LCMXO2280E-3MN132C

IC FPGA 101 I/O 132CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA

Quantity 841 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O101Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-3MN132C – MachXO FPGA, 2280 logic elements, 101 I/Os

The LCMXO2280E-3MN132C is a MachXO family field programmable gate array (FPGA) optimized for glue logic, bus bridging/interfacing, power‑up control and general control logic. It combines non‑volatile, instant‑on configuration with reconfigurable logic and embedded memory to address applications that require single‑chip configuration and flexible in‑field updates.

Built for compact surface‑mount designs, this device provides 2280 logic elements, 101 user I/Os in a 132‑ball CSPBGA (8×8 mm) package, and approximately 28.3 Kbits of on‑chip RAM, offering a balance of I/O density and embedded memory for a wide range of commercial embedded systems.

Key Features

  • Non‑volatile, instant‑on architecture  Single‑chip configuration with no external configuration memory required; powers up in microseconds for rapid system availability.
  • Reconfigurable logic  2280 logic elements (LUTs) that support in‑field updates and SRAM‑based reconfiguration in milliseconds via JTAG and TransFR™ Reconfiguration.
  • Embedded memory  Approximately 28,262 total RAM bits (around 27.6 Kbits sysMEM™ embedded block RAM and distributed RAM) for buffering and small data structures.
  • Flexible I/O and levels  101 I/Os with programmable sysIO™ buffers supporting a wide range of interfaces and voltage standards including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
  • Clocking  On‑device sysCLOCK™ PLLs (up to two analog PLLs for the device family) for clock multiply/divide and phase shifting to support complex timing requirements.
  • Low‑power modes  Sleep mode capability enabling up to 100× static current reduction for energy‑sensitive designs.
  • Package and mounting  132‑LFBGA (CSPBGA, 8×8 mm) surface‑mount package suitable for high‑density board layouts; RoHS compliant.
  • Commercial grade temperature  Rated for operation from 0 °C to 85 °C and a supply voltage range of 1.14 V to 1.26 V for core operation.

Typical Applications

  • Glue logic and bus interfacing  Implement bus bridging, protocol adaptation and signal conditioning where flexible I/O and quick configuration are required.
  • System control and power‑up sequencing  Single‑chip non‑volatile configuration and instant‑on behavior simplify power‑up control and system initialization tasks.
  • Embedded buffering and FIFO control  On‑chip RAM and dedicated FIFO control logic enable local buffering for data flow and interface bridging.
  • In‑field updates and security‑sensitive systems  Supports background programming and TransFR™ reconfiguration for in‑system logic updates without exposing a separate configuration bitstream.

Unique Advantages

  • Single‑chip, non‑volatile configuration: Eliminates the need for external configuration memory, reducing bill‑of‑materials and simplifying board design.
  • Instant‑on responsiveness: Fast power‑up capability enables systems to become operational in microseconds, useful for systems with tight startup windows.
  • Flexible I/O standards: Programmable sysIO buffers support multiple interface standards and voltage levels, easing integration with diverse peripherals and host systems.
  • Field reprogrammability: TransFR™ and JTAG programming allow in‑field and background updates to logic and non‑volatile memory, supporting iterative development and long‑term feature updates.
  • Power management options: Sleep mode with large static current reduction helps reduce standby power in battery‑aware or low‑power applications.
  • Compact, high‑density package: 132‑ball CSPBGA (8×8 mm) package delivers high I/O count and logic density in a small footprint for space‑constrained designs.

Why Choose LCMXO2280E-3MN132C?

The LCMXO2280E-3MN132C positions itself as a practical, compact MachXO family member for designers who need non‑volatile, instant‑on FPGA capability with flexible I/O and embedded memory. Its 2280 logic elements, 101 I/Os and on‑chip RAM make it well suited to glue logic, interface bridging, control functions and designs that require field reprogrammability without external configuration devices.

Supported by MachXO family design flows and toolchains, the device offers a reliable platform for commercial embedded systems where board space, configuration security and low standby power are important. Its combination of single‑chip configuration, programmable I/O standards and sleep‑mode power savings delivers a scalable solution for evolving hardware designs.

Request a quote or submit a purchase inquiry to learn more about availability, pricing and lead times for the LCMXO2280E-3MN132C.

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