LCMXO2-7000HE-6FG484I

The LCMXO2-7000HE-6FG484I is a MachXO2 family FPGA offering a flexible, non-volatile programmable fabric targeted at industrial and embedded designs. This device integrates up to 6864 logic elements, approximately 245,760 bits of on-chip RAM, and 334 I/Os in a 484-ball BBGA package, enabling dense I/O and mid-range logic integration in a single-chip solution.

Designed for applications that require low standby power, reliable operation across a wide temperature range, and in-field reconfiguration, this MachXO2 device provides a balance of logic density, memory, and programmable I/O for system control, interface bridging, and display or memory interface applications.

Key Features

• Logic Core — Up to 6864 logic elements (LUT4-based architecture) for implementing glue logic, state machines, and mid-density programmable logic functions.
• Embedded and Distributed Memory — Approximately 245,760 bits of embedded block RAM plus distributed RAM resources for data buffering, FIFOs, and small working storage.
• On-Chip User Flash (UFM) — Non-volatile user Flash memory (up to 256 kbits) for configuration storage and application data with support for background programming.
• Flexible I/O — 334 I/Os with programmable sysIO buffers supporting a wide range of interfaces and on-chip differential termination; I/O features include DDR registers, programmable pull-up/pull-down, and hot-socketing support.
• Pre-Engineered Source-Synchronous I/O — Dedicated DDR registers and gearing logic, with support for generic DDR modes and dedicated DDR/DDR2/LPDDR memory interfaces with DQS support.
• Low Power — Advanced low-power process with standby power as low as 22 μW and multiple power-saving modes.
• Clocking and PLLs — Up to eight primary clocks, two edge clocks for high-speed I/O, and up to two analog PLLs with fractional-N synthesis and wide input frequency range.
• System Functions — Hardened I2C, SPI and timer/counter blocks, on-chip oscillator, TraceID for system tracking, and support for JTAG/SPI/I2C programming and boundary scan.
• Reconfiguration — Instant-on, non-volatile single-chip configuration with TransFR in-field reconfiguration and optional dual-boot with external SPI memory.
• Industrial Grade Packaging and Range — Surface-mount 484-BBGA package (484-FBGA, 23 × 23 mm) and industrial operating temperature from −40 °C to 100 °C; single power supply operation with an extended supply range of 1.14 V to 1.26 V.

Typical Applications

• Industrial Control — I/O aggregation, protocol bridging, and real-time control functions where non-volatile configuration and industrial temperature operation are required.
• Display and Video Interfaces — Pre-engineered display gearing and DDR I/O support for driving or interfacing with display panels and LVDS/RSDS signaling.
• Memory Interface and Buffering — Dedicated DDR/DDR2/LPDDR memory interface features and embedded RAM for memory controllers, buffering, and data path acceleration.
• Embedded System Glue Logic — Platform control, boot management, and peripheral interfacing using on-chip UFM, timers, SPI/I2C, and instant-on capability.
• Field Upgradeable Systems — Devices that require in-field logic updates and background programming via TransFR and standard serial or JTAG interfaces.

Unique Advantages

• High I/O Density: 334 programmable I/Os in a 484-ball package allow consolidation of multiple interface functions onto a single device.
• Non-Volatile Instant-On: On-chip user Flash delivers secure, single-chip configuration with immediate startup and background programming support.
• Low Standby Power: Advanced low-power process technology delivers standby power as low as 22 μW, helping reduce overall system power consumption.
• Rich Memory Resources: Approximately 245,760 bits of embedded RAM plus distributed RAM provide on-chip storage for FIFOs, buffers, and state data without external SRAM.
• Flexible, Hardened Peripherals: Built-in SPI, I2C, timers and oscillator reduce external component count and simplify system design.
• Industrial Reliability: Specified for −40 °C to 100 °C operation and supplied in surface-mount BGA packaging suitable for industrial applications.

Why Choose LCMXO2-7000HE-6FG484I?

The LCMXO2-7000HE-6FG484I balances mid-range logic capacity with extensive on-chip memory and a large, flexible I/O complement to address industrial and embedded design challenges. Its non-volatile instant-on configuration, built-in peripherals, and low standby power make it suitable for systems that need reliable boot behavior, in-field updates, and compact BOMs.

This MachXO2 device is ideal for engineers seeking a single-chip solution for interface consolidation, display or memory interfacing, and control-plane logic in industrial temperature environments. The combination of programmable I/O standards, embedded memory, and reconfiguration features supports scalable designs and long-term maintainability.

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