LCMXO2280E-4FT324C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA |
|---|---|
| Quantity | 590 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FTBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 271 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-4FT324C – MachXO FPGA, 2280 logic elements, 271 I/O, 324-LBGA
The LCMXO2280E-4FT324C is a MachXO family field-programmable gate array (FPGA) featuring non-volatile, instant-on operation and a high I/O-to-logic density architecture. It combines 2280 LUT-based logic elements with embedded and distributed memory, making it well suited for glue logic, bus bridging, power-up control and general control logic in commercial applications.
This device provides single-chip configuration (no external configuration memory required), flexible I/O support and on-chip system features that simplify board-level design and speed time to market.
Key Features
- Core Architecture: 2280 LUT4-based logic elements delivering flexible programmable logic for glue logic and control functions.
- Embedded and Distributed Memory: Approximately 27.6 Kbits of embedded block RAM (EBR) plus up to 7.7 Kbits of distributed RAM; product total RAM bits listed as 28,262 bits for on-chip storage and buffering.
- I/O Density and Standards: 271 available I/Os with a programmable sysIO buffer supporting LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS interfaces for broad system compatibility.
- Non-volatile Instant-On & Reconfiguration: Single-chip non-volatile configuration enables instant-on behavior without external memory; supports background programming and in-field TransFR™ reconfiguration for updates while the system runs.
- Clocking: Up to two analog PLLs for clock multiply, divide and phase shifting to meet varied timing requirements.
- Power and Low-Power Modes: Core supply range 1.14 V to 1.26 V with device support for standard supply rails; includes a Sleep Mode capable of up to 100× static current reduction for reduced standby power.
- Package and Temperature: 324-ball LBGA package (324-FTBGA, 19×19 mm supplier package), RoHS compliant; commercial-grade operating temperature range 0 °C to 85 °C.
- System-Level Support: Single-chip configuration, JTAG programmability and support from the ispLEVER toolset for synthesis, place-and-route and timing verification.
Typical Applications
- Glue Logic and System Control: Implement combinational and sequential glue logic to interface discrete peripherals and coordinate board-level control functions.
- Bus Bridging and Interfacing: Bridge differing bus standards or implement protocol-adaptation logic using the high I/O count and broad I/O standard support.
- Power-Up and Reset Control: Implement robust power sequencing and reset control with instant-on capability and on-chip reconfiguration for field updates.
- Peripheral and I/O Management: Consolidate multiple interface translators, clock management blocks and simple FIFOs into a single-device solution.
Unique Advantages
- Single-Chip Non-Volatile Configuration: Eliminates the need for external configuration memory and delivers instant-on behavior to simplify system startup and improve security.
- High I/O-to-Logic Density: 271 I/Os paired with 2280 logic elements enable complex interfacing and control tasks without excessive device count or board area.
- In-Field Reconfiguration: TransFR™ reconfiguration and background programming allow logic updates while the system operates, reducing downtime during field upgrades.
- Low Standby Power Option: Sleep Mode provides significant static current reduction for power-sensitive commercial applications.
- Integrated Memory and Clocking: On-chip EBR and distributed RAM combined with up to two PLLs reduce the need for external memory and clock-management components.
- Commercial-Grade, RoHS-Compliant Package: 324-LBGA packaging and commercial temperature rating (0 °C to 85 °C) suit a broad range of consumer and industrial-adjacent electronics.
Why Choose LCMXO2280E-4FT324C?
The LCMXO2280E-4FT324C positions itself as a compact, single-chip solution for designers needing instant-on, high I/O capacity and reconfigurable logic. Its combination of 2280 LUT-based logic elements, embedded memory, PLLs and a wide array of supported I/O standards makes it a practical choice for board-level interfacing, control logic and protocol bridging in commercial products.
Coupled with ispLEVER design support and features such as background programming and TransFR reconfiguration, this device offers scalable deployment and simplified lifecycle maintenance for designs that require in-field updates and reliable, single-chip configuration.
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