LCMXO2280E-3M132C

IC FPGA 101 I/O 132CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA

Quantity 1,409 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O101Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-3M132C – MachXO FPGA, 2280 logic elements, 101 I/Os, 132-LFBGA

The LCMXO2280E-3M132C is a MachXO family field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It combines non-volatile, instant-on architecture with FPGA-style LUT-based logic to address glue logic, bus bridging, bus interfacing, power-up control, and general control logic needs.

With 2,280 logic elements, approximately 28 Kbits of on-chip RAM, and 101 user I/Os in a compact 132-ball CSPBGA package, this device targets compact system designs that require single-chip configuration, flexible I/O, and in-field reconfiguration capabilities.

Key Features

  • Core Logic – 2,280 logic elements (LUT-based) for implementing glue logic, control state machines, and medium-density FPGA functions.
  • On-chip Memory – Approximately 28,262 bits (about 27.6 Kbits) of total RAM for distributed and embedded block memory usage.
  • I/O Density – 101 programmable I/Os available in the 132-CSPBGA (8×8 mm) package to support multiple peripherals and interfaces.
  • Non-volatile, Instant-on – Single-chip non-volatile configuration provides instant-on operation and eliminates the need for external configuration memory.
  • In-field Reconfiguration – Supports background and in-field reconfiguration (TransFR™) and JTAG programming for flexible updates without external configuration storage.
  • Clocking – Family support for multiple sysCLOCK PLLs (family-level: up to two analog PLLs) for clock multiply/divide and phase control where applicable.
  • Flexible I/O Standards – Family-level support for a wide range of I/O buffers and standards (LVCMOS, LVTTL, LVDS, Bus-LVDS, and others) to accommodate various board-level interfaces.
  • Low Power and Sleep Mode – Sleep mode capability for substantial static current reduction to support low-power system states.
  • Power and Environmental – Core voltage supply range of 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
  • Package & Mounting – 132-ball LFBGA / CSPBGA package (132-CSPBGA, 8×8 mm), surface-mount mounting for compact board designs.

Typical Applications

  • Glue Logic and Board Control – Replace discrete logic with programmable, reconfigurable logic for board-level control and state machines.
  • Bus Bridging and Interfacing – Implement bus adapters, protocol translators, and interface glue between different I/O standards using the device’s flexible I/O and on-chip memory.
  • Power-up and Reset Control – Manage power sequencing, reset logic and supervisory control with single-chip non-volatile configuration and instant-on behavior.
  • In-field Logic Updates – Systems requiring field updates can use background programming and TransFR reconfiguration to modify logic without removing the device.

Unique Advantages

  • Instant-on, single-chip configuration: Eliminates the need for external configuration memory and provides microsecond power-up, simplifying BOM and startup behavior.
  • Compact, high I/O-to-logic density: 2,280 logic elements with 101 I/Os in a 132-ball CSPBGA delivers significant connectivity in a small footprint.
  • On-chip memory resources: Approximately 28 Kbits of embedded memory and distributed RAM support FIFO and buffering without external SRAM.
  • Field and background programming: Supports in-system programming and non-volatile updates via JTAG and background programming for maintenance and feature upgrades.
  • Power management features: Sleep mode provides large static current reduction to support low-power system states and energy-conscious designs.
  • Commercial temperature and RoHS compliance: Operates across 0 °C to 85 °C and is RoHS compliant for standard commercial applications.

Why Choose LCMXO2280E-3M132C?

The LCMXO2280E-3M132C positions itself as a versatile, non-volatile FPGA that bridges the gap between CPLDs and low-capacity FPGAs. Its combination of instant-on single-chip configuration, mid-range logic capacity, embedded memory, and flexible I/O makes it suitable for compact system control, interface bridging, and in-field-updatable designs.

Designers benefit from a compact 132-ball CSPBGA package and an ecosystem that supports standard synthesis and in-system programming flows, enabling rapid integration into commercial embedded applications where single-chip configuration, connectivity, and reconfigurability matter.

Request a quote or submit an RFQ to evaluate the LCMXO2280E-3M132C for your next design project.

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