LCMXO2280E-3FT324I

The LCMXO2280E-3FT324I is a MachXO family field programmable gate array (FPGA) optimized for glue logic, bus interfacing and control applications. It combines non-volatile configuration, a high I/O-to-logic ratio and embedded memory to deliver a compact, instant-on programmable solution for industrial designs.

With 2,280 logic elements, 271 I/Os and 28,262 bits of on-chip RAM, this surface-mount device is packaged in a 324-ball FTBGA (324-LBGA footprint) and is specified for industrial temperature operation from -40 °C to 100 °C.

Key Features

• Non-volatile, instant-on architecture — Single-chip non-volatile configuration enables power-up in microseconds without external configuration memory or an externally stored bitstream.
• Reconfigurability and in-field updates — Supports in-system programming and background programming of non-volatile memory; TransFR™ reconfiguration enables in-field logic updates while the system operates.
• Logic density — 2,280 logic elements (LUT-based architecture) for implementing glue logic, control functions and moderate FPGA workloads.
• On-chip memory — 28,262 bits of total on-chip RAM, including embedded and distributed memory resources for state storage and small FIFOs.
• High I/O count and flexible I/O — 271 I/O pins with programmable buffer options to support a wide range of signaling standards.
• Clocking — Family supports up to two analog PLLs for clock multiply/divide and phase shifting (device-level support in MachXO family).
• Low-voltage core supply — Device supply specified from 1.14 V to 1.26 V for the core.
• Industrial temperature rating — Specified operation from -40 °C to 100 °C for use in industrial environments.
• Package and mounting — Surface-mount 324-ball FTBGA/324-LBGA package (19×19) for compact board integration.
• RoHS compliant — Lead-free packaging compliant with RoHS requirements.

Typical Applications

• Glue Logic and System Control — Implement board-level control logic and hand-off functions between system blocks using the device’s instant-on capability and reconfigurable logic.
• Bus Bridging and Interfacing — Use the high I/O count and programmable I/O buffers to implement bus interface translation and protocol bridging.
• Power-Up Sequencing and Reset Control — Non-volatile configuration and instant-on behavior simplify power-up control and sequencing tasks.
• Peripheral and I/O Expansion — Add flexible I/O and small embedded memory to extend or adapt peripheral interfaces on compact designs.

Unique Advantages

• Instant-on single-chip solution: Eliminates external configuration flash and reduces system complexity by storing configuration on-chip.
• High pin-to-logic ratio: 271 I/Os paired with 2,280 logic elements supports I/O-heavy designs without excessive device count.
• Field reconfigurability: Background programming and TransFR™ enable in-field updates and iterative development without taking systems offline.
• Industrial temperature range: Rated -40 °C to 100 °C for reliable operation in industrial environments.
• Compact package: 324-ball FTBGA in a 19×19 footprint allows high-density mounting on space-constrained PCBs.
• RoHS compliant packaging: Compliant material set simplifies regulatory and assembly considerations.

Why Choose LCMXO2280E-3FT324I?

The LCMXO2280E-3FT324I positions itself as a robust, non-volatile FPGA option for engineers needing instant-on behavior, substantial I/O capacity and on-chip memory in a compact industrial-grade package. Its combination of 2,280 logic elements, 271 I/Os and reconfiguration capabilities make it well suited for board-level control, interface bridging and system sequencing where single-chip configurability and field updates are valuable.

Choose this device when you need a programmable, reconfigurable component that reduces BOM complexity by removing external configuration memory while offering the flexibility to update logic in the field and operate across a wide industrial temperature range.

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