LCMXO2280E-3FT256I

The LCMXO2280E-3FT256I is a MachXO family Field Programmable Gate Array (FPGA) IC in a 256‑ball FBGA package, designed for industrial-grade embedded control and glue-logic functions. It combines non‑volatile configuration, on-chip embedded memory and flexible I/O to address bus interfacing, control logic and system glue applications where instant-on behavior and reconfigurability are required.

This device integrates 2,280 logic elements, approximately 27.6 Kbits of on‑chip RAM, and 211 I/O pins in a surface‑mount 256‑FTBGA (17×17 mm) package. It supports single‑chip instant-on operation and reconfiguration capabilities suitable for in‑field updates and secure designs.

Key Features

• Non‑volatile, instant‑on architecture  Single‑chip non‑volatile configuration enables rapid power-up without external configuration memory and supports secure designs with no bitstream transfer needed.
• Reconfigurability and programming  Supports in‑system programming and background programming; JTAG programmability and TransFR™ reconfiguration allow in‑field logic updates while the system is operating.
• Logic and memory  2,280 logic elements and approximately 27.6 Kbits of on‑chip RAM provide capacity for glue logic, bridging and control tasks.
• I/O and packaging  211 I/Os in a 256‑ball ftBGA (17×17 mm) surface‑mount package deliver high pin‑to‑logic density for complex interfacing needs.
• Power and temperature  Core supply range specified at 1.14 V to 1.26 V; industrial operating temperature range from −40 °C to 100 °C.
• Low‑power modes  Sleep mode enables substantial static current reduction for power‑sensitive designs.
• Clocking and system support  Family architecture includes up to two analog PLLs and an onboard oscillator for flexible clock management; IEEE 1149.1 boundary scan and IEEE 1532 in‑system programming are supported.
• Flexible I/O buffer options  Family allows a wide range of I/O standards and high‑speed interfacing options (as supported by MachXO family devices).
• Compliance  RoHS‑compliant packaging and industrial grade specification.

Typical Applications

• Glue Logic and System Control  Implement power‑up sequencing, status aggregation, and discrete control functions with instant‑on, single‑chip configuration.
• Bus Bridging and Interfacing  Bridge between different bus standards and manage signal translations using the device’s high I/O count and flexible I/O buffers.
• Embedded Control and Power Management  Execute control algorithms and power management functions with low static power modes and in‑field reconfiguration.
• Field Upgradeable Logic  Support in‑field feature updates and bug fixes via TransFR reconfiguration and in‑system programming.

Unique Advantages

• Instant‑on, single‑chip solution: Reduces BOM and eliminates external configuration memory by providing non‑volatile configuration on the device itself.
• Field reconfigurability: TransFR and JTAG programming enable safe, in‑field updates without full system downtime.
• High I/O density in a compact package: 211 I/Os in a 256‑ball ftBGA simplify board routing for complex interfacing while maintaining a small footprint.
• Industrial robustness: Rated for −40 °C to 100 °C operation and RoHS‑compliant packaging for deployment in industrial environments.
• Integrated memory and clocking: On‑chip RAM and up to two PLLs support local buffering and flexible clock management without external components.

Why Choose LCMXO2280E-3FT256I?

The LCMXO2280E-3FT256I positions itself as a compact, industrial‑grade MachXO FPGA that brings non‑volatile instant‑on behavior together with a practical mix of logic capacity, embedded RAM and high I/O count. Its combination of single‑chip configuration, low‑power modes and in‑system reprogramming makes it well suited for engineers building robust control, interfacing and field‑upgradeable systems.

Targeted at designs requiring dependable operation across industrial temperature ranges, flexible reconfiguration and reduced external components, this device offers a balance of integration and system‑level features that streamline BOM, accelerate startup and simplify mid‑life updates.

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