LCMXO2280E-4FTN256C

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA

Quantity 1,157 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-4FTN256C – MachXO Field Programmable Gate Array (FPGA)

The LCMXO2280E-4FTN256C is a MachXO family FPGA device offering a non-volatile, instant-on architecture with on-chip reprogrammability. It combines look-up table based logic and embedded memory to address glue logic, bus bridging/interfacing, power‑up control and general control-logic applications.

Designed for commercial-grade systems, this part delivers 2,280 logic elements and up to 211 I/Os in a compact 256-ball BGA package, with on-chip RAM and system-level features that simplify board integration and in-field updates.

Key Features

  • Core Logic 2,280 logic elements (LUT-based) for implementing control, glue logic and interface functions.
  • On‑chip Memory Approximately 28 Kbits of total on-chip RAM to support small FIFOs, state machines and buffering.
  • I/O Density 211 available I/Os to support rich peripheral and bus interfacing in a single device.
  • Non‑Volatile, Instant‑On MachXO family features non-volatile configuration that powers up quickly with no external configuration memory required.
  • Reconfiguration and Background Programming Supports in-field reconfiguration and background programming of non-volatile memory through standard programming ports.
  • Flexible I/O Buffering Programmable I/O supports a wide range of interface standards including multiple LVCMOS levels, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
  • Analog Clocking Up to two analog PLLs per device for clock multiply/divide and phase shifting (family-level capability).
  • Low‑Power Modes Sleep mode support for significant static current reduction, enabling lower power consumption during standby.
  • Package & Mounting 256-ball BGA (256-LBGA / supplier package 256-FTBGA 17×17) with surface-mount mounting type.
  • Voltage & Temperature Core supply specified at 1.14 V to 1.26 V; operating temperature range 0 °C to 85 °C (commercial grade).
  • RoHS Compliance Device is RoHS compliant.

Typical Applications

  • Glue Logic and Board-Level Control Replace multi-gate ICs with a single reprogrammable device for simplified BOM and board routing.
  • Bus Bridging and Interfacing High I/O count and flexible I/O standards enable bridging between different bus types and signal levels.
  • Power‑Up and System Sequencing Non-volatile instant-on behavior supports deterministic power-up control and system initialization.
  • In-Field Logic Updates Background programming and field reconfiguration enable post-deployment updates to control and interface logic.

Unique Advantages

  • Single‑Chip, Non‑Volatile Solution: Eliminates the need for external configuration memory while enabling instant-on functionality.
  • High I/O-to-Logic Ratio: 211 I/Os combined with 2,280 logic elements supports dense interfacing and complex glue logic in one device.
  • Flexible Interface Support: Programmable sysIO buffer options accommodate multiple signaling standards for broad interoperability.
  • Power Management: Sleep mode provides substantial static current reduction for lower standby power.
  • On-Device Clocking: Analog PLLs provide integrated clock management without adding external components.
  • Commercial Temperature and RoHS Compliance: Suited for mainstream electronic products with common environmental compliance.

Why Choose LCMXO2280E-4FTN256C?

The LCMXO2280E-4FTN256C positions itself as a versatile, non-volatile FPGA for commercial embedded systems that require dense I/O, on-chip memory and fast, deterministic startup. Its combination of 2,280 logic elements, approximately 28 Kbits of on-chip RAM and 211 I/Os in a compact 256-ball BGA package makes it well suited for board-level control, interface bridging, and system sequencing tasks.

Designers benefit from MachXO family capabilities such as instant-on, background programming, flexible I/O standards and integrated PLLs, all supported by established design flows and toolchains referenced for the MachXO family. This delivers a scalable, reconfigurable building block for a wide range of commercial electronic designs.

Request a quote or submit an RFQ to get pricing and availability for the LCMXO2280E-4FTN256C.

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