LCMXO2280C-4FTN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA |
|---|---|
| Quantity | 561 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-4FTN256C – MachXO Field Programmable Gate Array (FPGA), 2280 LUTs, 211 I/O, 256-LBGA
The LCMXO2280C-4FTN256C is a MachXO family FPGA optimized for glue logic, bus interfacing and system control functions. It combines non-volatile configuration and FPGA-style lookup-table logic to deliver instant-on, reconfigurable control in a single surface-mount 256-ball package.
With 2,280 LUTs (logic elements), 211 available I/Os, and on-chip memory resources, this commercial-grade device targets applications requiring flexible I/O, background reconfiguration and compact board-level integration while operating across a wide supply voltage range and standard commercial temperature.
Key Features
- Core Logic 2,280 LUTs (logic elements) for programmable combinational and sequential logic implementations.
- On-chip Memory Total on-chip RAM: 28,262 bits. The MachXO family also provides embedded block RAM and distributed RAM options at the device-family level.
- I/O and Interfaces 211 I/O pins in the 256-ball ftBGA package, with programmable sysIO buffer support across multiple signaling standards at the family level.
- Non-volatile, Instant-on Single-chip non-volatile configuration provides instant-on behavior and eliminates the need for external configuration memory.
- Reconfiguration and Programming Supports in-field reconfiguration and JTAG-based programming; background programming of non-volatile memory is supported at the family level.
- Clocking Family supports up to two analog PLLs per device for clock multiply/divide and phase shifting.
- Power and Voltage Operates from 1.71 V to 3.465 V supply, with a sleep mode capability at the family level to reduce static current.
- Package and Mounting Surface-mount 256-LBGA (supplier package listed as 256-FTBGA 17×17 mm) for compact board integration.
- Temperature and Grade Commercial grade operation from 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- Glue Logic Implement board-level glue logic and finite state machines to consolidate discrete components into a single programmable device.
- Bus Bridging and Interfacing Use available I/Os and programmable buffers for protocol translation and bus interfacing at the system edge.
- Power-Up and Reset Control Leverage instant-on, non-volatile configuration for deterministic power-up sequencing and system control tasks.
- Control Logic Replace multiple discrete controllers with a single reconfigurable device for centralized control and timing functions.
Unique Advantages
- Single-chip, non-volatile configuration: Eliminates external configuration memory and enables microsecond-level power-up ready time for systems that require immediate availability.
- High pin-to-logic ratio: 211 I/Os paired with 2,280 LUTs provide a balance of I/O density and programmable logic for board-level integration tasks.
- Flexible power operation: Broad supply voltage support (1.71 V–3.465 V) accommodates mixed-voltage systems and standard commercial supplies.
- In-field update capability: Supports reconfiguration and background programming of non-volatile memory at the family level for field-upgradeable designs.
- Compact package: 256-ball ftBGA packaging enables high-density surface-mount implementations while maintaining numerous I/Os.
- Commercial temperature suitability: Rated for 0 °C to 85 °C, matching typical commercial electronics operating environments.
Why Choose LCMXO2280C-4FTN256C?
The LCMXO2280C-4FTN256C pairs MachXO family non-volatile configuration and FPGA-style LUT logic to deliver a compact, instant-on programmable device suited to glue logic, bus interfacing and control tasks. Its combination of 2,280 LUTs, 211 I/Os, and on-chip memory makes it a practical choice for designs that need flexible I/O mappings and in-field reconfiguration without external configuration components.
This device is targeted at designers and procurement teams building commercial-grade embedded systems who value immediate system availability at power-up, straightforward board-level integration in a 256-ball surface-mount package, and a clear upgrade path through field reconfiguration capabilities supported by the MachXO family.
Request a quote or submit a procurement inquiry to evaluate LCMXO2280C-4FTN256C for your next design.

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