LCMXO2280E-3FTN324C

IC FPGA 271 I/O 324FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA

Quantity 356 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package324-FTBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LBGANumber of I/O271Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-3FTN324C – MachXO FPGA, 2,280 logic elements, 28,262-bit RAM, 271 I/Os, 324-LBGA

The LCMXO2280E-3FTN324C is a MachXO family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor designed for glue logic, bus interfacing and control logic applications. It combines non-volatile, instant-on operation with a grid of programmable logic and on-chip memory to deliver reconfigurable logic in a single surface-mount package.

This device targets commercial designs that need a balance of I/O density and logic resources: it provides 2,280 logic elements, approximately 28,262 bits of on-chip RAM and up to 271 I/Os in a 324-ball FTBGA-style package (324-LBGA, 19×19 mm supplier package).

Key Features

  • Non-volatile, Instant-on: Single-chip architecture with non-volatile configuration enables instant-on operation and removes the need for external configuration memory.
  • Reconfigurable Logic: Approximately 2,280 logic elements suitable for glue logic, bus bridging and control logic; supports in-field reconfiguration and background programming.
  • On-chip Memory: Approximately 28,262 bits of embedded RAM to support distributed and block memory usage within designs.
  • I/O Density: Up to 271 I/Os in the 324-LBGA package, enabling broad interfacing options for complex boards and multi-bus systems.
  • Clocking: Device family supports up to two analog PLLs for clock multiply/divide and phase shifting functions.
  • Low-power Modes: Sleep mode support to significantly reduce static current during low-power operation.
  • Supply Voltage: Device-specific supply range of 1.14 V to 1.26 V.
  • Package & Mounting: 324-LBGA (supplier package 324-FTBGA, 19×19 mm), surface-mount mounting type.
  • Commercial Grade Temperature: Rated for 0 °C to 85 °C operating temperature.
  • Standards & Programming: Supports JTAG-based programming and in-system programming features described for the MachXO family.
  • RoHS Compliance: Device is RoHS compliant.

Typical Applications

  • Glue Logic and System Control: Implement glue logic, power-up sequencing and board-level control functions using on-chip logic and memory.
  • Bus Bridging and Interfacing: Use the high I/O count and flexible I/O buffer options to bridge and interface multiple buses and subsystems.
  • Peripheral and I/O Expansion: Expand or consolidate peripheral interfaces where a mix of signals and many I/Os are required.
  • In-field Logic Updates: Enable in-system reconfiguration and background programming for field-updatable control logic.

Unique Advantages

  • Single-chip, no external configuration memory: Reduces BOM complexity and board area by eliminating the need for external config storage.
  • Instant-on capability: Non-volatile configuration allows the device to power up and begin operation immediately, simplifying system boot behavior.
  • High I/O-to-logic ratio: 271 I/Os paired with 2,280 logic elements supports dense interfacing without oversizing logic capacity.
  • Field reconfiguration and background programming: Supports in-field updates and background programming to evolve device behavior without full system downtime.
  • Power management features: Sleep mode enables large reductions in static current for lower-power system states.
  • Design tool support: MachXO family devices are supported by the vendor’s design tool flow for synthesis, place-and-route and timing verification.

Why Choose LCMXO2280E-3FTN324C?

The LCMXO2280E-3FTN324C is positioned for commercial systems that require a compact, non-volatile FPGA with strong I/O capability and flexible reconfiguration. Its combination of 2,280 logic elements, substantial on-chip RAM and up to 271 I/Os in a 324-ball BGA footprint makes it well suited for board-level control, bus interfacing and applications that benefit from instant-on behavior and field updates.

For teams focused on reducing BOM count, supporting in-field upgrades and maintaining flexible timing and clocking options, this MachXO device delivers a balance of integration, reprogramability and practical power features backed by the family’s toolchain and in-system programming capabilities.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the LCMXO2280E-3FTN324C.

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