LCMXO2280E-3FT256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA |
|---|---|
| Quantity | 82 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-3FT256C – MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA
The LCMXO2280E-3FT256C is a MachXO family non-volatile FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines a dense logic array with embedded memory and flexible I/O to address applications that require instant-on capability, reconfigurability and high pin-to-pin integration.
Designed for commercial applications, this device delivers 2,280 logic elements, 211 user I/Os and integrated configuration features that remove the need for external configuration memory, enabling compact, secure and fast-boot system designs.
Key Features
- Core Logic — 2,280 logic elements providing high logic density for glue logic, control and interfacing tasks.
- On‑chip Memory — Total RAM: 28,262 bits (approximately 27.6 Kbits) of embedded and distributed memory to support state storage, FIFOs and small buffers.
- I/O Count & Flexibility — 211 user I/Os with a programmable sysIO™ buffer that supports a wide range of interfaces including LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
- Non‑volatile, Instant‑on Configuration — Single-chip non‑volatile configuration enables instant-on behavior without external configuration memory; supports background programming and JTAG programming.
- Low‑Power Modes — Sleep mode provides up to 100× reduction in static current for power-sensitive designs.
- In‑field Reconfiguration — TransFR™ reconfiguration enables in-field logic updates while the system is operating.
- Clocking — Up to two analog PLLs for clock multiplication, division and phase shifting.
- Package and Mounting — 256-ball LBGA package (supplier device package: 256‑FTBGA, 17×17 mm) for surface mount applications.
- Power and Temperature — Core voltage supply range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
- RoHS Compliance — Device is RoHS compliant.
Typical Applications
- Glue Logic & System Control — Implement board-level control, reset sequencing and simple state machines that benefit from instant-on non‑volatile operation.
- Bus Bridging & Interfacing — Bridge and adapt signals between different bus standards using abundant I/O and programmable I/O buffer support.
- Power‑Up & Reset Management — Implement power sequencing, supervisory logic and fast startup behavior without external configuration storage.
- In‑field Logic Updates — Apply incremental firmware updates to control logic while the system remains operational using TransFR™ reconfiguration.
Unique Advantages
- Single‑chip non‑volatile configuration: Eliminates the need for external configuration memory, simplifying BOM and improving system security by removing an exposed bitstream.
- Fast, deterministic startup: Instant-on capability (device powers up in microseconds) reduces system boot time and simplifies power sequencing.
- High I/O-to-logic density: 211 I/Os paired with 2,280 logic elements provide a compact platform for complex interfacing tasks without large FPGAs.
- Flexible interface support: Programmable I/O buffers support multiple signaling standards to maximize board-level compatibility.
- Low static power option: Sleep mode enables significant static current reduction for battery-powered and low-power systems.
- Onboard clock management and memory: Integrated PLLs and approximately 27.6 Kbits of embedded memory simplify timing and buffering needs on-chip.
Why Choose LCMXO2280E-3FT256C?
The LCMXO2280E-3FT256C positions itself as a compact, non‑volatile FPGA option for designers who need instant-on behavior, flexible I/O and the ability to reconfigure logic in the field. Its combination of 2,280 logic elements, approximately 27.6 Kbits of on‑chip RAM and 211 I/Os makes it well suited for control, interfacing and system-management roles where minimizing external components and boot time matters.
Supported by the MachXO family architecture and established design tool flows, the device is appropriate for commercial embedded designs that require reliable configuration, flexible interface options and low-power modes.
If you need pricing, availability or a formal quote for the LCMXO2280E-3FT256C, request a quote or submit an inquiry for sales and procurement assistance.