LCMXO2280C-4FTN324I

The LCMXO2280C-4FTN324I is a MachXO family Field Programmable Gate Array (FPGA) IC optimized for glue logic, bus bridging, bus interfacing, power-up control and general control-logic tasks. It combines non-volatile configuration, reconfigurable SRAM-based logic and a high I/O-to-logic density architecture in a single surface-mount 324‑LBGA package.

With 2,280 logic elements, approximately 27.6 Kbits of embedded block RAM (28,262 total RAM bits), and up to 271 I/Os, this device targets industrial applications that require instant-on operation, high pin-count connectivity and in-field reconfiguration while supporting a wide supply voltage and extended temperature range.

Key Features

• Non-volatile, instantly configurable — Single-chip non-volatile architecture provides instant-on behavior and eliminates the need for external configuration memory.
• Reconfiguration and programming — Supports in-field reconfiguration and background programming of non-volatile memory; SRAM-based logic can be reconfigured in milliseconds via JTAG.
• Logic capacity — 2,280 logic elements suitable for glue logic and control applications traditionally addressed by CPLDs and low-capacity FPGAs.
• On-chip memory — Total RAM of 28,262 bits (approximately 27.6 Kbits of embedded block RAM) plus distributed RAM for FIFO and buffering needs.
• High I/O count and flexible I/O buffers — Up to 271 I/Os with programmable sysIO buffers supporting multiple signaling standards and interfaces.
• Clocking — Up to two analog PLLs for clock multiply, divide and phase shifting.
• Low-power modes — Sleep mode available to reduce static current (allows up to 100× static current reduction as specified in family documentation).
• Industrial operating range — Rated for operation from -40 °C to 100 °C; RoHS compliant.
• Package and mounting — 324-ball LBGA, supplier package 324‑FTBGA (19×19 mm), surface-mount.
• Voltage flexibility — Operates across a wide supply range (1.71 V to 3.465 V) to accommodate multiple I/O voltage domains.
• System-level support — IEEE 1149.1 boundary scan, onboard oscillator and IEEE 1532 in‑system programming support; design flow support via ispLEVER tools (family documentation).

Typical Applications

• Glue Logic and System Control — Implement address decoding, control-state machines and microcontroller interface logic without external configuration memory.
• Bus Bridging and Interfacing — Bridge between different bus standards and manage signal adaptation with the device’s flexible I/O buffer options and high pin count.
• Power-Up and Reset Control — Provide deterministic, instant-on sequencing and supervisory control for complex power-up scenarios.
• Peripheral and Sensor Aggregation — Aggregate and preprocess signals from multiple sensors or peripherals using embedded RAM and distributed resources.

Unique Advantages

• Instant-on single-chip solution: Non-volatile configuration removes external flash, shortening boot time and reducing BOM complexity.
• Field update capability: Background programming and TransFR reconfiguration allow in-field logic updates with minimal system interruption.
• High connectivity: Up to 271 I/Os in a 324‑LBGA package enables dense peripheral interfacing and routing efficiency on modern PCBs.
• Low-power operation: Sleep mode provides significant static current reduction for energy-sensitive industrial applications.
• Flexible supply support: Wide supply range (1.71–3.465 V) supports multiple I/O voltage domains without external level-shifting components.
• Design ecosystem: MachXO family support in ispLEVER design tools and standard synthesis flows streamlines implementation and verification.

Why Choose LCMXO2280C-4FTN324I?

The LCMXO2280C-4FTN324I occupies a practical position between CPLDs and low-capacity FPGAs by combining non-volatile instant-on behavior with FPGA-style LUTs and embedded memory. It is well suited for industrial control, interface bridging and system glue logic where fast startup, reconfigurability and a high I/O count are priorities.

Engineers choosing this device benefit from reduced BOM and board complexity through single-chip configuration, flexible I/O options and support for in-field updates. The MachXO family design tools and compatibility with common synthesis flows help shorten development time and enable reliable deployments across extended temperature and supply ranges.

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