LCMXO2280E-3MN132I

The LCMXO2280E-3MN132I is a MachXO family Field Programmable Gate Array (FPGA) in a 132-ball CSPBGA (8×8 mm) package. It combines non-volatile, instant-on configuration with SRAM-style logic flexibility to address glue logic, bus bridging, power-up control and general control logic for industrial applications.

Designed for single-chip integration, this device delivers 2280 logic elements, approximately 27.6 Kbits of embedded block RAM, and 101 I/Os in a surface-mount, industrial-grade package. Key value comes from instant-on behavior, background non-volatile programming, and on-chip resources that reduce BOM and speed system bring-up.

Key Features

• Non-volatile, instant-on architecture – Single-chip configuration with no external configuration memory required; device powers up in microseconds and supports background programming of non-volatile memory.
• Reconfigurable logic – 2280 logic elements (LUT4s) provide flexible implementation of combinational and sequential logic for control and interfacing tasks.
• On-chip memory – Approximately 27.6 Kbits of embedded block RAM plus support for distributed RAM for buffering, state storage, and small data structures.
• I/O and package – 101 user I/Os in a 132-CSPBGA (8×8 mm) package; surface-mount mounting simplifies PCB design for compact systems.
• Analog PLLs and clocking – Up to two analog PLLs per device to support clock multiply/divide and phase shifting for system timing.
• Flexible I/O buffer support – Programmable sysIO buffers support a wide range of interface standards, including multiple LVCMOS voltage levels, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, and RSDS as documented for the MachXO family.
• Low-power and sleep mode – Sleep mode enables static current reduction up to 100× for power-sensitive applications.
• Industrial temperature range – Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Core supply range – Specified core voltage range of 1.14 V to 1.26 V for this device variant.
• RoHS compliant – Lead-free packaging and RoHS status compliant.

Typical Applications

• Glue logic and system control – Replace discrete logic and microcontroller glue with a compact, reconfigurable single-chip solution for board-level control tasks.
• Bus bridging and interfacing – Implement protocol translation, bus width adaptation, and interface glue between legacy and modern peripherals using the device’s flexible I/O and clocking resources.
• Power-up and reset management – Centralize power sequencing, reset control, and supervisory logic to improve system reliability and deterministic startup.
• Industrial control panels and equipment – Use the industrial temperature rating and abundant I/Os for sensor interfacing, motor control supervisory logic, and human-machine interface (HMI) glue logic.

Unique Advantages

• Instant-on, single-chip solution: Eliminates external configuration memory and accelerates system boot with microsecond power-up.
• Secure configuration model: Non-volatile architecture removes the need for an external bitstream to intercept during configuration.
• High I/O-to-logic density: 101 I/Os combined with 2280 logic elements supports complex interfacing without large FPGA form factors.
• In-field reconfiguration: SRAM-based logic can be reconfigured in milliseconds, and non-volatile memory supports background programming for field updates.
• Power management flexibility: Sleep mode provides significant static current reduction for low-power standby operation.
• Toolchain support: MachXO family devices are supported by ispLEVER design tools and common synthesis flows for efficient implementation and verification.

Why Choose LCMXO2280E-3MN132I?

The LCMXO2280E-3MN132I positions itself as a compact, industrial-grade FPGA that blends the instant-on security of non-volatile configuration with the flexibility of reprogrammable SRAM logic. Its combination of 2280 logic elements, embedded memory, two PLLs, and 101 I/Os in a 132-CSPBGA package makes it well suited for system glue logic, bus interfacing, and control tasks where fast startup, in-field updates, and robustness across −40 °C to 100 °C are required.

Systems designers benefit from a reduced BOM, simplified board-level integration, and established design tool support for migrating and scaling designs across the MachXO family.

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