LCMXO2280C-4FT324C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA |
|---|---|
| Quantity | 673 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FTBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 271 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-4FT324C – MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA
The LCMXO2280C-4FT324C is a MachXO family non-volatile FPGA designed for glue logic, bus bridging, power-up control and system control applications. It combines a dense complement of logic elements with on-chip RAM and a high I/O count to deliver a compact, single-chip programmable solution.
Built around the MachXO architecture, this device supports instant-on non-volatile operation, in-field reconfiguration, and a flexible programmable I/O buffer set. It targets commercial embedded and system designs that require fast startup, secure single-chip configuration, and moderate logic and memory capacity.
Key Features
- Logic Core — 2,280 logic elements (as provided) suitable for glue logic, control state machines, and bus interfacing implementations.
- On-chip Memory — Total on-chip RAM: 28,262 bits, implemented as embedded block RAM and distributed RAM to support FIFOs, small data buffers and control state storage.
- I/O Density — 271 user I/Os in a high-density package, enabling broad peripheral, bus and interface connectivity.
- Programmable I/O Standards — Flexible sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS interfaces (per MachXO family specification).
- Non‑volatile, Instant‑on Architecture — Single-chip non-volatile configuration with no external configuration memory required and quick power-up behavior (family capability).
- In-field Reconfiguration — Supports TransFR reconfiguration for in-system updates while the system operates (family capability).
- Clocking — Up to two analog PLLs available in the family for clock multiply/divide and phase shifting (family capability).
- Power and Supply Range — Operates across a wide voltage supply range: 1.71 V to 3.465 V, allowing multi-voltage system integration.
- Package & Mounting — Available in a 324-ball LBGA footprint; supplier device package listed as 324-FTBGA (19 × 19 mm). Surface-mount package case.
- Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for commercial applications.
- Standards & Reliability — RoHS compliant (lead-free) packaging (per product data).
Typical Applications
- Glue Logic & Bus Interfacing — Implement address decoding, bus bridging and protocol translation with the device’s logic and high I/O count.
- System Control & Power Sequencing — Use non-volatile instant-on behavior for power-up control, reset sequencing and supervisory logic.
- Peripheral Aggregation — Aggregate and buffer multiple sensor, UART, SPI, I2C or custom interfaces using abundant I/O and on-chip RAM for small FIFOs.
- Field-updateable Logic — Apply in-field logic updates and background non-volatile programming to evolve system behavior without replacing hardware.
Unique Advantages
- Single‑chip Non‑volatile Configuration: Eliminates the need for external configuration memory, simplifying BOM and improving system security.
- High I/O per Logic Density: 271 I/Os paired with 2,280 logic elements provide flexibility to connect many peripherals without a larger, more costly device.
- Flexible I/O Standards: Programmable I/O buffer support for multiple signaling standards reduces the need for external level translators or interface chips.
- Compact, Surface‑Mount Package: 324-ball LBGA (324-FTBGA supplier package) enables dense board designs with a small footprint.
- Commercial Temperature Range: Rated 0 °C to 85 °C for typical embedded and consumer applications.
- RoHS Compliant: Lead‑free packaging supports environmentally conscious product designs.
Why Choose LCMXO2280C-4FT324C?
The LCMXO2280C-4FT324C offers a balanced combination of logic capacity, on-chip memory and high I/O density in a single non-volatile FPGA package. It is well suited to designers who need instant-on operation, flexible interface options and the ability to perform in-field updates without adding external configuration components.
This device is ideal for commercial embedded systems that require compact, reconfigurable control logic, extensive peripheral interfacing, and simplified system-level design. Its broad supply voltage range and RoHS-compliant package further enhance integration and manufacturability.
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