LCMXO2280C-4T144I

IC FPGA 113 I/O 144TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 113 28262 2280 144-LQFP

Quantity 979 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O113Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-4T144I – MachXO FPGA – 2280 logic elements, 113 I/O, 144‑LQFP

The LCMXO2280C-4T144I is a MachXO family, non-volatile field programmable gate array (FPGA) in a 144-pin QFP package. It combines LUT-based logic with embedded and distributed RAM to deliver up to 2280 logic elements and approximately 27.6 Kbits of on-chip memory for control, glue-logic and interface tasks.

Engineered for industrial applications, this surface-mount device supports a wide supply range (1.71 V to 3.465 V) and an operating temperature range of −40 °C to 100 °C, making it suitable for robust system control, bus bridging and interface functions.

Key Features

  • Non-volatile single-chip architecture — Instant-on operation with no external configuration memory required; on-chip non-volatile storage supports configuration without a separate flash device.
  • Logic density — 2280 logic elements (LUT-based) for implementing glue logic, state machines and interface bridging within a compact FPGA.
  • Embedded and distributed memory — Total RAM bits: 28,262 (approximately 27.6 Kbits) plus distributed RAM up to 7.7 Kbits and dedicated FIFO control logic for buffering and state storage.
  • Flexible I/O — 113 I/Os in the 144-LQFP package with programmable sysIO buffer support for multiple signaling standards and voltage levels.
  • Reconfiguration and programming — Infinitely reconfigurable device with support for background programming and in-field updates (TransFR™ Reconfiguration) and JTAG programming of SRAM and non-volatile memory.
  • Clocking — Up to two analog PLLs for clock multiplication, division and phase shifting to support system timing needs.
  • Low-power modes — Sleep mode available to reduce static current (datasheet notes up to 100× static current reduction in sleep).
  • Package and mounting — 144-LQFP package (supplier device package: 144-TQFP, 20×20 mm); surface-mount mounting type.
  • Industrial operating range — Voltage supply 1.71 V to 3.465 V; operating temperature −40 °C to 100 °C; RoHS compliant.

Typical Applications

  • Glue logic and control — Implement glue logic, power-up sequencing and device control functions using the device’s LUTs and on-chip memory.
  • Bus bridging and interfacing — Bridge mismatched buses and implement protocol adaptation with flexible I/O and embedded memory for buffering.
  • System-level control — Use on-chip PLLs and reconfigurable logic for state machines, power management control and supervisory functions.
  • In-field updates — Support firmware and logic updates while the system remains operational using background programming and TransFR reconfiguration.

Unique Advantages

  • Instant-on, single-chip configuration: Eliminates the need for external configuration memory, simplifying BOM and reducing board-level components.
  • On-chip memory and FIFOs: Approximately 27.6 Kbits of embedded memory plus distributed RAM and FIFO control logic enable local buffering and state retention without external SRAM.
  • Wide I/O and signaling flexibility: 113 I/Os and programmable sysIO buffers accommodate multiple voltage rails and interface standards to simplify system interfacing.
  • Low-power standby: Sleep mode provides significant static current reduction for energy-sensitive industrial designs.
  • Field reconfigurability: Background programming and TransFR allow safe in-field logic updates and iterative feature enhancement.
  • Design tool support: MachXO family devices are supported by ispLEVER design tools for synthesis, place-and-route and timing verification.

Why Choose LCMXO2280C-4T144I?

The LCMXO2280C-4T144I positions itself as a highly integrated, industrial-grade MachXO FPGA suited for control, interfacing and glue-logic roles where instant-on behavior, reconfigurability and flexible I/O matter. With 2280 logic elements, embedded memory resources and up to two PLLs, it addresses designs that need compact, single-chip implementations without external configuration devices.

Choose this device when you require a surface-mount, RoHS-compliant FPGA with robust operating temperature and voltage ranges, in-field update capability, and ispLEVER design-tool support to accelerate development and deployment.

Request a quote or submit a pricing and availability inquiry to receive product and purchasing details for the LCMXO2280C-4T144I.

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