LCMXO2280E-3TN100C

The LCMXO2280E-3TN100C is a MachXO family FPGA IC offering non-volatile, instant-on operation in a 100-pin LQFP package. Built for control and glue-logic roles, the device combines 2,280 logic elements with embedded and distributed memory to implement bus interfacing, power-up sequencing, and system control functions.

As a MachXO device, it provides single-chip non-volatile configuration, fast power-up, and in-field reconfiguration options while supporting a broad range of I/O standards and system-level features suitable for commercial applications.

Key Features

• Core Logic 2,280 logic elements (LUT4-based) for implementing glue logic, state machines, and control paths.
• Embedded & Distributed Memory Up to approximately 27.6 Kbits of embedded block RAM (EBR) plus up to 7.7 Kbits of distributed RAM for buffering, FIFOs, and small data storage.
• I/O Capacity & Flexibility 73 I/O pins in the 100-LQFP package with programmable sysIO buffers supporting a wide range of interfaces per family specifications.
• Programmable Clocking Up to two analog PLLs for clock multiply/divide and phase adjustments.
• Non-volatile Configuration Single-chip, no external configuration memory required; instant-on and background programming supported.
• In-field Reconfiguration TransFR™ (TFR) reconfiguration allows updates to SRAM-based logic while the system is running.
• Low-power Modes Sleep mode capability enables substantial static current reduction during low-power standby.
• Package & Temperature Supplied in a 100-LQFP (100-TQFP, 14×14 mm) package; commercial grade with operating temperature 0°C to 85°C.
• Power Core voltage specified at 1.14 V to 1.26 V; family-level guidance supports operation with common I/O power rails.
• Standards & System Support JTAG programmability and IEEE boundary-scan support; devices support in-system programming per family data.
• Compliance RoHS compliant packaging.

Typical Applications

• Glue Logic & System Control Implement glue logic, control state machines, and startup sequencing without external configuration memory.
• Bus Bridging & Interfacing Bridge between buses and implement protocol adaptation using flexible I/O and embedded memory.
• Power-up & Reset Management Handle deterministic power-up control and supervisory functions with instant-on capability.
• Peripheral & UI Control Manage user interfaces, LED control, button debouncing, and peripheral timing with available logic and RAM.

Unique Advantages

• Instant-on, single-chip configuration: Eliminates the need for external configuration memory and enables microsecond-scale startup.
• Non-volatile and reconfigurable: Stores configuration on-chip and supports in-field reconfiguration and background programming for flexible updates.
• High I/O-to-logic density: 73 I/Os paired with 2,280 logic elements provides an efficient balance for interfacing-intensive applications.
• On-chip memory options: Embedded and distributed RAM resources simplify buffer and FIFO implementations without external memory.
• Power management features: Sleep mode enables significant static current reduction for lower standby power.
• Commercial-grade packaging: 100-LQFP package and 0°C to 85°C operating range suit a wide range of commercial applications.

Why Choose LCMXO2280E-3TN100C?

The LCMXO2280E-3TN100C positions itself as a compact, non-volatile FPGA tailored for control, interfacing, and glue-logic tasks where fast startup, flexible I/O, and on-chip memory are important. Its combination of 2,280 logic elements, on-chip RAM, programmable PLLs, and single-chip configuration simplifies board-level design and reduces BOM complexity.

This device is well suited for commercial embedded designs requiring reliable instant-on behavior, in-field reconfiguration, and a balanced mix of logic and I/O capacity—backed by MachXO family system-level features and RoHS-compliant packaging.

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