LCMXO2-7000HC-5BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA

Quantity 815 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000HC-5BG256I – MachXO2 Field Programmable Gate Array (FPGA), 6864 logic elements, 206 I/Os

The LCMXO2-7000HC-5BG256I is a MachXO2 family Field Programmable Gate Array (FPGA) in a 256-ball BGA package designed for industrial-grade embedded designs. It combines flexible logic, substantial on-chip memory, and a high I/O count to address control, interface and system integration tasks that require low power and reconfigurability.

This device provides up to 6,864 logic elements, approximately 246 kbits of total on-chip RAM, and 206 I/Os, along with single-chip nonvolatile configuration options and multiple power and clock management features to support robust, field-updateable systems.

Key Features

  • Core Logic  6,864 logic elements (cells) for implementing glue logic, control functions and moderate-density FPGA designs.
  • On‑chip Memory  Approximately 245,760 bits of total RAM (embedded and distributed) and on-chip user Flash Memory options per the MachXO2 family data sheet for code and configuration storage.
  • I/O Capacity & Flexibility  206 general-purpose I/Os with programmable sysIO buffer support across a wide range of interface standards, including differential and single‑ended signaling modes described in the family data sheet.
  • Package & Mounting  256-ball package (256-LFBGA; supplier package: 256-CABGA, 14 mm × 14 mm) with surface-mount mounting for compact board-level integration.
  • Power & Voltage  Single power-supply operation across a 2.375 V to 3.465 V range and family-level low-power features including ultra-low standby options.
  • Industrial Temperature Grade  Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
  • Reconfiguration & Nonvolatile Storage  On-chip user Flash memory and TransFR in-field reconfiguration capability for secure, background updates and instant-on behavior as described for the MachXO2 family.
  • Clocking & PLLs  Multiple primary clocks and up to two analog PLLs with wide input frequency support for flexible clocking and high-speed I/O timing (family-level capability).
  • System-Level Functions  Hardened peripherals and support including SPI, I2C and timer/counter, plus JTAG and IEEE boundary-scan for system test and programming (family-level features).
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Industrial-grade temperature range and flexible I/O make this device suitable for control logic, sensor interfacing and automation subsystems.
  • Interface Bridging & System Glue  High I/O count and programmable I/O standards enable protocol conversion, bus bridging and board-level integration tasks.
  • Memory and Display Interfaces  Dedicated I/O gears and DDR-friendly I/O cells described in the family data sheet support source-synchronous and DDR-type interfaces for displays and external memory.
  • Embedded Control with Field Updates  On-chip user Flash and TransFR reconfiguration allow firmware and logic updates in the field without full system downtime.

Unique Advantages

  • Highly integrated logic and memory: Combines 6,864 logic elements with approximately 246 kbits of on-chip RAM and on-chip user Flash for compact system designs.
  • Flexible, programmable I/O: 206 I/Os and family-level sysIO support for a wide range of signaling standards reduce external interface components.
  • Industrial reliability: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
  • Field reprogrammability: On-chip Flash and TransFR reconfiguration support in-field logic updates and background programming workflows.
  • Low-power options: Family-level low-power architecture and standby modes help minimize system power consumption.
  • Single-supply simplicity: Operates across a 2.375 V to 3.465 V supply range to simplify power-rail design.

Why Choose LCMXO2-7000HC-5BG256I?

The LCMXO2-7000HC-5BG256I positions itself as a versatile, industrial-grade FPGA option within the MachXO2 family, delivering a balance of logic density, on-chip memory and extensive I/O in a compact 256-ball BGA footprint. Its combination of nonvolatile configuration, field reconfiguration capability, and hardened system interfaces makes it well suited for designers who need reconfigurable logic with reliable operation across a wide temperature range.

Choose this device when your design requires a single-chip solution that integrates moderate FPGA capacity, robust I/O flexibility and on-board memory for configuration and runtime functions—helping reduce BOM complexity while enabling field updates and system-level features described in the MachXO2 family data sheet.

Request a quote or submit an inquiry to get pricing and availability for the LCMXO2-7000HC-5BG256I. Provide your quantity and delivery requirements to receive a prompt response.

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