LCMXO2280C-4FT324C

IC FPGA 271 I/O 324FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA

Quantity 673 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FTBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LBGANumber of I/O271Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-4FT324C – MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA

The LCMXO2280C-4FT324C is a MachXO family non-volatile FPGA designed for glue logic, bus bridging, power-up control and system control applications. It combines a dense complement of logic elements with on-chip RAM and a high I/O count to deliver a compact, single-chip programmable solution.

Built around the MachXO architecture, this device supports instant-on non-volatile operation, in-field reconfiguration, and a flexible programmable I/O buffer set. It targets commercial embedded and system designs that require fast startup, secure single-chip configuration, and moderate logic and memory capacity.

Key Features

  • Logic Core — 2,280 logic elements (as provided) suitable for glue logic, control state machines, and bus interfacing implementations.
  • On-chip Memory — Total on-chip RAM: 28,262 bits, implemented as embedded block RAM and distributed RAM to support FIFOs, small data buffers and control state storage.
  • I/O Density — 271 user I/Os in a high-density package, enabling broad peripheral, bus and interface connectivity.
  • Programmable I/O Standards — Flexible sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS interfaces (per MachXO family specification).
  • Non‑volatile, Instant‑on Architecture — Single-chip non-volatile configuration with no external configuration memory required and quick power-up behavior (family capability).
  • In-field Reconfiguration — Supports TransFR reconfiguration for in-system updates while the system operates (family capability).
  • Clocking — Up to two analog PLLs available in the family for clock multiply/divide and phase shifting (family capability).
  • Power and Supply Range — Operates across a wide voltage supply range: 1.71 V to 3.465 V, allowing multi-voltage system integration.
  • Package & Mounting — Available in a 324-ball LBGA footprint; supplier device package listed as 324-FTBGA (19 × 19 mm). Surface-mount package case.
  • Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for commercial applications.
  • Standards & Reliability — RoHS compliant (lead-free) packaging (per product data).

Typical Applications

  • Glue Logic & Bus Interfacing — Implement address decoding, bus bridging and protocol translation with the device’s logic and high I/O count.
  • System Control & Power Sequencing — Use non-volatile instant-on behavior for power-up control, reset sequencing and supervisory logic.
  • Peripheral Aggregation — Aggregate and buffer multiple sensor, UART, SPI, I2C or custom interfaces using abundant I/O and on-chip RAM for small FIFOs.
  • Field-updateable Logic — Apply in-field logic updates and background non-volatile programming to evolve system behavior without replacing hardware.

Unique Advantages

  • Single‑chip Non‑volatile Configuration: Eliminates the need for external configuration memory, simplifying BOM and improving system security.
  • High I/O per Logic Density: 271 I/Os paired with 2,280 logic elements provide flexibility to connect many peripherals without a larger, more costly device.
  • Flexible I/O Standards: Programmable I/O buffer support for multiple signaling standards reduces the need for external level translators or interface chips.
  • Compact, Surface‑Mount Package: 324-ball LBGA (324-FTBGA supplier package) enables dense board designs with a small footprint.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for typical embedded and consumer applications.
  • RoHS Compliant: Lead‑free packaging supports environmentally conscious product designs.

Why Choose LCMXO2280C-4FT324C?

The LCMXO2280C-4FT324C offers a balanced combination of logic capacity, on-chip memory and high I/O density in a single non-volatile FPGA package. It is well suited to designers who need instant-on operation, flexible interface options and the ability to perform in-field updates without adding external configuration components.

This device is ideal for commercial embedded systems that require compact, reconfigurable control logic, extensive peripheral interfacing, and simplified system-level design. Its broad supply voltage range and RoHS-compliant package further enhance integration and manufacturability.

Request a quote or submit your specifications to receive pricing and availability for the LCMXO2280C-4FT324C. Our team will provide a prompt response to support your procurement and design timelines.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up