LCMXO2280E-3FTN324I

The LCMXO2280E-3FTN324I is a MachXO family FPGA that combines non-volatile instant-on operation with FPGA-style LUT-based logic and embedded memory. It is optimized for applications such as glue logic, bus bridging and interfacing, power-up control, and general control logic where single-chip configurability and fast start-up are important.

This device provides 2,280 logic elements, up to 271 I/Os in a high-density 324-ball BGA package, and on-chip memory resources, delivering integration that reduces system BOM while supporting reconfiguration and secure single-chip operation.

Key Features

• Core Logic — 2,280 logic elements (LUT4s) for implementing combinational and sequential logic with density suitable for glue logic and control functions.
• Memory — Approximately 27.6 Kbits of embedded block RAM plus distributed RAM (total RAM bits: 28,262) to support data buffering, small FIFOs and state storage.
• I/O and Interfaces — Up to 271 I/Os in the 324-ball package with a programmable sysIO buffer that supports a wide range of interfaces, including multiple LVCMOS voltage levels, LVTTL, PCI, LVDS and other differential standards documented for the MachXO family.
• Analog and Clocking — Two analog PLLs (per MachXO2280 family) for clock multiplication, division and phase shifting to manage system clocks on-chip.
• Non-volatile, Instant-On — Single-chip non-volatile configuration that powers up in microseconds without external configuration memory and supports secure operation without an exposed bitstream.
• In-field Reconfiguration — TransFR™ reconfiguration enables in-field logic updates; SRAM-based logic can be reconfigured in milliseconds and non-volatile memory can be programmed via JTAG.
• Low-power Modes — Sleep mode capability for substantial static current reduction as described in the MachXO family data sheet.
• Package and Mounting — Surface-mount 324-LBGA / 324-FTBGA (19×19) package for compact, high-pin-count board designs.
• Industrial Temperature and Compliance — Industrial-grade device with operating temperature range from −40 °C to 100 °C and RoHS-compliant packaging.
• System Support — Onboard oscillator, IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support for development and production-level programmability.

Typical Applications

• Glue Logic and System Integration — Implement address decoding, bus control and peripheral glue to consolidate discrete components and simplify board-level design.
• Bus Bridging and Interfacing — Create protocol bridging and I/O translation with dense I/O count and flexible sysIO buffering to match multiple interface standards.
• Power-Up and System Control — Handle power sequencing, reset management and startup control using non-volatile, instant-on configuration for predictable system behavior.
• Control Logic — Implement state machines, control paths and small data buffers using the device’s logic elements and embedded RAM resources.

Unique Advantages

• Single-chip, non-volatile operation: Eliminates external configuration memory and delivers microsecond power-up for faster system availability.
• High I/O density in a compact package: 271 I/Os in a 324-ball BGA enable feature-rich designs without large packages or multiple devices.
• Practical on-chip memory: Embedded block RAM plus distributed RAM provides localized storage for FIFOs, buffering and small data tables.
• Field updatable: TransFR reconfiguration and JTAG-programmable non-volatile memory let you update logic in the field with minimal disruption.
• Industrial robustness: Industrial operating range (−40 °C to 100 °C) and RoHS compliance support deployment in temperature-challenging environments.
• Integrated clock management: Dedicated PLLs facilitate on-chip clock generation and manipulation, reducing external component count.

Why Choose LCMXO2280E-3FTN324I?

The LCMXO2280E-3FTN324I positions itself as a compact, non-volatile FPGA tailored for designers who need instant-on behavior, high I/O density and moderate logic capacity. With 2,280 logic elements, extensive on-chip memory, two PLLs and up to 271 I/Os in a 324-ball BGA, it addresses board-level integration tasks such as glue logic, bus bridging and system control while minimizing external components.

Backed by MachXO family features like in-field reconfiguration, JTAG programming and boundary-scan support, this device is suitable for development workflows that require secure, single-chip configuration and straightforward scalability within the MachXO product family.

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