LCMXO2-7000HC-5FG484I

The LCMXO2-7000HC-5FG484I is a MachXO2 family FPGA IC featuring 6,864 logic elements and up to 334 I/O pins in a 484-ball BGA (23 × 23 mm) package. Intended for industrial-grade applications, the device combines flexible logic architecture, non-volatile on-chip flash, and extensive I/O programmability for system glue logic, interface bridging, and control functions.

Built for low-power, instant-on operation with broad I/O support and embedded memory, this device suits designs that require high I/O density, in-field configurability, and a wide operating temperature range.

Key Features

• Core Logic — 6,864 logic elements (cells) providing the capacity to implement complex glue logic, protocol adapters, and control functions.
• I/O Density & Flexibility — 334 I/Os in the 484-BBGA package; programmable sysIO buffer options and support for a wide range of interfaces enable flexible signal standards and hot-socketing capability.
• Embedded and Distributed Memory — Approximately 245,760 bits (≈240 kbits) of embedded block RAM and up to 54 kbits of distributed RAM, plus dedicated FIFO control logic for buffering and data streams.
• On-Chip User Flash — Up to 256 kbits of user flash memory for non-volatile configuration and in-field updates; supports background programming and up to 100,000 write cycles.
• Low Power Operation — Advanced low-power process technology with standby modes; family-level standby power as low as 22 μW and programmable power-saving options.
• Clocking and PLLs — Multiple on-chip clocks and up to two analog PLLs per device for fractional-N frequency synthesis and flexible timing architectures.
• Source-Synchronous & DDR I/O — Pre-engineered source-synchronous I/O with DDR registers in I/O cells and dedicated gearing logic for display and high-speed interfaces.
• Packaging & Temperature Range — 484-BBGA (23 × 23 mm) package; industrial grade with operating temperature range from −40 °C to 100 °C and RoHS compliance.
• Reconfiguration & Security — Non-volatile, instant-on configuration with in-field TransFR reconfiguration capabilities and support for secure single-chip operation.

Typical Applications

• Industrial Control — Use the device for I/O consolidation, protocol translation, and real-time control logic in industrial systems, benefiting from industrial temperature rating and high I/O count.
• Communications & Networking — Implement interface bridging, timing adaptation, and buffering with the device’s DDR-ready I/O, embedded FIFO logic, and multiple clock resources.
• Display & Video Systems — Leverage pre-engineered source-synchronous I/O and gearing logic for display interfaces and parallel data streams.
• Instrumentation & Test — Employ reconfigurable logic, abundant I/Os, and on-chip non-volatile memory for adaptable test systems and measurement front-ends.

Unique Advantages

• High I/O Count in a Compact Package: 334 I/Os in a 484-ball BGA deliver dense connectivity for multi-interface applications while keeping PCB footprint manageable.
• Non-Volatile Instant-On: On-chip user flash enables secure, instant-on configuration and background programming for minimal system boot time and simpler supply chains.
• Integrated Memory Resources: Approximately 240 kbits of embedded RAM plus distributed RAM and FIFO logic reduce external-memory dependencies for buffering and state retention.
• Flexible Clocking and PLLs: Multiple primary clocks and up to two analog PLLs provide the timing versatility required for mixed-rate interfaces and precise frequency control.
• Industrial Reliability: Industrial-grade temperature range (−40 °C to 100 °C) and RoHS compliance support deployment in demanding environments.

Why Choose LCMXO2-7000HC-5FG484I?

This MachXO2 FPGA IC balances high I/O density, significant on-chip memory, and non-volatile configuration in a single industrial-grade package. It is well-suited to designs that need instant-on behavior, field reconfiguration, and flexible I/O signaling without adding external configuration memory or complex power domains.

Choose this device for mid- to high-density glue logic, interface bridging, display timing, and control subsystems where integration, configuration flexibility, and a wide operating temperature range deliver long-term design scalability and robustness.

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