LCMXO2280C-4FTN256I

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA

Quantity 737 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-4FTN256I – MachXO FPGA, 2,280 Logic Elements, 211 I/Os, 256-LBGA

The LCMXO2280C-4FTN256I is a non-volatile MachXO field programmable gate array (FPGA) offered in a 256-ball LBGA package. It combines instant-on, single-chip configuration with SRAM-based reconfigurability and an array of programmable I/Os to address glue logic, bus interfacing, control logic and other system integration tasks.

Designed for industrial environments, this device provides 2,280 logic elements, 28,262 bits of on-chip RAM, up to two analog PLLs, and 211 available I/Os, delivering a balance of logic density, embedded memory and flexible I/O for mid-density embedded designs.

Key Features

  • Non-volatile, instant-on architecture – Single-chip configuration with no external configuration memory required and microsecond power-up behavior for fast system startup.
  • Logic resources – 2,280 logic elements for implementing mid-density glue logic, control and interfacing functions.
  • Embedded memory – 28,262 bits of total on-chip RAM (combining embedded and distributed memory) for data buffering, FIFOs and small working memories.
  • I/O capacity and flexibility – 211 I/Os available to support extensive signal interfacing and peripheral connectivity.
  • Clock management – Up to two analog PLLs per device for clock multiply, divide and phase adjustments.
  • Reconfiguration and programming – Supports in-field reconfiguration and background programming; JTAG programmability and TransFR reconfiguration enable logic updates while the system operates.
  • Power and voltage – Operates across a wide supply range (1.71 V to 3.465 V), enabling compatibility with multiple I/O and core voltage domains.
  • Low-power modes – Sleep mode that allows substantial static current reduction for low-power standby operation.
  • Package and mounting – 256-ball ftBGA (17×17 mm) package, surface-mount mounting for compact board-level integration.
  • Industrial operating range – Specified for –40 °C to 100 °C operation for deployment in industrial temperature environments.

Typical Applications

  • Glue Logic and System Control – Implements board-level control, power sequencing and interface logic where instant-on and reconfigurability are valuable.
  • Bus Bridging and Protocol Interfacing – Provides flexible I/O and logic resources for bridging between different bus standards and managing peripheral interfaces.
  • Power-Up and Reset Control – Single-chip non-volatile configuration and fast startup simplify power-up sequencing and control functions.
  • Embedded Control and Timing – On-chip PLLs and embedded memory support timing control, FIFOs and small embedded data buffers for control applications.

Unique Advantages

  • Single-chip, secure configuration: Non-volatile memory removes the need for external configuration devices, simplifying BOM and improving system security.
  • Instant-on capability: Rapid power-up behavior reduces system initialization time and accelerates time-to-ready for downstream subsystems.
  • High I/O count with mid-density logic: 211 I/Os paired with 2,280 logic elements enables rich interfacing without sacrificing logic capacity.
  • Flexible power support: Wide supply voltage range (1.71–3.465 V) enables integration into designs with multiple logic levels and power domains.
  • Industrial temperature rating: Specified operation from –40 °C to 100 °C for reliable performance in industrial environments.
  • Field reconfigurability: Background programming and in-system reconfiguration support iterative updates and design evolution in deployed systems.

Why Choose LCMXO2280C-4FTN256I?

The LCMXO2280C-4FTN256I positions itself as a compact, non-volatile MachXO FPGA optimized for mid-density integration tasks where instant-on behavior, flexible I/O and in-field reconfigurability matter. Its combination of 2,280 logic elements, approximately 28 Kbits of on-chip RAM, up to two PLLs and 211 I/Os make it suitable for designers implementing glue logic, bus interfacing, system control and timing functions in industrial applications.

Designed to simplify system design and reduce external components, this device is suitable for engineering teams seeking a reprogrammable, single-chip solution with industrial temperature capability and tools support for design implementation and iteration.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2280C-4FTN256I and to discuss how it can fit your design requirements.

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