LCMXO2280E-3BN256I

The LCMXO2280E-3BN256I is a MachXO family Field Programmable Gate Array (FPGA) optimized for glue logic, bus bridging and interfacing, power-up control and other control-logic tasks. It combines non-volatile configuration with FPGA-style LUT-based logic to deliver instant-on behavior and flexible in-field reconfiguration.

This device integrates 2,280 logic elements, approximately 28.3 Kbits of on-chip RAM (28,262 bits), and 211 I/O pins in a 256-ball LFBGA/CABGA package, targeting industrial applications that require compact, reconfigurable logic with a wide operating temperature range.

Key Features

• Core Logic 2,280 logic elements (LUT4-based) for implementing glue logic, state machines, and glue/interfacing functions.
• Embedded Memory Approximately 28,262 bits of on-chip RAM for distributed and embedded block memory usage and FIFO control logic.
• I/O Capacity & Flexibility 211 user I/Os in the 256-ball package with programmable sysIO™ buffer support for multiple interface standards listed in the MachXO family data (LVCMOS, LVTTL, PCI, LVDS and more).
• Non-volatile, Instant-on Architecture Single-chip, non-volatile configuration enables instant-on operation without external configuration memory and supports programming via JTAG and background programming of non-volatile memory.
• In-field Reconfiguration TransFR™ reconfiguration capability enables in-field logic updates while the system is operating, and SRAM-based logic can be reconfigured in milliseconds.
• Clocking Supports up to two analog sysCLOCK™ PLLs per device for clock multiply, divide and phase shifting.
• Low-Power Modes Sleep mode reduces static current consumption by up to 100× for power-sensitive applications.
• Power Supply Specified supply range 1.14 V to 1.26 V.
• Package & Mounting Surface-mount 256-ball LFBGA / CABGA (14 × 14 mm) package for high pin-count density in a compact footprint.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory RoHS compliant packaging.

Typical Applications

• Glue Logic & System Control Implement board-level control, reset sequencing and system state machines using on-chip LUTs and embedded memory.
• Bus Bridging & Interfacing Support protocol adaptation and level translation across buses with abundant I/O and programmable I/O buffer options.
• Power-up and Sequencing Control Instant-on non-volatile configuration and dedicated control logic enable reliable power-up behavior without external configuration memory.
• Field Updatable Logic In-field TransFR™ reconfiguration and JTAG-programmable non-volatile memory allow updates and feature additions without replacing hardware.

Unique Advantages

• Single-chip non-volatile FPGA: Eliminates the need for external configuration memory and enables microsecond power-up, simplifying BOM and start-up design.
• Fast in-field updates: TransFR™ reconfiguration and background programming let you update logic or non-volatile contents with minimal system disruption.
• Integrated clocking and memory: On-chip PLLs and embedded RAM reduce the need for external components and simplify timing and buffering designs.
• High I/O density in a compact package: 211 I/Os in a 256-ball BGA deliver pin-count density suitable for complex interfacing in compact board areas.
• Industrial temperature operation: −40 °C to 100 °C rating supports deployment in a broad range of industrial environments.
• Power-saving sleep mode: Dramatically lowers static current for designs where standby power is critical.

Why Choose LCMXO2280E-3BN256I?

The LCMXO2280E-3BN256I positions itself as a compact, non-volatile FPGA solution for designers who need instant-on behavior, flexible in-field reconfiguration, and a high I/O-to-logic density in an industrial-grade package. With 2,280 logic elements, embedded RAM, dual PLL capability, and programmable I/O options, it is well suited to replace discrete glue logic, handle bus interfacing, and provide robust system control in space-constrained designs.

Choose this part when you require a single-chip, reconfigurable solution that reduces component count while providing the reliability and temperature range demanded by industrial applications, along with the ability to update logic in the field.

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