LCMXO2280E-3FTN256C

The LCMXO2280E-3FTN256C is a MachXO family non-volatile FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. Its architecture combines lookup-table based logic with embedded block RAM to deliver flexible, reconfigurable logic in a single-chip, instant-on device.

This device provides 2,280 logic elements, 211 I/Os and 28,262 bits of on-chip RAM in a compact 256-ball BGA package, making it suitable for designs that require moderate logic density, substantial I/O capacity and single-chip configuration without external memory.

Key Features

• Core Logic  2,280 logic elements for implementing glue logic, finite state machines and medium-density FPGA functions.
• On-chip Memory  Total on-chip RAM: 28,262 bits (approximately 27.6 Kbits) for embedded data storage and small FIFOs.
• I/O Capacity  211 programmable I/Os to support wide system interfacing and high pin-count requirements in a single device.
• Non-volatile, Instant-on Operation  MachXO family architecture provides single-chip non-volatile configuration and fast power-up behavior without external configuration memory.
• Reconfiguration and Programming  Supports in-system programming and background programming of non-volatile memory for field updates and maintenance.
• Power  Specified core voltage range: 1.14 V to 1.26 V.
• Package & Mounting  256-ball ftBGA (17 × 17 mm) supplier package, surface-mount mounting type, listed as 256-LBGA package case.
• Operating Conditions & Compliance  Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Glue Logic and System Control  Implement power-up control, reset sequencing and board-level glue logic using the device’s instant-on, non-volatile configuration and moderate logic density.
• Bus Bridging and Interfacing  Use the 211 I/Os and on-chip memory for protocol translation, level shifting interfaces and bus bridging between system domains.
• Peripheral and User-Interface Control  Handle button scanning, LED control, keypad interfaces and other local control tasks with compact, single-chip logic.
• Firmware Update and Field Upgrades  In-system reprogramming and background non-volatile programming enable in-field logic updates and incremental feature deployment.

Unique Advantages

• Single-chip, non-volatile configuration: Eliminates the need for external configuration memory and enables instant-on behavior for faster system start-up.
• High I/O to logic ratio: 211 I/Os paired with 2,280 logic elements makes the device well suited for I/O-intensive glue logic and interface functions.
• Embedded RAM for local buffering: Approximately 27.6 Kbits of on-chip RAM supports small FIFOs, lookup tables and temporary data storage without external RAM.
• Field update capability: In-system and background programming support maintenance and feature upgrades without board removal.
• Compact BGA package: 256-ball ftBGA (17×17 mm) package provides high pin-count in a compact footprint for space-constrained designs.

Why Choose LCMXO2280E-3FTN256C?

The LCMXO2280E-3FTN256C positions itself as a flexible, single-chip solution for systems that require moderate logic resources with a high I/O count and on-chip memory. Its MachXO architecture delivers non-volatile, instant-on behavior and in-system reconfigurability, simplifying board design by removing external configuration memory and enabling field updates.

Engineers designing control logic, bus interfaces or I/O-heavy subsystems will value the balance of 2,280 logic elements, 211 I/Os, and approximately 27.6 Kbits of embedded RAM in a compact 256-ball BGA package, alongside commercial temperature operation and RoHS compliance. The MachXO family design flow and tool support accelerate implementation and integration into production designs.

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