LCMXO2280E-4BN256C

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA

Quantity 670 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-4BN256C – MachXO FPGA, 2280 logic elements, 211 I/Os, 256-LFBGA

The LCMXO2280E-4BN256C is a MachXO family field-programmable gate array (FPGA) from Lattice Semiconductor Corporation optimized for glue logic, bus bridging, power-up control and general-purpose control logic. It combines non-volatile configuration, a dense LUT-based fabric and flexible I/O in a single 256-ball LFBGA (caBGA) package for compact system designs.

With 2,280 logic elements, approximately 28,262 bits of on-chip RAM and up to 211 I/Os in this package option, the device targets designers who need instant-on operation, reconfigurability and a highly integrated one-chip solution for commercial applications.

Key Features

  • Logic Capacity — 2,280 logic elements and 285 logic blocks provide ample resources for glue logic, protocol bridging and control functions.
  • On-chip Memory — Approximately 28,262 total RAM bits of embedded and distributed memory for buffers, FIFOs and small data tables.
  • I/O Density — Up to 211 user I/Os in the 256-ball LFBGA package, enabling high pin-count system interfaces in a compact footprint.
  • Non-volatile, Instant-on Architecture — Single-chip non-volatile configuration with instant-on capability and no external configuration memory required, offering design security and fast power-up.
  • Reconfiguration and In-field Updates — Supports background programming and TransFR™ reconfiguration for in-field logic updates while the system operates.
  • Flexible sysIO Buffering — Family-level support for a wide range of interface standards (LVCMOS levels, LVTTL, PCI, LVDS and others) to simplify mixed-signal system interfacing.
  • Clocking — Up to two analog PLLs per device for clock multiply/divide and phase shifting (family capability).
  • Power and Thermal — Core voltage supply 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
  • Package — 256-ball LFBGA, CSPBGA (256-CABGA 14×14 mm) provides a high-density, surface-mount package option for space-constrained boards.
  • RoHS Compliant — Device is RoHS compliant for environmental and assembly compatibility.

Typical Applications

  • Glue Logic and System Control: Implement board-level control, reset sequencing and power-up state machines using the device's instant-on non-volatile configuration and logic fabric.
  • Bus Bridging and Protocol Conversion: Use the high I/O count and flexible sysIO buffering to bridge between different bus standards and peripherals.
  • Interface Aggregation: Aggregate and buffer multiple interface signals, leveraging on-chip RAM and PLL resources for timing and data flow control.
  • In-field Upgradeable Logic: Deploy systems that require live updates or feature upgrades using background programming and TransFR™ reconfiguration.

Unique Advantages

  • One-chip, Non-volatile Solution: Eliminates the need for external configuration memory and enables immediate availability of logic at power-up.
  • High I/O in a Compact Package: 211 I/Os in a 256-ball LFBGA package reduce board complexity while maintaining signal routing flexibility.
  • Flexible Memory Resources: Approximately 28,262 bits of on-chip RAM support buffering, FIFOs and small data tables without external SRAM.
  • Field Reconfiguration: Background programming and TransFR™ capability let you update logic in the field with minimal system interruption.
  • Commercial Temperature and Supply Profile: Designed for commercial applications with a 0 °C to 85 °C operating range and defined core supply rails for predictable system integration.

Why Choose LCMXO2280E-4BN256C?

The LCMXO2280E-4BN256C positions itself as a compact, non-volatile FPGA for commercial designs that need immediate availability of logic at power-up, high I/O density and flexible in-field reconfiguration. Its combination of 2,280 logic elements, substantial on-chip RAM and family-level clocking and I/O flexibility make it well suited to system control, bus interfacing and protocol conversion tasks.

For designers focused on reducing BOM count and simplifying configuration management while keeping options open for live updates and interface diversity, this MachXO device delivers a balance of integration, reconfigurability and predictable commercial-grade operating conditions.

Request a quote or submit an inquiry to get pricing, lead-time and availability for the LCMXO2280E-4BN256C. Our team can assist with part selection and sample requests to support your design evaluation.

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