LCMXO2-7000HC-5FTG256C

The LCMXO2-7000HC-5FTG256C is a MachXO2 family Field Programmable Gate Array (FPGA) in a 256-ball ftBGA package that combines flexible logic, abundant I/O and integrated non-volatile configuration memory. With 6,864 logic elements, approximately 245,760 bits (≈240 kbits) of on-chip RAM and 206 I/Os, this device is intended for applications requiring configurable logic, rich I/O support and in-field reconfiguration.

Key value propositions include instant-on non-volatile operation, programmable I/O standards, embedded memory and on-chip user flash, enabling system integration and design flexibility in commercial-grade embedded systems.

Key Features

• Core Logic  6,864 logic elements provide programmable LUT4-based logic fabric for glue logic, control functions and custom datapaths.
• On-chip RAM  Approximately 245,760 bits of embedded RAM for data buffering and local storage; includes both embedded block RAM and distributed RAM options in the MachXO2 family.
• On-Chip User Flash (UFM)  Up to 256 kbits of user flash memory for configuration storage and field-updateable code; supports 100,000 write cycles and multiple access interfaces.
• High-Performance I/O  206 I/Os with programmable sysIO buffer supporting a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, MLVDS, RSDS, LVPECL, SSTL and HSTL.
• Source-Synchronous and DDR I/O  Pre-engineered source-synchronous I/O with DDR registers and dedicated gearing logic; supports generic DDR, DDRx2, DDRx4 and dedicated DDR/DDR2/LPDDR memory interfaces with DQS support.
• Low Power and Power Management  Built on an advanced 65 nm low-power process with standby power as low as 22 μW and programmable power-saving modes including standby.
• Clocking and PLLs  Flexible on-chip clocking with up to eight primary clocks, up to two edge clocks for high-speed I/O, and up to two analog PLLs with fractional‑n synthesis (7 MHz to 400 MHz input range).
• Non-volatile, Reconfigurable Operation  Instant-on, single-chip non-volatile configuration with background programming, JTAG/SPI/I2C programming interfaces and TransFR in-field reconfiguration capability.
• System-Level Features  On-chip hardened peripherals including SPI, I2C, timer/counter, an on-chip oscillator and IEEE 1149.1 boundary-scan support for system integration and debug.
• Package and Electrical  256-ball ftBGA (17 × 17 mm) surface-mount package; supply voltage range 2.375 V to 3.465 V and commercial operating temperature 0 °C to 85 °C.

Typical Applications

• Display Interfaces  Drive and manage display subsystems using dedicated gearing and DDR display I/O features for source-synchronous signaling and timing control.
• Memory Interface Bridging  Implement DDR/DDR2/LPDDR interface logic and buffering with dedicated DDR support and DQS-capable I/O.
• Interface Bridging and Glue Logic  Consolidate protocol translation, bus bridging and board-level glue logic using the programmable I/O standards and extensive logic resources.
• Field-Upgradeable System Control  Use on-chip UFM and TransFR reconfiguration to provide secure, updatable firmware and logic changes in deployed systems.
• Embedded Peripherals and Control  Leverage on-chip SPI, I2C, timers and oscillator for compact subsystem control and state management without external components.

Unique Advantages

• Instant-on, single-chip solution: Non-volatile configuration enables immediate startup and reduces external configuration components.
• High I/O density and versatility: 206 programmable I/Os support a wide range of industry signaling standards, minimizing the need for level translators and external buffers.
• Integrated non-volatile storage: On-chip user flash (UFM) stores configuration and firmware with high endurance for in-field updates.
• Flexible memory and clocking: Embedded block RAM, distributed RAM and multiple PLLs provide local buffering and precise clock management for diverse system requirements.
• Low standby power: Advanced process technology and programmable power modes enable low-power system standby operation.
• Compact, surface-mount packaging: 256-ball ftBGA (17 × 17) provides a high-density footprint for space-constrained board designs.

Why Choose LCMXO2-7000HC-5FTG256C?

The LCMXO2-7000HC-5FTG256C positions itself as a flexible, integrated FPGA solution for commercial embedded systems that need a combination of moderate logic capacity, abundant and versatile I/O, on-chip non-volatile memory and low-power operation. Its blend of on-chip RAM, user flash and pre-engineered I/O options makes it suitable for designs requiring instant-on behavior, field upgradeability and a reduced external component count.

This device is well suited to engineers designing display controllers, memory interface logic, protocol bridges and compact control subsystems where compact packaging, programmable I/O standards and in-field reconfiguration are priorities.

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