LCMXO2-7000HC-5BG332I

The LCMXO2-7000HC-5BG332I is an industrial-grade MachXO2 FPGA from Lattice Semiconductor Corporation. It provides a flexible logic architecture with 6,864 logic elements, approximately 245,760 bits of embedded RAM, and 278 programmable I/O pins for system control, interface bridging and embedded logic functions.

Designed for applications requiring non-volatile instant-on capability, in-field reconfiguration and a wide operating range, this device combines on-chip memory, a versatile I/O subsystem and compact BGA packaging for space-constrained, industrial environments.

Key Features

• Logic Resources  6,864 logic elements (LUT4-based architecture) provide programmable combinational and sequential logic capacity for glue logic, protocol adaptation and custom control functions.
• Embedded Memory  Approximately 245,760 bits of on-chip RAM provide system memory for FIFOs, buffers and small data stores required by embedded applications.
• I/O Flexibility  278 I/O pins with programmable sysIO buffer options and support for multiple interface standards enable a wide range of serial and parallel interfacing.
• Non-volatile and Reconfigurable  MachXO2 family features include on-chip user flash and instant-on capability with support for background programming and in-field TransFR reconfiguration.
• Power and Low-Power Modes  Family-level low-power architecture (65 nm process) includes standby and other power-saving options, suitable for energy-conscious applications.
• Clocking and PLLs  Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs (fractional‑n synthesis) supports varied timing domains and high-speed I/O requirements.
• Hardened System Functions  Integrated functions such as SPI, I2C and timer/counter reduce external component count and simplify system design.
• Package and Temperature  332-ball FBGA package (supplier device package: 332-CABGA, 17 × 17 mm) in a surface-mount form factor; industrial operating temperature range of -40°C to 100°C and single-supply operation across 2.375 V to 3.465 V.
• Standards & Reliability  Supports IEEE 1149.1 boundary scan and IEEE 1532 in-system programming; RoHS compliant.

Typical Applications

• Industrial Control  Implements deterministic control logic, state machines and interface translation in factory automation and process-control systems operating across -40°C to 100°C.
• System Glue & Interface Bridging  Serves as a compact, reprogrammable bridge between legacy buses and modern interfaces, leveraging plentiful I/O and flexible sysIO standards.
• Embedded Peripherals & Sensor Aggregation  Consolidates SPI/I2C peripherals, timers and custom preprocessing in sensor hubs and monitoring modules.
• Display and Memory Interfaces  Supports source-synchronous I/O and DDR gearing options for display controllers and memory-interface logic where pre‑engineered I/O timing helps simplify design.

Unique Advantages

• High integration in a single device:  6,864 logic elements combined with approximately 245,760 bits of embedded RAM reduce the need for external glue logic and discrete memories.
• Industrial temperature capability:  Rated for -40°C to 100°C, enabling deployment in harsh environments without additional thermal qualification steps.
• Flexible I/O and interface support:  Programmable sysIO and a large I/O count (278 pins) accommodate a broad set of standards and mixed-signal connection requirements.
• Non-volatile instant-on and in-field updates:  On-chip user flash and TransFR reconfiguration enable secure instant-on operation and background programming for field updates.
• Reduced BOM and simpler timing design:  Hardened peripherals (SPI, I2C, timers) and dedicated DDR/gear logic cut component count and simplify signal timing implementation.
• Compact, manufacturable package:  332-ball FBGA (332-CABGA supplier package) in a surface-mount form factor for dense PCB layouts.

Why Choose LCMXO2-7000HC-5BG332I?

The LCMXO2-7000HC-5BG332I positions itself as a compact, industrial-grade FPGA solution for designs that need moderate logic density, substantial on-chip RAM and a large number of configurable I/Os in a single package. Its combination of non-volatile instant-on behavior, in-field reconfiguration and hardened peripheral functions makes it well suited to embedded control, interface bridging and systems requiring reliable operation across a wide temperature and voltage range.

As part of the MachXO2 family, this device supports density migration and a range of family-level features—allowing designers to scale resources while maintaining common architectural advantages such as flexible I/O, low-power modes and integrated system functions.

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