LCMXO2280C-4FTN256C

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA

Quantity 561 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-4FTN256C – MachXO Field Programmable Gate Array (FPGA), 2280 LUTs, 211 I/O, 256-LBGA

The LCMXO2280C-4FTN256C is a MachXO family FPGA optimized for glue logic, bus interfacing and system control functions. It combines non-volatile configuration and FPGA-style lookup-table logic to deliver instant-on, reconfigurable control in a single surface-mount 256-ball package.

With 2,280 LUTs (logic elements), 211 available I/Os, and on-chip memory resources, this commercial-grade device targets applications requiring flexible I/O, background reconfiguration and compact board-level integration while operating across a wide supply voltage range and standard commercial temperature.

Key Features

  • Core Logic  2,280 LUTs (logic elements) for programmable combinational and sequential logic implementations.
  • On-chip Memory  Total on-chip RAM: 28,262 bits. The MachXO family also provides embedded block RAM and distributed RAM options at the device-family level.
  • I/O and Interfaces  211 I/O pins in the 256-ball ftBGA package, with programmable sysIO buffer support across multiple signaling standards at the family level.
  • Non-volatile, Instant-on  Single-chip non-volatile configuration provides instant-on behavior and eliminates the need for external configuration memory.
  • Reconfiguration and Programming  Supports in-field reconfiguration and JTAG-based programming; background programming of non-volatile memory is supported at the family level.
  • Clocking  Family supports up to two analog PLLs per device for clock multiply/divide and phase shifting.
  • Power and Voltage  Operates from 1.71 V to 3.465 V supply, with a sleep mode capability at the family level to reduce static current.
  • Package and Mounting  Surface-mount 256-LBGA (supplier package listed as 256-FTBGA 17×17 mm) for compact board integration.
  • Temperature and Grade  Commercial grade operation from 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Glue Logic  Implement board-level glue logic and finite state machines to consolidate discrete components into a single programmable device.
  • Bus Bridging and Interfacing  Use available I/Os and programmable buffers for protocol translation and bus interfacing at the system edge.
  • Power-Up and Reset Control  Leverage instant-on, non-volatile configuration for deterministic power-up sequencing and system control tasks.
  • Control Logic  Replace multiple discrete controllers with a single reconfigurable device for centralized control and timing functions.

Unique Advantages

  • Single-chip, non-volatile configuration: Eliminates external configuration memory and enables microsecond-level power-up ready time for systems that require immediate availability.
  • High pin-to-logic ratio: 211 I/Os paired with 2,280 LUTs provide a balance of I/O density and programmable logic for board-level integration tasks.
  • Flexible power operation: Broad supply voltage support (1.71 V–3.465 V) accommodates mixed-voltage systems and standard commercial supplies.
  • In-field update capability: Supports reconfiguration and background programming of non-volatile memory at the family level for field-upgradeable designs.
  • Compact package: 256-ball ftBGA packaging enables high-density surface-mount implementations while maintaining numerous I/Os.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C, matching typical commercial electronics operating environments.

Why Choose LCMXO2280C-4FTN256C?

The LCMXO2280C-4FTN256C pairs MachXO family non-volatile configuration and FPGA-style LUT logic to deliver a compact, instant-on programmable device suited to glue logic, bus interfacing and control tasks. Its combination of 2,280 LUTs, 211 I/Os, and on-chip memory makes it a practical choice for designs that need flexible I/O mappings and in-field reconfiguration without external configuration components.

This device is targeted at designers and procurement teams building commercial-grade embedded systems who value immediate system availability at power-up, straightforward board-level integration in a 256-ball surface-mount package, and a clear upgrade path through field reconfiguration capabilities supported by the MachXO family.

Request a quote or submit a procurement inquiry to evaluate LCMXO2280C-4FTN256C for your next design.

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