LCMXO2280E-3FTN324C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA |
|---|---|
| Quantity | 356 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FTBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 271 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-3FTN324C – MachXO FPGA, 2,280 logic elements, 28,262-bit RAM, 271 I/Os, 324-LBGA
The LCMXO2280E-3FTN324C is a MachXO family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor designed for glue logic, bus interfacing and control logic applications. It combines non-volatile, instant-on operation with a grid of programmable logic and on-chip memory to deliver reconfigurable logic in a single surface-mount package.
This device targets commercial designs that need a balance of I/O density and logic resources: it provides 2,280 logic elements, approximately 28,262 bits of on-chip RAM and up to 271 I/Os in a 324-ball FTBGA-style package (324-LBGA, 19×19 mm supplier package).
Key Features
- Non-volatile, Instant-on: Single-chip architecture with non-volatile configuration enables instant-on operation and removes the need for external configuration memory.
- Reconfigurable Logic: Approximately 2,280 logic elements suitable for glue logic, bus bridging and control logic; supports in-field reconfiguration and background programming.
- On-chip Memory: Approximately 28,262 bits of embedded RAM to support distributed and block memory usage within designs.
- I/O Density: Up to 271 I/Os in the 324-LBGA package, enabling broad interfacing options for complex boards and multi-bus systems.
- Clocking: Device family supports up to two analog PLLs for clock multiply/divide and phase shifting functions.
- Low-power Modes: Sleep mode support to significantly reduce static current during low-power operation.
- Supply Voltage: Device-specific supply range of 1.14 V to 1.26 V.
- Package & Mounting: 324-LBGA (supplier package 324-FTBGA, 19×19 mm), surface-mount mounting type.
- Commercial Grade Temperature: Rated for 0 °C to 85 °C operating temperature.
- Standards & Programming: Supports JTAG-based programming and in-system programming features described for the MachXO family.
- RoHS Compliance: Device is RoHS compliant.
Typical Applications
- Glue Logic and System Control: Implement glue logic, power-up sequencing and board-level control functions using on-chip logic and memory.
- Bus Bridging and Interfacing: Use the high I/O count and flexible I/O buffer options to bridge and interface multiple buses and subsystems.
- Peripheral and I/O Expansion: Expand or consolidate peripheral interfaces where a mix of signals and many I/Os are required.
- In-field Logic Updates: Enable in-system reconfiguration and background programming for field-updatable control logic.
Unique Advantages
- Single-chip, no external configuration memory: Reduces BOM complexity and board area by eliminating the need for external config storage.
- Instant-on capability: Non-volatile configuration allows the device to power up and begin operation immediately, simplifying system boot behavior.
- High I/O-to-logic ratio: 271 I/Os paired with 2,280 logic elements supports dense interfacing without oversizing logic capacity.
- Field reconfiguration and background programming: Supports in-field updates and background programming to evolve device behavior without full system downtime.
- Power management features: Sleep mode enables large reductions in static current for lower-power system states.
- Design tool support: MachXO family devices are supported by the vendor’s design tool flow for synthesis, place-and-route and timing verification.
Why Choose LCMXO2280E-3FTN324C?
The LCMXO2280E-3FTN324C is positioned for commercial systems that require a compact, non-volatile FPGA with strong I/O capability and flexible reconfiguration. Its combination of 2,280 logic elements, substantial on-chip RAM and up to 271 I/Os in a 324-ball BGA footprint makes it well suited for board-level control, bus interfacing and applications that benefit from instant-on behavior and field updates.
For teams focused on reducing BOM count, supporting in-field upgrades and maintaining flexible timing and clocking options, this MachXO device delivers a balance of integration, reprogramability and practical power features backed by the family’s toolchain and in-system programming capabilities.
Request a quote or submit a procurement inquiry to receive pricing and availability information for the LCMXO2280E-3FTN324C.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016