming.
  • Flexible I/O — 114 I/Os with programmable sysIO buffers supporting a wide range of standards (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, LVDS, Bus‑LVDS, MLVDS, RSDS, LVPECL, SSTL, HSTL and others) and programmable pull modes and on‑chip differential termination.
  • High‑performance I/O and Memory Interfaces — Pre‑engineered source synchronous I/O with DDR registers, dedicated gearing logic and support for generic DDR modes and dedicated DDR/DDR2/LPDDR memory interfaces (family feature).
  • Low Power Operation — Advanced low power process with standby modes; family data cites standby power as low as 22 μW and programmable power saving options.
  • Clocking and PLLs — Up to eight primary clocks and up to two analog PLLs per device for fractional‑n frequency synthesis and wide input frequency support (family feature).
  • Non‑volatile, Reconfigurable — Instant‑on, single‑chip non‑volatile FPGA architecture with TransFR™ in‑field reconfiguration and support for JTAG, SPI and I2C programming interfaces (family features).
  • Hardened System Functions — On‑chip SPI, I2C, timer/counter and an internal oscillator (family features) help reduce external component count.
  • Package and Environmental — 144‑pin LQFP package (supplier package listed as 144‑TQFP 20×20), surface‑mount mounting, industrial grade operation from −40 °C to 100 °C, RoHS compliant.

Typical Applications

  • Industrial Control and Automation — Instant‑on, reconfigurable logic and industrial temperature rating make this device suitable for control logic, interlocks and supervisory functions in industrial systems.
  • Interface Bridging and I/O Expansion — Flexible sysIO and broad protocol support enable bridging between different logic levels and expanding I/O within embedded systems.
  • Display and Memory Interfaces — Pre‑engineered source synchronous I/O, DDR gearing and dedicated memory interface features support display timing and external memory buffering (family capabilities).
  • System Configuration and Security — On‑chip user flash and background programming support configuration storage, field updates and secure boot architectures.

Unique Advantages

  • Non‑volatile, instant‑on operation: Single‑chip flash‑based FPGA architecture enables immediate startup without external configuration memory.
  • High I/O flexibility: 114 programmable I/Os with on‑chip termination and multiple supported standards simplify mixed‑signal and mixed‑voltage board designs.
  • Compact industrial packaging: 144‑pin LQFP surface‑mount package provides a small footprint with industrial temperature range for reliable deployment.
  • Reduced system BOM: Hardened peripherals (SPI, I2C, timers, oscillator) and on‑chip flash reduce the need for external components and simplify PCB layout.
  • Field update capability: TransFR in‑field reconfiguration and background programming enable in‑service logic updates and long‑term flexibility.
  • Wide supply voltage range: Operates from 2.375 V to 3.465 V, supporting systems designed around common single‑supply rails.

Why Choose LCMXO2-7000HC-4TG144I?

The LCMXO2-7000HC-4TG144I balances mid‑density logic resources with extensive I/O flexibility and on‑chip non‑volatile memory, making it well suited for industrial and embedded designs that require instant‑on reconfigurability and reduced external components. Its industrial temperature rating, surface‑mount 144‑pin package, and low power standby options provide practical advantages for robust, space‑constrained systems.

This part is appropriate for engineers seeking a single‑chip, reconfigurable solution that combines logic, memory and system functions—enabling scalable designs that can be updated in the field while minimizing board complexity.

Request a quote or submit a purchase inquiry to obtain pricing, availability and ordering information for the LCMXO2-7000HC-4TG144I.

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