LCMXO2-7000HE-6FTG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LBGA |
|---|---|
| Quantity | 1,138 Available (as of May 26, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000HE-6FTG256I – MachXO2 FPGA, 6,864 Logic Elements, 256-LBGA
The LCMXO2-7000HE-6FTG256I is a MachXO2 family field programmable gate array (FPGA) IC designed for industrial applications that require flexible logic, non-volatile configuration and low-power operation. The device combines a flexible logic architecture with embedded memory and user flash to support system control, interface bridging and in-field updates.
Key value propositions include a high logic density (6,864 logic elements), substantial on-chip RAM (approximately 240 kbits), a large I/O count (206 pins), and industrial-grade operating range—making it suitable for robust embedded systems and control electronics.
Key Features
- Core Logic 6,864 logic elements provide programmable LUT-based logic resources for glue logic, finite-state machines and custom accelerators.
- Embedded and Distributed Memory Total on-chip RAM of 245,760 bits (approximately 240 kbits) for data buffering and system state. The MachXO2 family also supports on-chip user flash memory up to 256 kbits for non-volatile storage and configuration.
- I/O and Interfaces 206 I/O pins in a 256-LBGA package support a wide range of interface requirements and system-level connectivity.
- Power Single-supply operation in the specified range of 1.14 V to 1.26 V supports system designs requiring a regulated low-voltage core supply.
- Package and Mounting 256-LBGA package (supplier package: 256-FTBGA, 17×17 mm) optimized for surface-mount assembly.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
- System Features Family-level capabilities include instant-on configuration, in-field reconfiguration (TransFR), multiple programming interfaces (JTAG, SPI, I²C) and IEEE boundary-scan support—enabling flexible provisioning and updates.
- Compliance RoHS compliant to meet environmental and regulatory requirements.
Typical Applications
- Industrial Control Implement motor control logic, sequencing, and machine interface functions using available logic elements and embedded RAM within the industrial temperature range.
- Interface Bridging and Glue Logic Consolidate multiple interface standards and perform protocol adaptation with up to 206 I/Os and programmable I/O buffering.
- System Configuration and Boot Management Use on-chip user flash and background programming capabilities for secure boot, dual-boot configurations and field-upgradeable firmware storage.
- Peripheral and Display Support Leverage distributed RAM and dedicated I/O gearing features (family-level) for timing-critical peripheral interfaces and display timing control.
Unique Advantages
- High Logic Density: 6,864 logic elements deliver ample programmable resources for medium-complexity designs without external ASICs or CPLDs.
- Substantial On-Chip Memory: Approximately 240 kbits of embedded RAM plus up to 256 kbits of on-chip user flash enable local data buffering and non-volatile storage, reducing external memory needs.
- Large I/O Count in Compact Package: 206 I/Os in a 256-LBGA (17×17 mm) package simplify high-density connectivity while maintaining a small PCB footprint.
- Industrial Reliability: Rated for −40 °C to 100 °C operation and RoHS compliant—suitable for industrial system deployments.
- Flexible System Integration: Support for JTAG, SPI and I²C configuration and family-level features such as instant-on and TransFR reconfiguration enable streamlined manufacturing and field updates.
Why Choose LCMXO2-7000HE-6FTG256I?
This MachXO2 part balances high logic capacity, on-chip memory and extensive I/O in an industrial-grade package, making it a practical choice for embedded designers who need flexible system control, interface consolidation and field-update capability. Its combination of non-volatile configuration, in-field reconfiguration features and RoHS compliance supports long-term, maintainable designs.
Designers targeting industrial control, interface bridging, configuration management or compact high-I/O systems will find the LCMXO2-7000HE-6FTG256I well suited to reduce BOM complexity while retaining reprogrammability and on-board non-volatile options.
Request a quote or submit an inquiry to receive pricing and availability information for LCMXO2-7000HE-6FTG256I and support for your design requirements.
