LCMXO2280C-4TN144C

The LCMXO2280C-4TN144C is a MachXO family field-programmable gate array (FPGA) from Lattice Semiconductor, delivering 2280 logic elements and approximately 28.3 Kbits of on-chip RAM in a 144-pin surface-mount package. It is optimized for glue logic, bus bridging, bus interfacing, power-up control and general control-logic tasks where single-chip, non-volatile, instant-on behavior and flexible I/O are important.

This device supports in-system and background reconfiguration, multiple analog PLLs for clocking, and a broad supply voltage range, making it suited to a wide range of commercial embedded designs requiring compact, reconfigurable logic with strong I/O flexibility.

Key Features

• Logic Capacity — 2280 logic elements suitable for mid-density glue logic and control designs.
• On-chip Memory — Total RAM bits: 28262 (approximately 28.3 Kbits) for embedded and distributed memory needs.
• I/O Density — 113 I/Os in the 144-pin package to support peripheral interfacing and board-level integration.
• Non‑volatile, Instant‑On — MachXO family architecture provides single-chip non-volatile configuration with instant-on behavior and no external configuration memory required.
• Reconfiguration and Programming — SRAM-based logic can be reconfigured in milliseconds; supports JTAG programming and IEEE 1532 in-system programming for field updates and background programming.
• TransFR™ Reconfiguration — In-field logic update capability while the system is operating (background reconfiguration supported).
• Power Management — Sleep mode enables up to 100× static current reduction for low-power standby scenarios.
• Clocking — Up to two analog PLLs per device for clock multiply, divide and phase shift operations.
• Flexible I/O — Programmable sysIO buffer supports LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS interfaces.
• Package & Mounting — Surface-mount 144-LQFP (supplier package: 144-TQFP, 20×20) for straightforward PCB assembly.
• Operating Conditions — Voltage supply range 1.71 V to 3.465 V and commercial operating temperature 0 °C to 85 °C.
• Standards & Reliability — IEEE 1149.1 boundary-scan support and onboard oscillator options; RoHS-compliant packaging.

Typical Applications

• Glue Logic and Board-Level Control — Implement multiplexing, decoding, and control-state machines that simplify PCB designs and reduce discrete logic count.
• Bus Bridging and Protocol Conversion — Bridge between different bus standards or implement protocol adaptation with flexible I/O choices.
• Power-Up and System Sequencing — Manage power rails, reset sequencing, and supervisory control using non-volatile, instant-on logic.
• User Interfaces and Peripheral Control — Handle button/scancodes, LED control, and peripheral interfaces where moderate logic density and many I/Os are required.

Unique Advantages

• Single‑Chip Non‑Volatile Configuration: Eliminates the need for external configuration memory, enabling true instant-on behavior and simplified BOM.
• Field Reconfiguration: TransFR and background programming let you update logic in-field with minimal system interruption.
• Wide I/O Flexibility: Programmable I/O buffers support multiple voltage levels and high-speed interface standards, reducing board-level level-shifting and interface components.
• Compact, Assembly‑Friendly Package: 144-pin surface-mount package provides a high pin count in a board-friendly form factor for compact designs.
• Commercial‑Grade Temperature and Supply Range: Operates across 0 °C to 85 °C with a broad supply range (1.71 V to 3.465 V) to match typical commercial embedded environments.
• Vendor Tooling and Density Migration: MachXO family support in vendor design tools and density migration paths simplify development and future upgrades.

Why Choose LCMXO2280C-4TN144C?

The LCMXO2280C-4TN144C positions itself as a practical, mid-density MachXO FPGA for commercial embedded designs that need single-chip, non-volatile configuration, flexible I/O and reconfigurability. Its 2280 logic elements, meaningful on-chip RAM and 113 I/Os in a 144-pin surface-mount package make it well-suited to glue logic, bus bridging, power sequencing and peripheral control tasks.

With instant-on behavior, field update capability, support for multiple I/O standards and RoHS-compliant packaging, this device provides a compact, reconfigurable solution backed by vendor design-tool support and family-level density migration options for future scalability.

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