LCMXO2280E-4FTN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA |
|---|---|
| Quantity | 1,157 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-4FTN256C – MachXO Field Programmable Gate Array (FPGA)
The LCMXO2280E-4FTN256C is a MachXO family FPGA device offering a non-volatile, instant-on architecture with on-chip reprogrammability. It combines look-up table based logic and embedded memory to address glue logic, bus bridging/interfacing, power‑up control and general control-logic applications.
Designed for commercial-grade systems, this part delivers 2,280 logic elements and up to 211 I/Os in a compact 256-ball BGA package, with on-chip RAM and system-level features that simplify board integration and in-field updates.
Key Features
- Core Logic 2,280 logic elements (LUT-based) for implementing control, glue logic and interface functions.
- On‑chip Memory Approximately 28 Kbits of total on-chip RAM to support small FIFOs, state machines and buffering.
- I/O Density 211 available I/Os to support rich peripheral and bus interfacing in a single device.
- Non‑Volatile, Instant‑On MachXO family features non-volatile configuration that powers up quickly with no external configuration memory required.
- Reconfiguration and Background Programming Supports in-field reconfiguration and background programming of non-volatile memory through standard programming ports.
- Flexible I/O Buffering Programmable I/O supports a wide range of interface standards including multiple LVCMOS levels, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
- Analog Clocking Up to two analog PLLs per device for clock multiply/divide and phase shifting (family-level capability).
- Low‑Power Modes Sleep mode support for significant static current reduction, enabling lower power consumption during standby.
- Package & Mounting 256-ball BGA (256-LBGA / supplier package 256-FTBGA 17×17) with surface-mount mounting type.
- Voltage & Temperature Core supply specified at 1.14 V to 1.26 V; operating temperature range 0 °C to 85 °C (commercial grade).
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- Glue Logic and Board-Level Control Replace multi-gate ICs with a single reprogrammable device for simplified BOM and board routing.
- Bus Bridging and Interfacing High I/O count and flexible I/O standards enable bridging between different bus types and signal levels.
- Power‑Up and System Sequencing Non-volatile instant-on behavior supports deterministic power-up control and system initialization.
- In-Field Logic Updates Background programming and field reconfiguration enable post-deployment updates to control and interface logic.
Unique Advantages
- Single‑Chip, Non‑Volatile Solution: Eliminates the need for external configuration memory while enabling instant-on functionality.
- High I/O-to-Logic Ratio: 211 I/Os combined with 2,280 logic elements supports dense interfacing and complex glue logic in one device.
- Flexible Interface Support: Programmable sysIO buffer options accommodate multiple signaling standards for broad interoperability.
- Power Management: Sleep mode provides substantial static current reduction for lower standby power.
- On-Device Clocking: Analog PLLs provide integrated clock management without adding external components.
- Commercial Temperature and RoHS Compliance: Suited for mainstream electronic products with common environmental compliance.
Why Choose LCMXO2280E-4FTN256C?
The LCMXO2280E-4FTN256C positions itself as a versatile, non-volatile FPGA for commercial embedded systems that require dense I/O, on-chip memory and fast, deterministic startup. Its combination of 2,280 logic elements, approximately 28 Kbits of on-chip RAM and 211 I/Os in a compact 256-ball BGA package makes it well suited for board-level control, interface bridging, and system sequencing tasks.
Designers benefit from MachXO family capabilities such as instant-on, background programming, flexible I/O standards and integrated PLLs, all supported by established design flows and toolchains referenced for the MachXO family. This delivers a scalable, reconfigurable building block for a wide range of commercial electronic designs.
Request a quote or submit an RFQ to get pricing and availability for the LCMXO2280E-4FTN256C.

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