LCMXO2280E-3T144C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 113 28262 2280 144-LQFP |
|---|---|
| Quantity | 698 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 113 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-3T144C – MachXO Field Programmable Gate Array (FPGA) IC 113 28262 2280 144-LQFP
The LCMXO2280E-3T144C is a MachXO family FPGA optimized for control, glue logic and bus-interface tasks. It combines non‑volatile, instant‑on configuration with a reconfigurable FPGA fabric to address applications such as bus bridging, power‑up control and general control logic.
Built around 2,280 logic elements and a flexible I/O structure, this surface‑mount device delivers an integrated single‑chip solution with on‑chip memory and in‑field reconfiguration capabilities suited to commercial embedded designs.
Key Features
- Programmable Logic — 2280 logic elements for implementing glue logic, state machines and control functions.
- On‑chip Memory — Total RAM bits: 28,262. The MachXO family datasheet notes up to 27.6 Kbits of sysMEM™ embedded block RAM and up to 7.7 Kbits of distributed RAM.
- I/O Flexibility — 113 I/Os with programmable sysIO™ buffer support for multiple interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
- Non‑volatile, Instant‑on — Single‑chip non‑volatile configuration that powers up in microseconds without external configuration memory; supports background programming and JTAG programming.
- Reconfiguration & Power Modes — TransFR™ in‑field reconfiguration for live updates and a Sleep Mode that reduces static current by up to 100× for low‑power states.
- Clocking — Up to two analog sysCLOCK™ PLLs per device for clock multiplication, division and phase shifting (as described in the MachXO family datasheet).
- Power and Supply — Core voltage supply range specified at 1.14 V to 1.26 V; device architecture supports multiple I/O voltage domains as described in the family datasheet.
- Package & Mounting — Surface mount; package case 144‑LQFP. Supplier device package also listed as 144‑TQFP (20 × 20 mm).
- Commercial Grade & Temperature — Grade: Commercial; operating temperature range 0 °C to 85 °C.
- Standards & System Support — IEEE 1149.1 boundary scan and IEEE 1532 in‑system programming support (family datasheet references).
- RoHS Compliant — Device is RoHS compliant.
Typical Applications
- Glue Logic — Implement board‑level glue and combinational logic to consolidate discrete components and simplify PCB routing.
- Bus Bridging and Interfacing — Create custom bus translators, level‑shifters and protocol adapters using the device’s flexible I/O and on‑chip logic.
- Power‑Up Control — Manage system sequencing and power rails with instant‑on capability and programmable control logic.
- Control Logic — Implement finite state machines, monitoring and supervisory functions with integrated memory and reconfigurable logic.
- Field Updatable Systems — Use TransFR™ reconfiguration and background programming to update logic in the field while systems remain operational.
Unique Advantages
- Instant, Single‑Chip Configuration: Non‑volatile architecture eliminates external configuration memory and enables microsecond power‑up for faster system availability.
- High I/O to Logic Ratio: 113 I/Os paired with 2,280 logic elements provides balanced capacity for I/O‑heavy glue logic and interfacing tasks.
- Flexible I/O Standards: Programmable sysIO™ buffers support a wide set of signaling standards, reducing the need for external level‑shifters or translator ICs.
- In‑Field Reconfigurability: TransFR™ and JTAG programming enable safe, incremental updates and background programming without full system downtime.
- Power Management: Dedicated Sleep Mode and core supply specification (1.14–1.26 V) help designers manage static current and power sequencing.
- Commercial‑Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream embedded applications.
Why Choose LCMXO2280E-3T144C?
The LCMXO2280E-3T144C positions itself as a compact, non‑volatile FPGA solution for commercial embedded systems that require instant‑on behavior, flexible I/O and field update capability. With 2,280 logic elements, on‑chip RAM, and 113 I/Os in a 144‑pin surface‑mount package, it is well suited for consolidating glue logic, handling bus interfacing duties, and implementing power‑up or supervisory control.
For design teams looking for an integrated, reconfigurable device with documented system‑level features (boundary scan, in‑system programming and PLL resources), this MachXO device offers a balance of integration, reconfigurability and predictable commercial‑grade operation backed by the MachXO family datasheet specifications.
If you would like pricing, availability or to request a quote for LCMXO2280E-3T144C, submit a quotation request or contact sales for further information and lead‑time details.

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